JP2006275579A - Test substrate and test device - Google Patents

Test substrate and test device Download PDF

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JP2006275579A
JP2006275579A JP2005091331A JP2005091331A JP2006275579A JP 2006275579 A JP2006275579 A JP 2006275579A JP 2005091331 A JP2005091331 A JP 2005091331A JP 2005091331 A JP2005091331 A JP 2005091331A JP 2006275579 A JP2006275579 A JP 2006275579A
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inspection
terminal
substrate
inspection terminal
probe pin
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Hitoshi Tega
仁 手賀
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Kyocera Corp
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Kyocera Corp
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<P>PROBLEM TO BE SOLVED: To provide a test substrate with high density superior in electric insulation performance, for measuring and testing electric connection of electronic parts such as a semiconductor element, and electric characteristics at once. <P>SOLUTION: The test substrate is formed of: a terminal 2a for testing formed on the upper surface of an insulation substrate 1; and an external connection terminal 2b electrically connected with the terminal 2a for testing formed on the lower surface of an insulation substrate 1. On the upper surface of the insulation substrate 1, an insulating frame 7 surrounding the circumference of the terminal for testing 2a and having the narrowest part 6 whose inner dimension is the minimum on the side upper than the upper surface of the terminal 2a for testing, is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、半導体素子等の電子部品の電気的特性を一括して測定検査するための検査基板および検査装置に関するものである。   The present invention relates to an inspection substrate and an inspection apparatus for collectively measuring and inspecting electrical characteristics of electronic components such as semiconductor elements.

従来、半導体素子を搭載した半導体装置は、半導体素子とリードフレームとがワイヤーボンディングによって電気的に接続され、その後、樹脂封止またはセラミック容器内に収納封止された状態で供給され、外部のプリント基板等に実装されていた。近年、半導体装置の小型化の要求から、フリップチップと呼ばれる半導体素子をそのままセラミック基板やプリント基板に実装する構成が主流になりつつある。   Conventionally, a semiconductor device mounted with a semiconductor element is supplied with the semiconductor element and the lead frame electrically connected by wire bonding, and then housed and sealed in a resin sealed or ceramic container, and is externally printed. It was mounted on the board. In recent years, a configuration in which a semiconductor element called a flip chip is directly mounted on a ceramic substrate or a printed board is becoming mainstream due to a demand for downsizing of a semiconductor device.

ところで、半導体ウェハ上に多数個同時に形成され、大規模集積回路を有する半導体素子は、半導体ウェハ上で作製される初期段階から、異物の付着などに起因する不良品が含まれる。これらを半導体ウェハのまま同時に多数の半導体素子を一括して電気検査を行うことができるものとしてプローブカードがあり、従来の配線基板を用いたプローブカードを図３に示す。図３において、１１は絶縁基板、１２ａは検査用端子、１２ｂは外部接続端子、１３はビア導体、１４はヘッド部、１９はプローブピン、Ａ’は半導体素子等の被検査対象の端子を示す。   By the way, a large number of semiconductor elements formed simultaneously on a semiconductor wafer and having a large-scale integrated circuit include defective products due to adhesion of foreign matters from the initial stage of manufacturing on the semiconductor wafer. There is a probe card that can perform electrical inspection of a large number of semiconductor elements at the same time as a semiconductor wafer, and FIG. 3 shows a probe card using a conventional wiring board. In FIG. 3, 11 is an insulating substrate, 12a is an inspection terminal, 12b is an external connection terminal, 13 is a via conductor, 14 is a head portion, 19 is a probe pin, and A 'is a terminal to be inspected such as a semiconductor element. .

このプローブカードは、絶縁基板１１の上面に形成した検査用端子１２ａとヘッド部１４に支持されたプローブピン１９とが接触し、検査用端子１２ａと絶縁基板１１の下面に形成した外部接続端子１２ｂとはビア導体１３を介して電気的に接続されている。
特開平１１−１６０３５６号公報 In this probe card, the inspection terminal 12 a formed on the upper surface of the insulating substrate 11 and the probe pin 19 supported by the head portion 14 come into contact with each other, and the external connection terminal 12 b formed on the lower surface of the inspection terminal 12 a and the insulating substrate 11. Are electrically connected via a via conductor 13.
Japanese Patent Laid-Open No. 11-160356

ところで、近年、半導体ウェハの大型化が進み、これに伴い、半導体ウェハに同時に形成された多数の半導体素子を一括して精度良く電気測定検査するプローブカード用多層配線基板においても高密度化が要求されている。半導体ウェハ上に端子が高密度に形成されるにつれ、検査用端子も、プローブカードとして用いる多層配線基板の表面に高密度で多数個形成する必要があり、検査用端子の寸法および、検査用端子間の間隔が狭くなってきている。   By the way, in recent years, semiconductor wafers have become larger, and with this trend, higher density is also required for multilayer wiring boards for probe cards that perform electrical measurement and inspection of a large number of semiconductor elements simultaneously formed on a semiconductor wafer with high accuracy. Has been. As the terminals are formed on the semiconductor wafer with high density, it is necessary to form a large number of inspection terminals on the surface of the multilayer wiring board used as the probe card. The dimensions of the inspection terminals and the inspection terminals The interval between them is getting narrower.

しかしながら、検査用端子と接触するプローブピンは、一般的に、先端の形状が円筒形または半球形であり、材質は硬質な金属が用いられるため、電気検査測定時に検査用端子にプローブピンを接触させると、プローブピンが横滑りして検査用端子からはずれ、接続を適切に保持できないという問題があった。   However, probe pins that come into contact with the inspection terminals are generally cylindrical or hemispherical at the tip and are made of hard metal, so the probe pins are in contact with the inspection terminals during electrical inspection measurement. Then, there is a problem that the probe pin slips sideways and is disconnected from the inspection terminal, so that the connection cannot be properly maintained.

またさらに、上記のように検査用端子間の間隔が狭い場合には、隣接する検査用端子と横滑りしたプローブピンとが接触し、電気検査を正確に行うことができないという問題もあった。   Further, when the interval between the inspection terminals is narrow as described above, there is a problem in that the adjacent inspection terminal and the probe pin that slips contact each other, and the electrical inspection cannot be performed accurately.

また、プローブピンによって検査用端子上面の金属が削られて、その金属屑によって隣接する検査用端子同士が電気的に短絡し、正確な電気測定検査ができないという問題もあった。   Further, the metal on the upper surface of the inspection terminal is scraped by the probe pin, and the adjacent inspection terminals are electrically short-circuited by the metal scrap, and there is a problem that accurate electrical measurement inspection cannot be performed.

この問題を解決する方法として、例えば検査用端子の寸法を大きくして、検査用端子とプローブピンとの位置ずれが生じても電気的接続を確保する方法等が考えられる。しかしながら、近年の半導体素子の高密度実装化にともなって検査用端子間の距離は短いものが、端子の大きさは小さいものが求められており、検査用端子の寸法を大きく形成すると、高密度に多数の検査用端子を配した検査基板を提供することができないという問題が生じる。   As a method of solving this problem, for example, a method of enlarging the size of the inspection terminal and securing an electrical connection even if a positional deviation between the inspection terminal and the probe pin occurs can be considered. However, with recent high-density mounting of semiconductor elements, the distance between inspection terminals is short, but the size of the terminals is required to be small. There is a problem that it is impossible to provide an inspection board having a large number of inspection terminals.

よって、本発明の検査基板は上記問題点に鑑みて完成されたものであり、その目的は、半導体素子などの電子部品の電気的接続および電気的特性を一括して精度よく測定検査するための高密度な検査基板を提供することにある。   Therefore, the inspection board of the present invention has been completed in view of the above problems, and its purpose is to accurately measure and inspect the electrical connection and electrical characteristics of electronic components such as semiconductor elements collectively. The object is to provide a high-density inspection substrate.

本発明のプローブカード用多層配線基板は、絶縁基板の上面に検査用端子を形成するとともに前記絶縁基板の下面に前記検査用端子と電気的に接続された外部接続端子を形成してなる検査基板において、前記絶縁基板の上面に、前記検査用端子の周囲を取り囲むとともに、前記検査用端子の上面よりも上側で内寸が最小となる最狭部を有する絶縁性の枠部を形成したことを特徴とする。   The multilayer wiring board for a probe card according to the present invention has an inspection board formed with an inspection terminal on the upper surface of the insulating substrate and an external connection terminal electrically connected to the inspection terminal on the lower surface of the insulating substrate. And forming an insulating frame portion on the upper surface of the insulating substrate, which surrounds the periphery of the inspection terminal and has a narrowest portion whose inner dimension is minimum above the upper surface of the inspection terminal. Features.

本発明のプローブカード用多層配線基板は、最狭部を、平面視で検査用端子と重なるように形成したことを特徴とする。   The multilayer wiring board for probe cards of the present invention is characterized in that the narrowest portion is formed so as to overlap with the inspection terminal in a plan view.

本発明の検査装置は、上記本発明の検査基板と、被検査対象と前記検査用端子とを電気的に接続するプローブピンと、前記被検査対象の電気的特性を検査する、前記外部接続端子と電気的に接続されるテスタとを有することを特徴とする。   The inspection apparatus according to the present invention includes the inspection substrate according to the present invention, a probe pin that electrically connects the inspection target and the inspection terminal, and the external connection terminal that inspects the electrical characteristics of the inspection target. And a tester which is electrically connected.

本発明の検査基板は、絶縁基板の上面に、検査用端子の周囲を取り囲むとともに、検査用端子の上面よりも上側で内寸が最小となる最狭部を有する絶縁性の枠部を形成したことにより、検査用端子が絶縁性の枠部で周囲を囲まれるため、プローブピンと検査用端子との接続を適切に維持することができる。つまり、従来ではプローブピンが横滑りを起こし、検査用端子とプローブピンとの接続を維持できなかったり、隣接する検査用端子と横滑りしたプローブピンとが接触したりして、電気検査を正確に行うことができないという不具合が生じていたが、本発明の構成では、検査用端子の周囲を絶縁性の枠部が取り囲むことで、プローブピンが横滑りを起こし難く、検査用端子との接続を適切に保持できる。その結果、検査用端子間の距離を近づけることができるとともに、検査用端子の大きさも小さく形成することができ、さらに、電気検査を正確に行うことが可能な高密度に多数の検査用端子を形成した検査基板を提供することができる。   In the inspection substrate of the present invention, an insulating frame portion is formed on the upper surface of the insulating substrate so as to surround the periphery of the inspection terminal and have the narrowest portion having the smallest inner dimension above the upper surface of the inspection terminal. Accordingly, since the inspection terminal is surrounded by the insulating frame portion, the connection between the probe pin and the inspection terminal can be appropriately maintained. In other words, in the past, the probe pin caused a skid, and the connection between the test terminal and the probe pin could not be maintained, or the adjacent test terminal and the skid probe pin contacted each other, so that the electrical test could be performed accurately. However, in the configuration of the present invention, since the insulating frame portion surrounds the periphery of the inspection terminal, the probe pin hardly slides, and the connection with the inspection terminal can be appropriately maintained. . As a result, the distance between the inspection terminals can be reduced, the size of the inspection terminals can be reduced, and a large number of inspection terminals can be formed at a high density capable of performing an electrical inspection accurately. A formed inspection substrate can be provided.

また、絶縁性の枠部が検査用端子の上面よりも上側で、内寸が最小となる最狭部を有することにより、仮にプローブピンが横滑りして検査用端子が削れ、金属屑が発生しても、絶縁性の枠部の内側に金属屑をためることができるので、金属屑によって隣接する検査用端子同士が電気的に短絡することを有効に抑制でき、正確な電気測定検査が行える。   In addition, since the insulating frame is above the upper surface of the inspection terminal and has the narrowest part with the smallest inner dimension, the probe pin slides sideways, the inspection terminal is scraped, and metal scrap is generated. However, since metal scraps can be accumulated inside the insulating frame, it is possible to effectively suppress electrical short-circuiting between adjacent inspection terminals due to the metal scraps, and accurate electrical measurement inspection can be performed.

また、検査用端子の上面よりも上側で、絶縁性の枠部の内寸が最小となるため、絶縁性の枠部の内側で、プローブピンと検査用端子との接続時の衝撃を和らげることができる。つまり、絶縁性の枠部の内側の、検査用端子上面に平行な断面の面積が、最狭部から検査用端子に向かうに伴って大きくなるため、プローブピンが適度に動くスペースを確保でき、接続時の衝撃が一箇所に集中せず、検査用端子の磨耗を和らげることができる。   In addition, since the inner dimension of the insulating frame is minimized above the upper surface of the inspection terminal, the impact at the time of connection between the probe pin and the inspection terminal can be reduced inside the insulating frame. it can. In other words, since the area of the cross section parallel to the upper surface of the inspection terminal inside the insulating frame portion increases as it goes from the narrowest portion to the inspection terminal, it is possible to secure a space for the probe pin to move appropriately, The impact at the time of connection is not concentrated in one place, and the wear of the inspection terminal can be eased.

このように本発明の構成では、プローブピンの横ずれを有効に抑制して検査用端子同士の短絡を有効に抑制できるとともに、検査用端子の磨耗を防いだ耐久性のある検査基板とすることができる。さらに検査用端子間の距離を近づけて、端子の大きさも小さく形成することができる。よって、半導体素子を一括して精度良く電気測定検査できる、高密度に多数の検査用端子が配置された検査基板を提供することができる。   Thus, in the configuration of the present invention, the lateral displacement of the probe pins can be effectively suppressed to effectively suppress a short circuit between the inspection terminals, and a durable inspection substrate that prevents the inspection terminals from being worn can be obtained. it can. Further, the distance between the inspection terminals can be reduced, and the size of the terminals can be reduced. Therefore, it is possible to provide an inspection substrate on which a large number of inspection terminals are arranged at a high density, which can accurately and electrically measure and inspect semiconductor elements.

本発明の検査基板は、最狭部を、平面視で前記検査用端子と重なるように形成したことにより、検査用端子の中央付近にプローブピンを接触させることができるため、より確実にプローブピンと検査用端子とを接触させることができ、電気測定の信頼性を向上させることができる。   Since the inspection board of the present invention is formed so that the narrowest portion overlaps the inspection terminal in plan view, the probe pin can be brought into contact with the vicinity of the center of the inspection terminal, so that the probe pin The inspection terminal can be brought into contact, and the reliability of electrical measurement can be improved.

本発明の検査装置は、上記本発明の検査基板と、被検査対象と検査用端子とを電気的に接続するプローブピンと、被検査対象の電気的特性を検査する、外部接続端子と電気的に接続されるテスタとを有することにより、電子部品の電気的接続および電気的特性を一括して精度よく測定検査できる検査装置とすることができる。   The inspection apparatus of the present invention is electrically connected to the inspection board of the present invention, a probe pin that electrically connects the object to be inspected and the inspection terminal, and an external connection terminal that inspects the electrical characteristics of the object to be inspected. By having a tester to be connected, it is possible to provide an inspection apparatus capable of accurately measuring and inspecting electrical connection and electrical characteristics of electronic components collectively.

次に本発明の検査基板について以下に詳細に説明する。図１は、本発明の検査基板について実施の形態の一例を示す断面図である。図１において、１は絶縁基板、２ａは検査用端子、２ｂは外部接続端子、３はビア導体、４はヘッド部、６は最狭部、７は絶縁性の枠部、８は接着材、９はプローブピン、Ａは被検査対象の端子である。   Next, the inspection substrate of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the inspection board of the present invention. In FIG. 1, 1 is an insulating substrate, 2a is an inspection terminal, 2b is an external connection terminal, 3 is a via conductor, 4 is a head portion, 6 is a narrowest portion, 7 is an insulating frame portion, 8 is an adhesive, 9 is a probe pin, and A is a terminal to be inspected.

本発明の検査基板は、絶縁基板１の上面に検査用端子２ａを形成するとともに絶縁基板１の下面に検査用端子２ａと電気的に接続された外部接続端子２ｂを形成しており、絶縁基板１の上面に、検査用端子２ａの周囲を取り囲むとともに、検査用端子２ａの上面よりも上側で内寸が最小となる最狭部６を有する絶縁性の枠部７を形成している。   The inspection board of the present invention has an inspection terminal 2 a formed on the upper surface of the insulating substrate 1 and an external connection terminal 2 b electrically connected to the inspection terminal 2 a on the lower surface of the insulating substrate 1. An insulating frame portion 7 is formed on the upper surface of 1 so as to surround the periphery of the inspection terminal 2a and to have the narrowest portion 6 having the smallest inner dimension above the upper surface of the inspection terminal 2a.

本発明の絶縁基板１は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス）、窒化アルミニウム質焼結体、ガラスセラミックス等のセラミックスや、四ふっ化エチレン樹脂（ポリテトラフルオロエチレン；ＰＴＦＥ）、四ふっ化エチレン・エチレン共重合樹脂（テトラフルオロエチレン−エチレン共重合樹脂；ＥＴＦＥ）、四ふっ化エチレン・パーフルオロアルコキシエチレン共重合樹脂（テトラフルオロエチレン−パーフルオロアルキルビニルエーテル共重合樹脂；ＰＦＡ）等のフッ素樹脂や、ガラスエポキシ樹脂、ポリイミド樹脂等の樹脂からなる。   The insulating substrate 1 of the present invention includes, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a ceramic such as glass ceramics, an ethylene tetrafluoride resin (polytetrafluoroethylene; PTFE), four Fluorinated ethylene / ethylene copolymer resin (tetrafluoroethylene-ethylene copolymer resin; ETFE), tetrafluoroethylene / perfluoroalkoxyethylene copolymer resin (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin; PFA), etc. It consists of resin, such as a fluororesin, a glass epoxy resin, and a polyimide resin.

次に、絶縁基板１の製造方法を示す。例えば、絶縁基板１がアルミナセラミックスから成る場合、先ずアルミナ（Ａｌ２Ｏ３）やシリカ（ＳiＯ２）、カルシア（ＣａＯ）、マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤、溶媒を添加混合して泥漿状と成し、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してセラミックグリーンシート（以下、グリーンシートともいう）を得る。その後、グリーンシートに、タングステン（Ｗ）を主成分とする印刷ペーストをスクリーン印刷等によって塗布する。さらに、グリーンシートの上下面間の電気的導通をとるために穿設した貫通孔に、加圧注入等で前述の印刷ペーストの埋め込み等を行い、グリーンシートを所定形状に打ち抜き加工するとともに必要に応じて複数枚積層し、これを約１５００℃の温度で焼成することにより絶縁基板１とすることができる。ここで、検査用端子２ａや外部接続端子２ｂを安定に形成するために、絶縁基板１の表面をアルミナ等の砥粒を用いて研磨し、算術平均粗さ（Ｒａ）を０.１μm以下程度としてもよい。 Next, a method for manufacturing the insulating substrate 1 will be described. For example, when the insulating substrate 1 is made of alumina ceramic, first, an appropriate organic solvent and solvent are added and mixed to the raw material powder such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), and magnesia (MgO). Thus, a slurry is formed, and this is formed into a sheet by a conventionally known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, a printing paste containing tungsten (W) as a main component is applied to the green sheet by screen printing or the like. Furthermore, the green sheet is punched into a predetermined shape by embedding the above-mentioned printing paste into the through-holes drilled in order to establish electrical continuity between the upper and lower surfaces of the green sheet, etc. Accordingly, the insulating substrate 1 can be formed by laminating a plurality of sheets and firing them at a temperature of about 1500 ° C. Here, in order to stably form the inspection terminals 2a and the external connection terminals 2b, the surface of the insulating substrate 1 is polished using abrasive grains such as alumina, and the arithmetic average roughness (Ra) is about 0.1 μm or less. It is good.

本発明の検査用端子２ａと外部接続端子２ｂはそれぞれ、絶縁基板１の上面および下面に設けられており、検査用端子２ａと外部接続端子２ｂは、絶縁基板１に形成された内部配線やビア導体３等の配線導体で、電気的に接続されている。   The inspection terminal 2a and the external connection terminal 2b of the present invention are respectively provided on the upper surface and the lower surface of the insulating substrate 1, and the inspection terminal 2a and the external connection terminal 2b are internal wirings and vias formed on the insulating substrate 1. They are electrically connected by a wiring conductor such as the conductor 3.

また、検査用端子２ａと外部接続端子２ｂとは、例えば、絶縁基板１側から、チタン（Ｔｉ）を主成分とする密着金属層、Ｔｉ−Ｗ合金を主成分とする拡散防止層、銅（Ｃｕ）を主成分とする主導体層を順次成膜して形成され、その厚さは、密着金属層から順に０.１μm程度、２μm程度、５μm程度であり、それぞれフォトリソグラフィ法および、エッチング法によりパターン加工することにより形成される。なお、Ｃｕを主成分とする主導体層の表面には、酸化を防ぐために、無電解めっきによって厚さ２μmのニッケル（Ｎｉ）めっき層および厚さ０.２μmの金（Ａｕ）めっき層を順次被着させるのがよい。   Further, the inspection terminal 2a and the external connection terminal 2b are, for example, from the insulating substrate 1 side, an adhesion metal layer mainly composed of titanium (Ti), a diffusion prevention layer mainly composed of a Ti—W alloy, copper ( A main conductor layer containing Cu) as a main component is sequentially formed, and its thickness is about 0.1 μm, 2 μm, and 5 μm in order from the adhesion metal layer. The photolithography method and the etching method, respectively. Is formed by pattern processing. In order to prevent oxidation, a nickel (Ni) plating layer having a thickness of 2 μm and a gold (Au) plating layer having a thickness of 0.2 μm are sequentially formed on the surface of the main conductor layer mainly composed of Cu by electroless plating. It should be attached.

また、検査用端子２ａと外部接続端子２ｂの厚みは、それぞれ全体で０.５μm〜５０μmとするのがよく、０.５μm未満では導通抵抗値が高くなる傾向にあり、５０μmを超えると微細な配線パターンに加工するのが困難となる。   Further, the thickness of the inspection terminal 2a and the external connection terminal 2b is preferably 0.5 to 50 μm as a whole, and if it is less than 0.5 μm, the conduction resistance value tends to increase, and if it exceeds 50 μm, the thickness is fine. It becomes difficult to process the wiring pattern.

次に、検査用端子２ａと外部接続端子２ｂとは、例えば、薄膜形成法、印刷ペーストによるメタライズ法、金属箔をエッチングしてパターン化する方法、パターン状の金属箔を転写する方法等によって形成される。例えば、検査用端子２ａと外部接続端子２ｂとをメッキ法により形成する場合は、無電解メッキ法によるＡｕメッキ層や電解メッキ法によるＡｕメッキ層等を形成し、パターン加工して形成する。   Next, the inspection terminal 2a and the external connection terminal 2b are formed by, for example, a thin film forming method, a metallization method using a printing paste, a method of patterning by etching a metal foil, a method of transferring a patterned metal foil, or the like. Is done. For example, when the inspection terminal 2a and the external connection terminal 2b are formed by a plating method, an Au plating layer by an electroless plating method, an Au plating layer by an electrolytic plating method, or the like is formed and patterned.

本発明の絶縁性の枠部７は、アルミナセラミックス、窒化アルミニウム質焼結体、ガラスセラミックス等の各種セラミックスやパイレックス（登録商標）等の各種ガラス等からなり、ＹＡＧやＣＯ２等のレーザー加工やマイクロブラスト加工を用いて貫通穴を形成することで所望の最狭部６を有する絶縁性の枠部７とすることができる。その後、貫通穴と同サイズの穴の開いた接着材８を用いて絶縁基板１と絶縁性の枠部７とを接合する。このように、絶縁基板１上に形成された検査用端子２ａは絶縁性の枠部７で周囲を囲まれるため、プローブピンが横ずれを起こし難く、検査用端子２ａとの接続を適切に保持できるよう位置決め精度を向上した検査基板とすることができる。よって、プローブピン９が検査用端子２ａからずれたり、隣接する検査用端子２ａと接触することを有効に防ぐことができるため、正確な電気測定を行うことができる。 The insulating frame portion 7 of the present invention is made of various ceramics such as alumina ceramics, aluminum nitride sintered bodies, glass ceramics, various glasses such as Pyrex (registered trademark), and laser processing such as YAG and CO 2. By forming the through hole using microblasting, the insulating frame portion 7 having the desired narrowest portion 6 can be obtained. Thereafter, the insulating substrate 1 and the insulating frame portion 7 are joined using the adhesive 8 having a hole having the same size as the through hole. As described above, since the inspection terminal 2a formed on the insulating substrate 1 is surrounded by the insulating frame portion 7, the probe pin is less likely to cause lateral displacement, and the connection with the inspection terminal 2a can be appropriately maintained. Thus, an inspection substrate with improved positioning accuracy can be obtained. Accordingly, it is possible to effectively prevent the probe pin 9 from being displaced from the inspection terminal 2a or coming into contact with the adjacent inspection terminal 2a, so that accurate electrical measurement can be performed.

その結果、検査用端子２ａ間の距離を近づけることができるとともに、検査用端子２ａの大きさも小さく形成することができる。   As a result, the distance between the inspection terminals 2a can be reduced, and the size of the inspection terminal 2a can be reduced.

また、仮にプローブピン９が横滑りして検査用端子２ａが削れ、金属屑が発生しても、絶縁性の枠部７が検査用端子２ａの上面よりも上側で、内寸が最小となる最狭部６を有することにより、絶縁性の枠部７の内側に金属屑をためることができる。このため、金属屑によって隣接する検査用端子２ａ同士が電気的に短絡することを有効に抑制でき、正確な電気測定検査が行える。   Further, even if the probe pin 9 slides sideways and the inspection terminal 2a is scraped and metal scraps are generated, the insulating frame 7 is above the upper surface of the inspection terminal 2a and the inner dimension is minimized. By having the narrow part 6, metal scraps can be accumulated inside the insulating frame part 7. For this reason, it can suppress effectively that the inspection terminals 2a which adjoin by metal scraps are electrically short-circuited, and can perform an exact electrical measurement test | inspection.

また、検査用端子２ａの上面よりも上側で、絶縁性の枠部７の内寸が最小となるため、絶縁性の枠部７の内側で、プローブピン９と検査用端子２ａとの接続時の衝撃を和らげることができる。つまり、最狭部６と絶縁基板１との間に、プローブピン９が適度に動けるスペースが確保できるため、接続時の衝撃が一箇所に集中せず、検査用端子２ａの磨耗を和らげることができ、耐久性のある検査基板とすることができる。   In addition, since the inner dimension of the insulating frame 7 is minimized above the upper surface of the inspection terminal 2a, the probe pin 9 and the inspection terminal 2a are connected inside the insulating frame 7. Can alleviate the impact. That is, since a space where the probe pin 9 can move appropriately can be secured between the narrowest portion 6 and the insulating substrate 1, the impact at the time of connection is not concentrated on one place, and the wear of the inspection terminal 2a can be eased. And a durable inspection substrate.

また、最狭部６は、平面視で検査用端子２ａと重なるように形成されるのが好ましい。これにより、検査用端子２ａの中央付近にプローブピン９を接触させることができ、より確実にプローブピンと検査用端子とを接触させることができ、電気測定の信頼性をより向上することができる。   The narrowest portion 6 is preferably formed so as to overlap the inspection terminal 2a in plan view. Thereby, the probe pin 9 can be brought into contact with the vicinity of the center of the inspection terminal 2a, the probe pin and the inspection terminal can be brought into contact with each other more reliably, and the reliability of electrical measurement can be further improved.

また、図２に示すように絶縁性の枠部７は、厚み方向の中央部に最狭部６が設けられてもよい。この構造により、さらに、プローブピン９と検査用端子２ａとの接続を確実に行うことができる。つまり、絶縁性の枠部７の内側が、最狭部６から検査用端子２ａに向かって広がるとともに、最狭部６の上方でも広がる形状をもつことにより、プローブピン９を検査用端子２ａに接続する際に絶縁性の枠部７にプローブピン９が当たっても、絶縁性の枠部７の最狭部６の上方に形成された傾斜面に沿って、絶縁性の枠部７の内側へプローブピン９を導き、さらに検査用端子２ａと接触させることができる。よって、さらに信頼性の高い電気測定を行える検査基板とすることができる。   In addition, as shown in FIG. 2, the insulating frame portion 7 may be provided with the narrowest portion 6 at the center in the thickness direction. With this structure, the probe pin 9 and the inspection terminal 2a can be reliably connected. That is, the inner side of the insulating frame portion 7 has a shape that extends from the narrowest portion 6 toward the inspection terminal 2a and also expands above the narrowest portion 6, so that the probe pin 9 becomes the inspection terminal 2a. Even when the probe pin 9 hits the insulating frame 7 when connecting, the inner side of the insulating frame 7 along the inclined surface formed above the narrowest portion 6 of the insulating frame 7. The probe pin 9 can be led to contact with the inspection terminal 2a. Therefore, it can be set as the inspection board which can perform electrical measurement with higher reliability.

また、本発明の検査基板は、被検査対象と検査用端子とを電気的に接続するプローブピンと、被検査対象の電気的特性を検査する、外部接続端子２ｂと電気的に接続されるテスタとを有することにより、検査装置とすることができる。例えば、本発明の検査基板の検査用端子２ａを、ヘッド部４で支持されたプローブピン９と接続し、外部接続端子２ｂを、被検査対象の接続端子Ａと接続した検査装置によると、半導体素子などの電子部品の電気的接続および電気的特性を一括して有効に測定検査できる検査装置とすることができる。   In addition, the inspection board of the present invention includes a probe pin that electrically connects an object to be inspected and an inspection terminal, and a tester that is electrically connected to the external connection terminal 2b for inspecting the electrical characteristics of the object to be inspected. It can be set as an inspection device by having. For example, according to the inspection apparatus in which the inspection terminal 2a of the inspection board of the present invention is connected to the probe pin 9 supported by the head portion 4 and the external connection terminal 2b is connected to the connection terminal A to be inspected, the semiconductor An inspection apparatus capable of effectively measuring and inspecting electrical connection and electrical characteristics of electronic components such as elements collectively can be provided.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更を行うことは何等差し支えない。例えば、絶縁基板１の下面に検査用端子２ａを設け、絶縁基板１の上面に外部接続端子２ｂを設けても何等支障ない。   Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention. For example, there is no problem even if the inspection terminal 2 a is provided on the lower surface of the insulating substrate 1 and the external connection terminal 2 b is provided on the upper surface of the insulating substrate 1.

本発明の検査基板の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the test | inspection board | substrate of this invention. 本発明の検査基板の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the test | inspection board | substrate of this invention. 従来の検査基板の断面図である。It is sectional drawing of the conventional test | inspection board | substrate.

符号の説明Explanation of symbols

１：絶縁基板
２ａ：検査用端子
２ｂ：外部接続端子
６：最狭部
７：絶縁性の枠部
９：プローブピン
Ａ：被検査対象の端子 1: Insulating substrate 2a: Inspection terminal 2b: External connection terminal 6: Narrowest part 7: Insulating frame part 9: Probe pin A: Terminal to be inspected

Claims (3)

絶縁基板の上面に検査用端子を形成するとともに前記絶縁基板の下面に前記検査用端子と電気的に接続された外部接続端子を形成してなる検査基板において、前記絶縁基板の上面に、前記検査用端子の周囲を取り囲むとともに、前記検査用端子の上面よりも上側で内寸が最小となる最狭部を有する絶縁性の枠部を形成したことを特徴とする検査基板。 An inspection board having an inspection terminal formed on an upper surface of an insulating substrate and an external connection terminal electrically connected to the inspection terminal on a lower surface of the insulating substrate, wherein the inspection is formed on the upper surface of the insulating substrate. An inspection board having an insulative frame portion surrounding the periphery of the terminal for use and having a narrowest portion having a minimum inner dimension above the upper surface of the inspection terminal. 前記最狭部を、平面視で前記検査用端子と重なるように形成したことを特徴とする請求項１に記載の検査基板。 The inspection substrate according to claim 1, wherein the narrowest portion is formed so as to overlap the inspection terminal in a plan view. 請求項１または請求項２に記載の検査基板と、被検査対象と前記検査用端子とを電気的に接続するプローブピンと、前記被検査対象の電気的特性を検査する、前記外部接続端子と電気的に接続されるテスタとを有することを特徴とする検査装置。 3. The inspection board according to claim 1 or 2, a probe pin for electrically connecting an object to be inspected and the terminal for inspection, and the external connection terminal and electric for inspecting an electrical characteristic of the object to be inspected. And a tester connected to each other.
JP2005091331A 2005-03-28 2005-03-28 Test substrate and test device Pending JP2006275579A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008101958A (en) * 2006-10-18 2008-05-01 Ngk Spark Plug Co Ltd Substrate for ic testing apparatus
JPWO2017169760A1 (en) * 2016-03-30 2019-03-07 株式会社村田製作所 Electronic devices
CN110634840A (en) * 2019-09-24 2019-12-31 京东方科技集团股份有限公司 Detection substrate, preparation method thereof, detection device and detection method
CN114200341A (en) * 2020-08-28 2022-03-18 慧萌高新科技有限公司 Device with roller electrode contact for checking sheet-like electronic component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008101958A (en) * 2006-10-18 2008-05-01 Ngk Spark Plug Co Ltd Substrate for ic testing apparatus
JP4616230B2 (en) * 2006-10-18 2011-01-19 日本特殊陶業株式会社 Substrate for IC inspection equipment
JPWO2017169760A1 (en) * 2016-03-30 2019-03-07 株式会社村田製作所 Electronic devices
CN110634840A (en) * 2019-09-24 2019-12-31 京东方科技集团股份有限公司 Detection substrate, preparation method thereof, detection device and detection method
US11398590B2 (en) 2019-09-24 2022-07-26 Boe Technology Group Co, Ltd. Detection substrate, preparation method thereof, detection device and detection method
CN114200341A (en) * 2020-08-28 2022-03-18 慧萌高新科技有限公司 Device with roller electrode contact for checking sheet-like electronic component

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