TW200617100A - Epoxy resin composition for copper clad laminate - Google Patents
Epoxy resin composition for copper clad laminateInfo
- Publication number
- TW200617100A TW200617100A TW094115314A TW94115314A TW200617100A TW 200617100 A TW200617100 A TW 200617100A TW 094115314 A TW094115314 A TW 094115314A TW 94115314 A TW94115314 A TW 94115314A TW 200617100 A TW200617100 A TW 200617100A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- copper clad
- resin composition
- composition
- clad laminate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040032927A KR100601091B1 (ko) | 2004-05-11 | 2004-05-11 | 동박적층판용 에폭시 수지 조성물 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200617100A true TW200617100A (en) | 2006-06-01 |
Family
ID=35320209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094115314A TW200617100A (en) | 2004-05-11 | 2005-05-11 | Epoxy resin composition for copper clad laminate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4477627B2 (zh) |
KR (1) | KR100601091B1 (zh) |
TW (1) | TW200617100A (zh) |
WO (1) | WO2005108488A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449681B (zh) * | 2010-09-06 | 2014-08-21 | Taiwan Union Technology Corp | 環氧樹脂掺合物 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0512610D0 (en) | 2005-06-18 | 2005-07-27 | Hexcel Composites Ltd | Composite material |
CN101341181B (zh) * | 2005-12-22 | 2013-09-04 | 陶氏环球技术有限责任公司 | 可固化环氧树脂组合物及由其制造的层压材料 |
KR100730982B1 (ko) * | 2006-03-16 | 2007-06-22 | 도레이새한 주식회사 | 동박적층판용 나노복합체 접착제 조성물 |
WO2008045270A1 (en) * | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
KR100845092B1 (ko) * | 2006-12-01 | 2008-07-09 | 주식회사 엘지화학 | 접착수지 조성물, 접착필름, 다이싱 다이본딩 필름 및반도체 장치 |
KR100836175B1 (ko) * | 2006-12-13 | 2008-06-09 | 도레이새한 주식회사 | 동박적층판용 비할로겐계 나노복합체 접착제 조성물 |
KR100823998B1 (ko) * | 2007-05-28 | 2008-04-23 | 전자부품연구원 | 동박적층판, 인쇄회로기판 및 동박적층판의 제조방법 |
ES2320305B1 (es) * | 2007-06-05 | 2010-03-08 | Antonio Miravete De Marco | Metodo de pre-impregnado de nano-refuerzos y producto asi obtenido. |
KR100918914B1 (ko) * | 2007-10-04 | 2009-09-23 | 도레이새한 주식회사 | 비할로겐계 커버레이필름용 나노복합체 접착제 조성물 |
KR100979541B1 (ko) * | 2008-07-16 | 2010-09-02 | 삼성전기주식회사 | 프리프레그, 프리프레그 제조방법 및 이를 이용한동박적층판 |
KR100995678B1 (ko) * | 2008-09-01 | 2010-11-22 | 주식회사 코오롱 | 페놀 노볼락 수지, 페놀 노볼락 에폭시 수지 및 에폭시 수지 조성물 |
KR101114318B1 (ko) * | 2009-04-16 | 2012-03-14 | 삼성전기주식회사 | 박리 강도가 강화된 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조 방법 |
CN101864146B (zh) * | 2010-06-13 | 2012-02-15 | 宏昌电子材料股份有限公司 | 印刷电路覆铜板用环氧树脂组合物 |
KR20160081073A (ko) | 2014-12-30 | 2016-07-08 | 도레이첨단소재 주식회사 | 비할로겐계 접착제 조성물을 이용한 동박 부착 접착시트 및 그 제조방법 |
KR20190097622A (ko) | 2018-02-12 | 2019-08-21 | 옥광호 | 친환경 층간소음 방지구조 |
CN109677058B (zh) * | 2018-12-24 | 2021-02-26 | 龙宇电子(梅州)有限公司 | 一种无铅tg140覆铜板的制作方法 |
KR102152327B1 (ko) | 2020-02-21 | 2020-09-07 | 옥광호 | 친환경 바닥재를 이용한 층간소음 방지구조 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63162775A (ja) * | 1986-12-26 | 1988-07-06 | Somar Corp | 無電解メツキ用レジストインキ |
CA1338252C (en) * | 1989-07-05 | 1996-04-16 | Osamu Ogitani | Resist ink composition |
KR970010865A (ko) * | 1995-08-29 | 1997-03-27 | 이웅열 | 다층회로기판용 동박적층판용 수지 조성물 |
JP2001139659A (ja) | 1999-11-15 | 2001-05-22 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
KR100447547B1 (ko) | 2001-12-28 | 2004-09-04 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
KR100491754B1 (ko) | 2002-09-11 | 2005-05-27 | 주식회사 엘지화학 | 빌드업 인쇄 회로 기판 기재용 동박 부착 수지 조성물 |
-
2004
- 2004-05-11 KR KR1020040032927A patent/KR100601091B1/ko active IP Right Grant
-
2005
- 2005-05-10 JP JP2006508554A patent/JP4477627B2/ja active Active
- 2005-05-10 WO PCT/KR2005/001358 patent/WO2005108488A1/en active Application Filing
- 2005-05-11 TW TW094115314A patent/TW200617100A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449681B (zh) * | 2010-09-06 | 2014-08-21 | Taiwan Union Technology Corp | 環氧樹脂掺合物 |
Also Published As
Publication number | Publication date |
---|---|
KR20050107999A (ko) | 2005-11-16 |
JP4477627B2 (ja) | 2010-06-09 |
WO2005108488A1 (en) | 2005-11-17 |
KR100601091B1 (ko) | 2006-07-14 |
JP2006526683A (ja) | 2006-11-24 |
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