JP2005311040A - ウェハ用の吸着チャック - Google Patents
ウェハ用の吸着チャック Download PDFInfo
- Publication number
- JP2005311040A JP2005311040A JP2004125418A JP2004125418A JP2005311040A JP 2005311040 A JP2005311040 A JP 2005311040A JP 2004125418 A JP2004125418 A JP 2004125418A JP 2004125418 A JP2004125418 A JP 2004125418A JP 2005311040 A JP2005311040 A JP 2005311040A
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- Japan
- Prior art keywords
- suction
- wafer
- suction surface
- chuck
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010521 absorption reaction Methods 0.000 title 1
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 235000012431 wafers Nutrition 0.000 abstract 3
- 238000005452 bending Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
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- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】円形の吸着面11を有する本体10と、吸着面11に付設する吸着パッド21とを備え、吸着面11には、中央の連結孔12を介して真空源に連通させる放射状の凹溝15、15…を形成し、吸着パッド21には、周方向の同位置で区切る同心円状の開口部21a、21a…を形成する。
【選択図】図1
Description
β…中心角
10…本体
11…吸着面
12…連結孔
14…外フランジ
15…凹溝
21…吸着パッド
21a…開口部
特許出願人 株式会社 ビービーエス金明
代理人 弁理士 松 田 忠 秋
Claims (4)
- 円形の吸着面を有する本体と、前記吸着面に付設する吸着パッドとを備えてなり、前記吸着面には、中央の連結孔を介して真空源に連通させる放射状の凹溝を形成し、前記吸着パッドには、前記各凹溝の相対角度相当の中心角を隔てて周方向の同位置で区切る同心円状の開口部を形成することを特徴とするウェハ用の吸着チャック。
- 前記本体は、前記吸着面を拡大する可撓性の外フランジを有することを特徴とする請求項1記載のウェハ用の吸着チャック。
- 最外周側の前記開口部は、内側に隣接する前記開口部に連通させることを特徴とする請求項1または請求項2記載のウェハ用の吸着チャック。
- 前記吸着パッドは、前記吸着面と同径の円形とすることを特徴とする請求項1ないし請求項3のいずれか記載のウェハ用の吸着チャック。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004125418A JP4445318B2 (ja) | 2004-04-21 | 2004-04-21 | ウェハ用の吸着チャック |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004125418A JP4445318B2 (ja) | 2004-04-21 | 2004-04-21 | ウェハ用の吸着チャック |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005311040A true JP2005311040A (ja) | 2005-11-04 |
JP4445318B2 JP4445318B2 (ja) | 2010-04-07 |
Family
ID=35439458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004125418A Expired - Lifetime JP4445318B2 (ja) | 2004-04-21 | 2004-04-21 | ウェハ用の吸着チャック |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4445318B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008030175A (ja) * | 2006-07-31 | 2008-02-14 | Setsuko Kondo | ロアチャックパッド |
JP2009184074A (ja) * | 2008-02-06 | 2009-08-20 | Sd Future Technology Co Ltd | 研磨装置 |
US20120267423A1 (en) * | 2011-04-19 | 2012-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and Apparatus for Thin Die Processing |
US10460975B2 (en) | 2014-12-04 | 2019-10-29 | Sumco Corporation | Vacuum chuck, beveling/polishing device, and silicon wafer beveling/polishing method |
CN112802794A (zh) * | 2021-04-07 | 2021-05-14 | 宁波润华全芯微电子设备有限公司 | 一种静电卡盘装置及去胶机 |
-
2004
- 2004-04-21 JP JP2004125418A patent/JP4445318B2/ja not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008030175A (ja) * | 2006-07-31 | 2008-02-14 | Setsuko Kondo | ロアチャックパッド |
JP2009184074A (ja) * | 2008-02-06 | 2009-08-20 | Sd Future Technology Co Ltd | 研磨装置 |
US20120267423A1 (en) * | 2011-04-19 | 2012-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and Apparatus for Thin Die Processing |
US10460975B2 (en) | 2014-12-04 | 2019-10-29 | Sumco Corporation | Vacuum chuck, beveling/polishing device, and silicon wafer beveling/polishing method |
DE112015005458B4 (de) | 2014-12-04 | 2022-07-14 | Sumco Corporation | Vakuumspannvorrichtung, abschräg-/poliervorrichtung und siliciumwaferabschräg-/polierverfahren |
CN112802794A (zh) * | 2021-04-07 | 2021-05-14 | 宁波润华全芯微电子设备有限公司 | 一种静电卡盘装置及去胶机 |
Also Published As
Publication number | Publication date |
---|---|
JP4445318B2 (ja) | 2010-04-07 |
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