JP2006177887A - 被検査体の外観検査装置 - Google Patents
被検査体の外観検査装置 Download PDFInfo
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- JP2006177887A JP2006177887A JP2004373741A JP2004373741A JP2006177887A JP 2006177887 A JP2006177887 A JP 2006177887A JP 2004373741 A JP2004373741 A JP 2004373741A JP 2004373741 A JP2004373741 A JP 2004373741A JP 2006177887 A JP2006177887 A JP 2006177887A
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- 238000011179 visual inspection Methods 0.000 title abstract description 5
- 238000003384 imaging method Methods 0.000 claims abstract description 163
- 238000007689 inspection Methods 0.000 claims abstract description 116
- 239000000758 substrate Substances 0.000 abstract description 170
- 230000032258 transport Effects 0.000 description 28
- 238000005286 illumination Methods 0.000 description 25
- 238000012545 processing Methods 0.000 description 23
- 230000015654 memory Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
【解決手段】 基板2の外観検査装置200において、複数のスレーブPC140は、基板2の撮像を行う複数の撮像部30と、該複数の撮像部30の各々に対応して設けられ、対応する撮像部30により撮像された基板2の撮像データに基づいて基板2の検査を行う。該複数のスレーブPC140の各々は他のスレーブPC140に、該他のスレーブPC140による検査に必要な共用データを送信する。共用データは、各々のスレーブPC140が対応する撮像部30により撮像された基板2の撮像データから取得してものである。スレーブPC140は各々、他のスレーブPC140から受信した共用データを参照して基板2の外観検査を行う。
【選択図】 図4
Description
Claims (3)
- 被検査体の撮像を行う複数の撮像部と、該複数の撮像部の各々に対応して設けられ、対応する撮像部により撮像された被検査体の撮像データに基づいて被検査体の検査を行う複数の検査手段と、を有し、
該複数の検査手段の各々は他の検査手段に、該他の検査手段による検査に必要な共用データを送信することを特徴とする被検査体の外観検査装置。 - 前記共用データは、各検査手段が対応する撮像部により撮像された被検査体の撮像データから取得したものであることを特徴とする請求項1に記載の被検査体の外観検査装置。
- 前記検査手段は各々、他の検査手段から受信した共用データを参照して被検査体の外観検査を行うことを特徴とする請求項1または2に記載の被検査体の外観検査装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373741A JP4654022B2 (ja) | 2004-12-24 | 2004-12-24 | 基板の外観検査装置 |
US11/314,094 US7751611B2 (en) | 2004-12-24 | 2005-12-22 | Apparatus for inspecting appearance of inspection piece |
CNB2005100033839A CN100439862C (zh) | 2004-12-24 | 2005-12-23 | 被检查体的外观检查装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373741A JP4654022B2 (ja) | 2004-12-24 | 2004-12-24 | 基板の外観検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006177887A true JP2006177887A (ja) | 2006-07-06 |
JP4654022B2 JP4654022B2 (ja) | 2011-03-16 |
Family
ID=36696796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004373741A Active JP4654022B2 (ja) | 2004-12-24 | 2004-12-24 | 基板の外観検査装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7751611B2 (ja) |
JP (1) | JP4654022B2 (ja) |
CN (1) | CN100439862C (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008298488A (ja) * | 2007-05-29 | 2008-12-11 | Saki Corp:Kk | 外観検査装置およびシステム |
JP2017058306A (ja) * | 2015-09-18 | 2017-03-23 | 日本電気株式会社 | 識別装置および識別方法 |
KR20200109236A (ko) * | 2019-03-12 | 2020-09-22 | 가부시키가이샤 스크린 홀딩스 | 검사 장치 및 검사 방법 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG138491A1 (en) * | 2006-06-21 | 2008-01-28 | Generic Power Pte Ltd | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
US8077307B2 (en) * | 2008-04-09 | 2011-12-13 | Orbotech Ltd. | Illumination system for optical inspection |
JP5989981B2 (ja) * | 2011-09-22 | 2016-09-07 | 富士機械製造株式会社 | 生産ラインおよび基板検査方法 |
FR3004582B1 (fr) * | 2013-04-11 | 2015-04-10 | Vit | Systeme et procede d'inspection optique de circuits electroniques |
JP6338085B2 (ja) | 2014-03-20 | 2018-06-06 | 日本電産リード株式会社 | 可撓性基板検査装置 |
JP6450697B2 (ja) * | 2016-03-22 | 2019-01-09 | Ckd株式会社 | 基板検査装置 |
JP6815162B2 (ja) * | 2016-10-20 | 2021-01-20 | 株式会社日立製作所 | 溶接監視システムおよび溶接監視方法 |
CN106767508A (zh) * | 2016-12-24 | 2017-05-31 | 大连日佳电子有限公司 | 一种钢网开孔精确度的检测装置 |
CN108535262A (zh) * | 2018-03-22 | 2018-09-14 | 深圳市永光神目科技有限公司 | 一种光源结构及焊锡缺陷检测*** |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6315380A (ja) * | 1986-07-07 | 1988-01-22 | Kyodo Printing Co Ltd | 繰返しパタ−ンをもつ物品の検査方法及びその装置 |
JPH06222012A (ja) * | 1992-12-01 | 1994-08-12 | Hitachi Ltd | 画像処理装置及び画像処理方法及び半導体パッケージ外観検査装置 |
JPH11118439A (ja) * | 1997-10-13 | 1999-04-30 | Matsushita Electric Ind Co Ltd | 実装基板の外観検査装置および外観検査システムならびに外観検査方法 |
JPH11132966A (ja) * | 1997-10-31 | 1999-05-21 | Mitsubishi Rayon Co Ltd | 欠陥検査装置用蛇行追従装置 |
JPH11170489A (ja) * | 1997-12-08 | 1999-06-29 | Dainippon Printing Co Ltd | 印刷物画像検査装置及び集中印刷物画像検査装置 |
JP2001005166A (ja) * | 1999-06-17 | 2001-01-12 | Nec Corp | パターン検査方法及びパターン検査装置 |
JP2002100660A (ja) * | 2000-07-18 | 2002-04-05 | Hitachi Ltd | 欠陥検出方法と欠陥観察方法及び欠陥検出装置 |
JP2003083718A (ja) * | 2001-09-14 | 2003-03-19 | Mitsubishi Electric Engineering Co Ltd | 高速移動体の外観検査システム |
JP2003115047A (ja) * | 2001-03-23 | 2003-04-18 | Keisoku Giken Co Ltd | 高精細画像生成表示装置 |
JP2006184022A (ja) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | 外観検査装置 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4538909A (en) * | 1983-05-24 | 1985-09-03 | Automation Engineering, Inc. | Circuit board inspection apparatus and method |
US4759074A (en) * | 1986-10-28 | 1988-07-19 | General Motors Corporation | Method for automatically inspecting parts utilizing machine vision and system utilizing same |
IL82037A0 (en) * | 1987-03-29 | 1987-10-20 | Kalman Peleg | Method and apparatus for automatically inspecting and classifying different objects |
JPH0786466B2 (ja) * | 1990-07-18 | 1995-09-20 | 大日本スクリーン製造株式会社 | プリント基板のパターン検査装置 |
JP2591292B2 (ja) * | 1990-09-05 | 1997-03-19 | 日本電気株式会社 | 画像処理装置とそれを用いた自動光学検査装置 |
US5835223A (en) * | 1996-01-05 | 1998-11-10 | Electronic Packaging Services, Ltd. | System for measuring surface flatness using shadow moire technology |
US6122065A (en) * | 1996-08-12 | 2000-09-19 | Centre De Recherche Industrielle Du Quebec | Apparatus and method for detecting surface defects |
US6061086A (en) * | 1997-09-11 | 2000-05-09 | Canopular East Inc. | Apparatus and method for automated visual inspection of objects |
US5978521A (en) * | 1997-09-25 | 1999-11-02 | Cognex Corporation | Machine vision methods using feedback to determine calibration locations of multiple cameras that image a common object |
US6173071B1 (en) * | 1997-12-16 | 2001-01-09 | Harold Wasserman | Apparatus and method for processing video data in automatic optical inspection |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US6493597B1 (en) * | 1998-01-30 | 2002-12-10 | Inspectron | Print monitoring system and method using slave signal processor/master processor arrangement |
US6667762B1 (en) * | 1998-05-29 | 2003-12-23 | Robotic Vision Systems, Inc. | Miniature inspection system |
DK1185854T3 (da) * | 1999-03-19 | 2007-03-26 | Titech Visionsort As | Materialeinspektion |
US6484066B1 (en) * | 1999-10-29 | 2002-11-19 | Lockheed Martin Corporation | Image life tunnel scanner inspection system using extended depth of field technology |
US6831998B1 (en) * | 2000-06-22 | 2004-12-14 | Hitachi, Ltd. | Inspection system for circuit patterns and a method thereof |
US6621566B1 (en) * | 2000-10-02 | 2003-09-16 | Teradyne, Inc. | Optical inspection system having integrated component learning |
JP2003177553A (ja) * | 2001-12-13 | 2003-06-27 | Dainippon Screen Mfg Co Ltd | レーザ描画方法とその装置 |
JP2004085436A (ja) * | 2002-08-28 | 2004-03-18 | Hitachi Giken Co Ltd | 工業製品の目視検査支援装置 |
JP4188674B2 (ja) * | 2002-12-09 | 2008-11-26 | 松下電器産業株式会社 | 検査データ作成方法 |
JP4166585B2 (ja) * | 2003-01-20 | 2008-10-15 | 株式会社サキコーポレーション | 外観検査装置および外観検査方法 |
JP4166587B2 (ja) * | 2003-01-24 | 2008-10-15 | 株式会社サキコーポレーション | 外観検査装置および体積検査方法 |
US7010086B2 (en) * | 2004-01-15 | 2006-03-07 | Agilent Technologies, Inc. | Three-dimensional x-ray imaging system |
JP4061289B2 (ja) * | 2004-04-27 | 2008-03-12 | 独立行政法人科学技術振興機構 | 画像検査方法及び装置 |
US7215808B2 (en) * | 2004-05-04 | 2007-05-08 | Kla-Tencor Technologies Corporation | High throughout image for processing inspection images |
US7590279B2 (en) * | 2004-12-24 | 2009-09-15 | Saki Corporation | Appearance inspection apparatus for inspecting inspection piece |
KR100661980B1 (ko) * | 2005-01-10 | 2006-12-28 | 엘지전자 주식회사 | 박막 검사 센서어래이의 정렬용 조명장치 및 그를 이용한 센서어래이 정렬 방법 |
US20080156207A1 (en) * | 2006-12-28 | 2008-07-03 | Dan Ellenbogen | Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
-
2004
- 2004-12-24 JP JP2004373741A patent/JP4654022B2/ja active Active
-
2005
- 2005-12-22 US US11/314,094 patent/US7751611B2/en active Active
- 2005-12-23 CN CNB2005100033839A patent/CN100439862C/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6315380A (ja) * | 1986-07-07 | 1988-01-22 | Kyodo Printing Co Ltd | 繰返しパタ−ンをもつ物品の検査方法及びその装置 |
JPH06222012A (ja) * | 1992-12-01 | 1994-08-12 | Hitachi Ltd | 画像処理装置及び画像処理方法及び半導体パッケージ外観検査装置 |
JPH11118439A (ja) * | 1997-10-13 | 1999-04-30 | Matsushita Electric Ind Co Ltd | 実装基板の外観検査装置および外観検査システムならびに外観検査方法 |
JPH11132966A (ja) * | 1997-10-31 | 1999-05-21 | Mitsubishi Rayon Co Ltd | 欠陥検査装置用蛇行追従装置 |
JPH11170489A (ja) * | 1997-12-08 | 1999-06-29 | Dainippon Printing Co Ltd | 印刷物画像検査装置及び集中印刷物画像検査装置 |
JP2001005166A (ja) * | 1999-06-17 | 2001-01-12 | Nec Corp | パターン検査方法及びパターン検査装置 |
JP2002100660A (ja) * | 2000-07-18 | 2002-04-05 | Hitachi Ltd | 欠陥検出方法と欠陥観察方法及び欠陥検出装置 |
JP2003115047A (ja) * | 2001-03-23 | 2003-04-18 | Keisoku Giken Co Ltd | 高精細画像生成表示装置 |
JP2003083718A (ja) * | 2001-09-14 | 2003-03-19 | Mitsubishi Electric Engineering Co Ltd | 高速移動体の外観検査システム |
JP2006184022A (ja) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | 外観検査装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008298488A (ja) * | 2007-05-29 | 2008-12-11 | Saki Corp:Kk | 外観検査装置およびシステム |
JP2017058306A (ja) * | 2015-09-18 | 2017-03-23 | 日本電気株式会社 | 識別装置および識別方法 |
KR20200109236A (ko) * | 2019-03-12 | 2020-09-22 | 가부시키가이샤 스크린 홀딩스 | 검사 장치 및 검사 방법 |
KR102192750B1 (ko) | 2019-03-12 | 2020-12-18 | 가부시키가이샤 스크린 홀딩스 | 검사 장치 및 검사 방법 |
Also Published As
Publication number | Publication date |
---|---|
US20060165274A1 (en) | 2006-07-27 |
CN100439862C (zh) | 2008-12-03 |
JP4654022B2 (ja) | 2011-03-16 |
CN1987347A (zh) | 2007-06-27 |
US7751611B2 (en) | 2010-07-06 |
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