JP2006526683A - 銅箔積層板用エポキシ樹脂組成物 - Google Patents
銅箔積層板用エポキシ樹脂組成物 Download PDFInfo
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- JP2006526683A JP2006526683A JP2006508554A JP2006508554A JP2006526683A JP 2006526683 A JP2006526683 A JP 2006526683A JP 2006508554 A JP2006508554 A JP 2006508554A JP 2006508554 A JP2006508554 A JP 2006508554A JP 2006526683 A JP2006526683 A JP 2006526683A
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- epoxy resin
- copper foil
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000011889 copper foil Substances 0.000 title claims abstract description 44
- 239000000203 mixture Substances 0.000 title claims abstract description 42
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 40
- 239000004593 Epoxy Substances 0.000 claims abstract description 32
- 239000012802 nanoclay Substances 0.000 claims abstract description 30
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000126 substance Substances 0.000 claims abstract description 28
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 18
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- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 7
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 7
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- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 235000015278 beef Nutrition 0.000 claims description 4
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- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical group CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical group O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 3
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
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- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
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- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
本発明のエポキシ樹脂組成物は、層状シリケート層の中間層に有機物質がインターカレートされている有機及び無機構造を有するナノクレーを含む。本発明のエポキシ樹脂組成物は、優れた耐熱性、高いガラス転移温度(Tg)、優れた難燃性、及び優れた機械的物性を示すため、印刷回路基板用銅箔積層板の製造に有用に使用することができる。
Description
本発明のエポキシ樹脂組成物はナノクレーを充填剤として含み、低い吸湿性及び優れた耐熱性、高温特性、耐電食性を満足しながら、高いガラス転移温度(Tg)を有する特徴がある。
したがって、本発明では全ての物性をバランスよく向上させるために、エポキシ樹脂組成物中のビスフェノールA型ノボラックエポキシ樹脂として平均エポキシ当量が100〜500の範囲であるものを使用し、これはメチルセロソルブ(MCS)、メチルエチルケトン(MEK)などの溶媒に溶解して使用する。前記ビスフェノールA型ノボラックエポキシ樹脂の量は全エポキシ樹脂100重量部に対して20乃至120重量部使用することが好ましい。前記ビスフェノールA型ノボラックエポキシ樹脂の量が20重量部未満であれば、ガラス転移温度が低下する問題があり、120重量部を超えれば未反応エポキシ樹脂のために耐熱性が低下する問題がある。
上記充填剤はプラスチックに配合して製品の品質や加工性を改善する材料として使用される。プラスチックの加工性、機械的特性、電気的特性、および熱的性質に対する、プラスチックへの充填剤の添加効果は、粒子形状、例えば、繊維状、板状、あるいは球状、に応じて非常に変わる。充填剤を使用する主な目的は、熱膨張率の減少、硬化収縮率の低下、耐摩耗性の向上、難燃性の向上を含めて、機械的特性の向上のためである。無機質充填剤としてはシリカ、タルク、炭酸カルシウムなどが主に使用され、金属質充填剤としてはアルミニウム、酸化アルミニウムなどが広く使用される。また、有機物及び無機質の充填剤としてはナノクレーがある。
本発明で使用されるエポキシ樹脂は表1の化合物を使用し、フェノール系硬化剤は表2の化合物を使用した。
平均エポキシ当量が100乃至500であるビスフェノールA型エポキシ樹脂(DIC、N-865)70g、3官能以上の多官能エポキシ樹脂(Bakelite社、LER-673)30g、ビスフェノールA型ノボラックフェノール系硬化剤(江南化学社、VH-4290)35g、臭素化されたフェノール系硬化剤(Tosoh、TBBPA)40g、イミダゾール化合物を含有する硬化促進剤0.5g、添加剤である酸化防止剤1g及びUV安定剤1g、ナノクレーとしてCloisite 20A(Southern Clay Products)4gを非揮発性物質が64%になるまでメチルセロソルブ(MCS)で溶解してワニスを製造した。
上記実施例1でCloisite 20A(Southern Clay Products)の代りに、Cloisite 30B(Southern Clay Products)4gを使用したことを除いては、実施例1と同様の方法で非揮発性物質が64%であるワニスを製造した。
上記実施例1でCloisite 20A(Southern Clay Products)の代りに、Na-MMT(Southern Clay Products)4gを使用したことを除いては、実施例1と同様の方法で非揮発性物質が64%であるワニスを製造した。
上記実施例1でCloisite 20A(Southern Clay Products)の代りに、Cloisite 93A(Southern Clay Products)4gを使用したことを除いては、実施例1と同様の方法で非揮発性物質が64%であるワニスを製造した。
ナノクレーを使用しないことを除いては、上記実施例1と同様の方法でワニスを製造した。
(プリプレグの製造)
上記実施例1乃至2、及び比較例1乃至3で使用したワニスの主要成分及びその含量は下記表3に示す。表3で記載された量の単位はg(グラム)である。
(銅箔積層板の製造)
上記実施例3で得たプリプレグ6枚を互いに重ねて、厚さ36μmの銅箔を夫々複合体両面に重ねて積層し、190℃で150分間20kgf/cm2の圧力で加圧して銅箔積層板を形成した。このように得られた銅箔積層板をエッチングなどの過程を経てTg、耐半田性、5%重量損失、耐熱性テストを実施し、その結果を表4に示した。物性測定は下記のような方法を使用した。
1)ガラス転移温度(Tg):TA社のDSC(Q100)を使用して測定し、10℃/minの速度で温度を上げて測定した。
2)5%重量損失:TA社のTGA(Q500)を使用して測定し、10℃/minの速度で温度を上げて測定した。
3)耐半田性:製造された銅箔積層板を横5cm×縦5cm大きさに切断した。この試験片を288℃で浮遊させて、銅箔または層間で層間剥離する時間を測定した。
4)耐熱性:エッチングした銅箔積層板を横5cm×縦5cm大きさに切断した。この試験片を、121℃、2気圧で2時間加圧した後、288℃の半田付け槽に10秒間浸漬して積層板の外形を肉眼で観察した。外形におけるミーズリング、層間剥離などの程度で判断した。
(×:非常に悪い、△:悪い、○:普通、◎:良い、◎◎:非常に良い)
上記で耐半田性、耐熱性などの特性に優れたナノクレーであるCloisite 30Bを使用して、ワニスを製造した。
上記実施例2と同様の方法と含量で実施したが、Cloisite 30Bの量を2gに減量してMCS溶媒に非揮発性物質が64%であるワニスを製造した。
上記実施例2と同様の方法と含量で実施したが、Cloisite 30Bの量を3gに減量してMCS溶媒に非揮発性物質が64%であるワニスを製造した。
上記実施例2と同様の方法と含量で実施したが、Cloisite 30Bの量を5gに増量してMCS溶媒に非揮発性物質が64%であるワニスを製造した。
Tgを向上させるために臭素含量を下げながら(TBBPAの量を減少し、VH-4290の量を増加する)試験をした。また、前記で耐半田性、耐熱性などの特性に優れたナノクレーであるCloisite 30Bを使用してワニスを製造した。
平均エポキシ当量が100〜500であるビスフェノールA型エポキシ樹脂(DIC、N-865)70g、3官能以上の多官能性エポキシ樹脂(Bakelite社、LER-673)30g、ビスフェノールA型ノボラックフェノール系硬化剤(江南化学VH-4290)40g、臭素化されたフェノール系硬化剤(Tosoh、TBBPA)35g、イミダゾール化合物を含有する硬化促進剤0.5g、酸化防止剤及びUV安定剤各々1g、Cloisite 30B(Southern Clay Products)3gをMCS溶媒に非揮発性物質が64%になるまで溶解してワニスを製造した。
平均エポキシ当量が100〜400であるビスフェノールA型エポキシ樹脂(DIC、N-865)70g、3官能以上の多官能性エポキシ樹脂(Bakelite社、LER-673)30g、ビスフェノールA型ノボラックフェノール系硬化剤(江南化学VH-4290)45g、臭素化されたフェノール系硬化剤(Tosoh、TBBPA)30g、イミダゾール化合物を含有する硬化促進剤0.5g、酸化防止剤及びUV安定剤各々1g、Cloisite 30B(Southern clay products、ナノクレー)3gをMCS溶媒に非揮発性物質が64%になるまで溶解してワニスを製造した。
Claims (9)
- a)平均エポキシ当量が100〜500であるビスフェノールA型ノボラックエポキシ樹脂、及び平均エポキシ当量が100〜500である3官能以上の多官能性エポキシ樹脂と;
b)イミダゾール化合物を含有する硬化促進剤と;
c)充填剤としてナノクレーと;
d)臭素が重量で40〜70%含まれている臭素化されたフェノール系硬化剤と;
e)ビスフェノールA型ノボラックフェノール系硬化剤、
を含む銅箔積層板用エポキシ樹脂組成物。 - 前記組成物が、
ビスフェノールA型ノボラックエポキシ樹脂20乃至120重量部、及び3官能以上の多官能性エポキシ樹脂10乃至80重量部を含むエポキシ樹脂100重量部と;
前記エポキシ樹脂100重量部当たり、硬化促進剤を0.001乃至4重量部及び充填剤を0.1乃至20重量部含み、
前記フェノール系硬化剤をエポキシ当量に対して0.1乃至0.7の当量比、及びビスフェノールA型ノボラックフェノール系硬化剤をエポキシ当量に対して0.3乃至1.0の当量比で含む、請求項1に記載の銅箔積層板用エポキシ樹脂組成物。 - 前記ナノクレーが、層状シリケートの間に有機物が挿入(インターカレート)されている有機物及び無機物構造を有する、請求項1に記載の銅箔積層板用エポキシ樹脂組成物。
- 前記硬化促進剤が、2-エチル-4-メチルイミダゾール、1-(2-シアノエチル)-2-アルキルイミダゾール、2-フェニルイミダゾール、及びイソシアネート-マスキングされたイミダゾール系化合物からなる群より1種以上選択されるものである、請求項1に記載の銅箔積層板用エポキシ樹脂組成物。
- 前記組成物がエポキシ樹脂100重量部当り0.01乃至7重量部の添加剤をさらに含む、請求項1に記載の銅箔積層板用エポキシ樹脂組成物。
- 請求項1乃至6のいずれか一項のエポキシ樹脂組成物をガラス繊維に含浸して得たプリプレグ。
- 請求項7に記載のプリプレグが少なくとも1種以上積層され、前記プリプレグの一面または両面に積層された少なくとも一枚の銅箔を含む、印刷回路基板用銅箔積層板。
- 前記プリプレグと前記銅箔が加熱及び加圧によって一体化されたものである、請求項8に記載の印刷回路基板用銅箔積層板。
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JP2010024437A (ja) * | 2008-07-16 | 2010-02-04 | Samsung Electro Mechanics Co Ltd | プリプレグ、プリプレグの製造方法、及びこれを用いた回路基板 |
WO2010024642A3 (en) * | 2008-09-01 | 2010-06-24 | Kolon Industries, Inc. | Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition |
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GB0512610D0 (en) | 2005-06-18 | 2005-07-27 | Hexcel Composites Ltd | Composite material |
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KR100730982B1 (ko) * | 2006-03-16 | 2007-06-22 | 도레이새한 주식회사 | 동박적층판용 나노복합체 접착제 조성물 |
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WO2010024642A3 (en) * | 2008-09-01 | 2010-06-24 | Kolon Industries, Inc. | Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition |
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