JP2005114679A - Sample-analyzing method and sample-collecting device - Google Patents

Sample-analyzing method and sample-collecting device Download PDF

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JP2005114679A
JP2005114679A JP2003352591A JP2003352591A JP2005114679A JP 2005114679 A JP2005114679 A JP 2005114679A JP 2003352591 A JP2003352591 A JP 2003352591A JP 2003352591 A JP2003352591 A JP 2003352591A JP 2005114679 A JP2005114679 A JP 2005114679A
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cutting
cutting blade
sample
piece
blade
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JP3738446B2 (en
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Yoshio Kijima
芳雄 木嶋
Itsuo Nishiyama
逸雄 西山
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Daipura Uintesu Kk
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a sample-analyzing method and a sample-collecting device, which can properly analyze an interior portion of a cut strip and a condition of a cut surface. <P>SOLUTION: The surface of a sample is cut by using a diamond cutting blade 1, and the cut strip C is irradiated with an infra-red light, in such a state that the cut strip C is held on the cutting face 1a of the blade 1, and light passing through the cut strip C and the diamond cutting blade 1 is received by a transmission light detector 32 and analyzed. As a result, the influence due to the light reflected by the surface of the cut strip C is suppressed, and the interior portion of the cut strip C and the condition of the cut surface are properly analyzed. Furthermore, by eliminating the need to separate the cut strip C from the diamond cutting blade 1, the problem of the cut strip C collapsing discretely by a force of tweezers or the like used for holding the cut strip C, whereby the cut strip C can be properly analyzed, even when its thickness is very thin (for example, 1 μm) or it is brittle is solved. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、試料分析方法および試料採取装置に関し、さらに詳しくは、試料表面から切削片を採取して分析を行う試料分析方法および試料表面を切削して切削片を採取する試料採取装置に関する。   The present invention relates to a sample analysis method and a sample collection device, and more particularly to a sample analysis method for collecting and analyzing a cut piece from a sample surface and a sample collection device for cutting a sample surface and collecting a cut piece.

従来、切刃により試料の表面を切削し、切刃のすくい面に切削片を削り起こしてのせ、切刃にのせた切削片に赤外光を照射し、反射光を分析する分析方法が知られている（例えば、特許文献１参照。）。   Conventionally, there is a known analysis method that analyzes the reflected light by cutting the surface of the sample with a cutting edge, shaving the cutting piece on the rake face of the cutting edge, irradiating the cutting piece placed on the cutting edge with infrared light. (For example, refer to Patent Document 1).

特開平１１−４４６１６号公報（［００４０］、図５）Japanese Patent Laid-Open No. 11-44616 ([0040], FIG. 5)

従来の分析方法では、切刃に高反射性の金属膜を設けているため、反射光の分析しか行えなかった。
しかし、切削片の表面での反射光の影響が非常に大きい場合、切削片の内部や切削面の状態を分析しにくい問題点があった。
そこで、本発明の目的は、切削片の内部や切削面の状態を好適に分析できる試料分析方法および試料採取装置を提供することにある。 In the conventional analysis method, since the highly reflective metal film is provided on the cutting edge, only the reflected light can be analyzed.
However, when the influence of the reflected light on the surface of the cutting piece is very large, there is a problem that it is difficult to analyze the inside of the cutting piece and the state of the cutting surface.
Therefore, an object of the present invention is to provide a sample analysis method and a sampling device that can suitably analyze the inside of a cutting piece and the state of a cutting surface.

第１の観点では、本発明は、測定光を透過させる材料から成る切刃を切削駆動手段に装着し、前記切刃を試料に切り込ませ、前記切刃のすくい面に切削片を削り起こしてのせ、前記切削片をのせたまま前記切刃を切削駆動手段から分離し、前記切削片を前記切刃にのせたままの状態で測定光を当て、前記切削片の分析を行うことを特徴とする試料分析方法を提供する。
上記第１の観点による試料分析方法では、測定光を透過させる材料から成る切刃を用いる。このため、切削片および切刃を透過した光を分析することが出来る。これにより、切削片の表面での反射光の影響を抑制し、切削片の内部や切削面の状態を好適に分析できる。
なお、切刃から切削片を分離してから分析しようとすると、ピンセット等で切削片をつかむ力で切削片がばらばらに崩れてしまい、分析できなくなることがあるが、上記第１の観点による試料分析方法では、切刃のすくい面に切削片をのせたまま分析するので、切削片が非常に薄い（例えば１μｍ）場合や脆い場合でも好適に分析できる。
また、上記構成において、切削駆動手段は、電動のものでもよいし、手動のものでもよい。 In a first aspect, the present invention provides a cutting blade made of a material that transmits measurement light to a cutting drive means, cuts the cutting blade into a sample, and scrapes a cutting piece on a rake face of the cutting blade. The cutting blade is separated from the cutting driving means with the cutting piece placed thereon, and the cutting piece is analyzed by applying measurement light while the cutting piece is placed on the cutting blade. A sample analysis method is provided.
In the sample analysis method according to the first aspect, a cutting blade made of a material that transmits measurement light is used. For this reason, the light which permeate | transmitted the cutting piece and the cutting blade can be analyzed. Thereby, the influence of the reflected light on the surface of the cutting piece can be suppressed, and the inside of the cutting piece and the state of the cutting surface can be suitably analyzed.
Note that if the cutting piece is separated from the cutting blade and then analyzed, the cutting piece may be broken apart by the force of grabbing the cutting piece with tweezers or the like, making it impossible to analyze the sample. In the analysis method, since the analysis is performed with the cutting piece placed on the rake face of the cutting blade, the analysis can be suitably performed even when the cutting piece is very thin (for example, 1 μm) or brittle.
In the above configuration, the cutting drive means may be electric or manual.

第２の観点では、本発明は、上記構成の試料分析方法において、前記切刃の材料がダイヤモンドであり、前記測定光が赤外光であることを特徴とする試料分析方法を提供する。
上記第２の観点による試料分析方法では、赤外光の吸収がほとんど無いダイヤモンド切刃を用いるため、透過光を好適に分析できる。 In a second aspect, the present invention provides a sample analysis method characterized in that, in the sample analysis method configured as described above, the material of the cutting edge is diamond and the measurement light is infrared light.
In the sample analysis method according to the second aspect, since a diamond cutting blade that hardly absorbs infrared light is used, transmitted light can be analyzed suitably.

第３の観点では、本発明は、上記構成の試料分析方法において、前記切刃のすくい面の内側から前記測定光を当て、前記切刃のすくい面側の前記切削片の面で反射した反射光を受光して分析することを特徴とする試料分析方法を提供する。
上記第３の観点による試料分析方法では、切刃のすくい面に切削片をのせたままの状態で切刃を通して測定光を当て、切削面で反射され再び切刃を透過した光を分析する。このように切削面で反射した光を分析するため、切削片の表面での反射光の影響がなく、切削面の状態を好適に分析できる。また、切削片が測定光を透過しない材料の場合でも切削面の状態を分析できる。 In a third aspect, the present invention provides the sample analysis method having the above-described configuration, in which the measurement light is applied from the inside of the rake face of the cutting blade and reflected by the surface of the cutting piece on the rake face side of the cutting edge. Provided is a sample analysis method characterized by receiving and analyzing light.
In the sample analysis method according to the third aspect, measurement light is applied through the cutting blade while the cutting piece is placed on the rake face of the cutting blade, and light reflected by the cutting surface and transmitted through the cutting blade is analyzed again. Thus, since the light reflected by the cutting surface is analyzed, there is no influence of the reflected light on the surface of the cutting piece, and the state of the cutting surface can be suitably analyzed. Even when the cutting piece is made of a material that does not transmit measurement light, the state of the cutting surface can be analyzed.

第４の観点では、本発明は、測定光を透過させる材料から成る切刃と、前記切刃を試料に切り込ませ前記切刃のすくい面に切削片を削り起こすための切削駆動手段と、前記切削片をのせたまま前記切刃を切削駆動手段から分離するための切刃分離手段とを具備したことを特徴とする試料採取装置を提供する。
上記第４の観点による試料採取装置では、上記第１の観点による試料分析方法を好適に実施できる。 In a fourth aspect, the present invention relates to a cutting blade made of a material that transmits measurement light, and a cutting driving means for cutting the cutting blade into a sample and scraping a cutting piece on a rake face of the cutting blade; There is provided a sampling apparatus comprising: a cutting blade separating means for separating the cutting blade from a cutting driving means while the cutting piece is placed thereon.
In the sample collection device according to the fourth aspect, the sample analysis method according to the first aspect can be suitably implemented.

第５の観点では、本発明は、上記構成の試料採取装置において、前記切削片の熱変形温度付近の温度ガスを、前記切刃のすくい面に削り起こされた状態の前記切削片に吹き付けるための温度ガス吹付手段を具備したことを特徴とする試料採取装置を提供する。
切削片をのせたまま切刃を切削駆動手段から分離するとき、切削片がすくい面から脱落することがある。
そこで、上記第５の観点による試料採取装置では、切刃を切削駆動手段から分離する前に、切削片の熱変形温度付近の温度ガスを切削片に吹き付けて、切削片をすくい面に付着させる。これにより、切削片がすくい面から脱落することを防止できる。 In a fifth aspect, the present invention is directed to spraying a temperature gas in the vicinity of the thermal deformation temperature of the cutting piece to the cutting piece in a state of being shaved and raised on the rake face of the cutting blade in the sampling device having the above-described configuration. There is provided a sampling apparatus comprising the temperature gas spraying means.
When the cutting blade is separated from the cutting driving means while the cutting piece is placed, the cutting piece may fall off the rake face.
Therefore, in the sampling device according to the fifth aspect, before the cutting blade is separated from the cutting drive means, a temperature gas near the thermal deformation temperature of the cutting piece is sprayed on the cutting piece to attach the cutting piece to the rake face. . Thereby, it can prevent that the cutting piece falls off from the rake face.

第６の観点では、本発明は、上記構成の試料採取装置において、前記切刃の材料が、ダイヤモンドであることを特徴とする試料採取装置を提供する。
上記第６の観点による試料採取装置では、上記第２の観点による試料分析方法を好適に実施できる。 In a sixth aspect, the present invention provides a sampling device, wherein the material of the cutting blade is diamond in the sampling device having the above configuration.
In the sampling apparatus according to the sixth aspect, the sample analysis method according to the second aspect can be suitably implemented.

本発明の試料分析方法および試料採取装置によれば、切刃を透過した光を分析できるため、切削片の表面での反射光の影響を抑制し、切削片の内部や切削面の状態を好適に分析できる。また、切刃のすくい面に切削片をのせたまま分析するので、切削片が非常に薄い場合や脆い場合でも好適に分析できる。   According to the sample analysis method and the sampling apparatus of the present invention, since the light transmitted through the cutting blade can be analyzed, the influence of the reflected light on the surface of the cutting piece is suppressed, and the state of the inside of the cutting piece and the cutting surface is suitable Can be analyzed. Further, since the analysis is performed with the cutting piece placed on the rake face of the cutting edge, the analysis can be suitably performed even when the cutting piece is very thin or fragile.

以下、図に示す実施の形態により本発明をさらに詳細に説明する。なお、これにより本発明が限定されるものではない。   Hereinafter, the present invention will be described in more detail with reference to embodiments shown in the drawings. Note that the present invention is not limited thereby.

図１は、実施例１に係る試料採取装置１００の構成説明図である。
この試料採取装置１００は、試料Ｐを保持する試料保持台２０と、ダイヤモンド切刃１と、ダイヤモンド切刃１を保持する切刃ホルダ２と、切刃ホルダ２を直交３軸方向に移動させる切刃移動機構３と、ダイヤモンド切刃１を試料Ｐに切り込ませて削り起こした切削片に温風を吹き付けるガスノズル４０と、切刃移動機構３を含む切削駆動装置１０とを具備している。 FIG. 1 is an explanatory diagram of a configuration of a sample collection device 100 according to the first embodiment.
The sample collection device 100 includes a sample holder 20 that holds a sample P, a diamond cutting blade 1, a cutting blade holder 2 that holds the diamond cutting blade 1, and a cutting tool that moves the cutting blade holder 2 in three orthogonal directions. A blade moving mechanism 3, a gas nozzle 40 that blows hot air onto a cut piece that is cut by cutting the diamond cutting blade 1 into the sample P, and a cutting drive device 10 that includes the cutting blade moving mechanism 3 are provided.

切削駆動装置１０は、例えば特開２００３−２５４８９４号公報で開示されている構成である。   The cutting drive device 10 has a configuration disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-254894.

次に、試料採取装置１００を用いた試料分析方法の手順を説明する。
（１）図１および図２に示すように、試料Ｐの表面には、切削方向に直交する方向にカッターで切り込みＰａを入れておく。なお、試料Ｐとして、２ｍｍ厚のポリカーボネート・シートを想定する。
（２）図２に示すように、ダイヤモンド切刃１を試料Ｐに切り込ませ、すくい面１ａに切削片Ｃを削り起こす。
（３）図３に示すように、ダイヤモンド切刃１が切削方向に移動して切り込みＰａに達すると、切削片Ｃが試料Ｐから分離してすくい面１ａに乗る。この状態で、ポリカーボネートの熱変形温度付近の温風ｈをガスノズル４０から切削片Ｃに吹き付けると、切削片Ｃが熱変形し、すくい面１ａに付着する。
（４）図４に示すように、切刃ホルダ固定ボルトＢ１を緩め、切刃ホルダ２を切刃移動機構３から分離する。なお、切刃移動機構３にはキー溝３ａがあり、このキー溝３ａに切刃ホルダ２の背面に突出している位置決め用キーを合わせて切刃移動機構３に対して切刃ホルダ２を位置決めする。
（５）図５に示すように、切刃固定ボルトＢ２を緩め、ダイヤモンド切刃１を切刃ホルダ２から分離する。なお、切刃ホルダ２には切刃ストッパ２ａがあり、この切刃ストッパ２ａにダイヤモンド切刃１の天面を合わせて切刃ホルダ２に対してダイヤモンド切刃１を位置決めする。
（６）すくい面１ａに切削片Ｃが付着したダイヤモンド切刃１を、恒温恒湿室に設置した赤外分析装置で分析する。すなわち、図６に示すように、光源５から切削片Ｃに赤外光を当て、切削片Ｃおよびダイヤモンド切刃１を透過した赤外光を透過光検出器３２で受光し、分光法的機器分析を行う。また、切削片Ｃから反射した赤外光を反射光検出器３１で受光し、分光法的機器分析を行う。
（７）分析後、ダイヤモンド切刃１から切削片Ｃを除去し、ダイヤモンド切刃１を洗浄し、ダイヤモンド切刃１を切刃ホルダ２に装着し、切刃ホルダ２を切刃移動機構３に取り付け、ダイヤモンド切刃１を再使用する。 Next, the procedure of the sample analysis method using the sample collection device 100 will be described.
(1) As shown in FIGS. 1 and 2, the surface of the sample P is cut with a cutter Pa in a direction perpendicular to the cutting direction. As the sample P, a 2 mm thick polycarbonate sheet is assumed.
(2) As shown in FIG. 2, the diamond cutting edge 1 is cut into the sample P, and the cutting piece C is shaved on the rake face 1a.
(3) As shown in FIG. 3, when the diamond cutting blade 1 moves in the cutting direction and reaches the cut Pa, the cutting piece C separates from the sample P and rides on the rake face 1a. In this state, when hot air h near the heat deformation temperature of the polycarbonate is blown from the gas nozzle 40 onto the cutting piece C, the cutting piece C is thermally deformed and adheres to the rake face 1a.
(4) As shown in FIG. 4, the cutting blade holder fixing bolt B <b> 1 is loosened, and the cutting blade holder 2 is separated from the cutting blade moving mechanism 3. The cutting edge moving mechanism 3 has a keyway 3a, and a positioning key protruding from the back of the cutting edge holder 2 is aligned with the keyway 3a to position the cutting edge holder 2 with respect to the cutting edge movement mechanism 3. To do.
(5) As shown in FIG. 5, the cutting blade fixing bolt B <b> 2 is loosened and the diamond cutting blade 1 is separated from the cutting blade holder 2. The cutting blade holder 2 has a cutting blade stopper 2 a, and the diamond cutting blade 1 is positioned with respect to the cutting blade holder 2 by aligning the top surface of the diamond cutting blade 1 with the cutting blade stopper 2 a.
(6) The diamond cutting blade 1 having the cutting piece C attached to the rake face 1a is analyzed by an infrared analyzer installed in a constant temperature and humidity chamber. That is, as shown in FIG. 6, infrared light is applied to the cutting piece C from the light source 5, and the infrared light transmitted through the cutting piece C and the diamond cutting blade 1 is received by the transmitted light detector 32, and the spectroscopic instrument Perform analysis. Further, the infrared light reflected from the cutting piece C is received by the reflected light detector 31 to perform spectroscopic instrument analysis.
(7) After the analysis, the cutting piece C is removed from the diamond cutting blade 1, the diamond cutting blade 1 is cleaned, the diamond cutting blade 1 is mounted on the cutting blade holder 2, and the cutting blade holder 2 is attached to the cutting blade moving mechanism 3. Attach and reuse the diamond cutting blade 1.

実施例１の試料採取装置１００を用いた試料分析方法によれば、切削片Ｃの透過光を分析するため、切削片Ｃの表面での反射光の影響がなく、切削片Ｃの内部や切削面の状態を好適に分析できる。また、ダイヤモンド切刃１から切削片Ｃを分離する必要がないため、切削片Ｃをピンセット等でつかむ力で切削片Ｃがばらばらに崩れてしまうといったことがなく、切削片Ｃが非常に薄い（例えば１μｍ）場合や脆い場合でも好適に分析できる。   According to the sample analysis method using the sampling device 100 of Example 1, since the transmitted light of the cutting piece C is analyzed, there is no influence of the reflected light on the surface of the cutting piece C, and the inside of the cutting piece C or the cutting The state of the surface can be analyzed suitably. Further, since it is not necessary to separate the cutting piece C from the diamond cutting blade 1, the cutting piece C is not broken apart by force of grasping the cutting piece C with tweezers or the like, and the cutting piece C is very thin ( For example, even if it is 1 μm) or brittle, it can be analyzed suitably.

図７に示すように、光源５よりダイヤモンド切刃１を透過して切削片Ｃに赤外光を当て、切削片Ｃの切削面Ｃｂで反射し再びダイヤモンド切刃１を透過した赤外光を反射光検出器３１で受光し、分光法的機器分析を行う。また、切削片Ｃが測定光を透過させる材料の場合、切削片Ｃを透過した赤外光を透過光検出器３２で受光し、分光法的機器分析を行う。   As shown in FIG. 7, infrared light that has passed through the diamond cutting blade 1 from the light source 5 and applied infrared light to the cutting piece C, reflected by the cutting surface Cb of the cutting piece C, and transmitted through the diamond cutting blade 1 again. The reflected light detector 31 receives the light and performs spectroscopic instrument analysis. When the cutting piece C is a material that transmits the measurement light, infrared light transmitted through the cutting piece C is received by the transmitted light detector 32 and subjected to spectroscopic instrument analysis.

実施例２の試料分析方法によれば、切削片Ｃが測定光を透過しない材料の場合でも、切削面Ｃｂの状態を分析できる。   According to the sample analysis method of the second embodiment, the state of the cutting surface Cb can be analyzed even when the cutting piece C is a material that does not transmit measurement light.

切刃のすくい面に切削片を付着させる方法は、水を噴霧して付着させる方法やアルコールのような溶剤を噴霧して付着させる方法を用いてもよい。   As a method of attaching the cutting piece to the rake face of the cutting blade, a method of spraying and attaching water or a method of spraying and attaching a solvent such as alcohol may be used.

本発明の試料分析方法および試料採取装置は、試料表面の性能評価を行うのに利用できる。   The sample analysis method and sample collection apparatus of the present invention can be used for performance evaluation of a sample surface.

実施例１に係る試料採取装置を示す構成説明図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration explanatory diagram illustrating a sample collection device according to a first embodiment. 試料を切削する工程を示す説明図である。It is explanatory drawing which shows the process of cutting a sample. 切削片をすくい面に付着させる工程を示す説明図である。It is explanatory drawing which shows the process of attaching a cutting piece to a rake face. 切刃ホルダを切刃移動機構から分離する工程を示す説明図である。It is explanatory drawing which shows the process of isolate | separating a cutting blade holder from a cutting blade moving mechanism. 切刃を切刃ホルダから分離する工程を示す説明図である。It is explanatory drawing which shows the process of isolate | separating a cutting blade from a cutting blade holder. 切刃を透過した光を分析する工程の一例を示す概念図である。It is a conceptual diagram which shows an example of the process of analyzing the light which permeate | transmitted the cutting blade. 切刃を透過した光を分析する工程の他例を示す概念図である。It is a conceptual diagram which shows the other example of the process of analyzing the light which permeate | transmitted the cutting blade.

符号の説明Explanation of symbols

１ ダイヤモンド切刃
１ａ すくい面
２ 切刃ホルダ
３ 切刃移動機構
５ 光源
１０ 切削駆動装置
２０ 試料保持台
３１ 反射光検出器
３２ 透過光検出器
４０ ガスノズル
Ｃ 切削片
１００ 試料採取装置 DESCRIPTION OF SYMBOLS 1 Diamond cutting blade 1a Rake face 2 Cutting blade holder 3 Cutting blade moving mechanism 5 Light source 10 Cutting drive device 20 Sample holding stand 31 Reflected light detector 32 Transmitted light detector 40 Gas nozzle C Cutting piece 100 Sampling device

Claims (6)

測定光を透過させる材料から成る切刃を切削駆動手段に装着し、前記切刃を試料に切り込ませ、前記切刃のすくい面に切削片を削り起こして乗せ、前記切削片を乗せたまま前記切刃を切削駆動手段から分離し、前記切削片を前記切刃に乗せたままの状態で測定光を当て、前記切削片の分析を行うことを特徴とする試料分析方法。   A cutting blade made of a material that transmits measurement light is attached to the cutting drive means, the cutting blade is cut into the sample, the cutting piece is shaved and placed on the rake face of the cutting blade, and the cutting piece is placed on the cutting edge. A sample analysis method characterized in that the cutting blade is separated from the cutting drive means, and the cutting piece is analyzed by applying measurement light while the cutting piece is placed on the cutting blade. 請求項１に記載の試料分析方法において、前記切刃の材料がダイヤモンドであり、前記測定光が赤外光であることを特徴とする試料分析方法。   The sample analysis method according to claim 1, wherein the material of the cutting edge is diamond, and the measurement light is infrared light. 請求項１または請求項２に記載の試料分析方法において、前記切刃のすくい面の内側から前記測定光を当て、前記切刃のすくい面側の前記切削片の面で反射した反射光を受光して分析することを特徴とする試料分析方法。   The sample analysis method according to claim 1 or 2, wherein the measurement light is applied from the inside of the rake face of the cutting blade, and the reflected light reflected by the surface of the cutting piece on the rake face side of the cutting edge is received. And analyzing the sample. 測定光を透過させる材料から成る切刃と、前記切刃を試料に切り込ませ前記切刃のすくい面に切削片を削り起こすための切削駆動手段と、前記切削片を乗せたまま前記切刃を切削駆動手段から分離するための切刃分離手段とを具備したことを特徴とする試料採取装置。   A cutting blade made of a material that transmits measurement light, a cutting drive means for cutting the cutting blade into a sample and scraping the cutting piece on the rake face of the cutting blade, and the cutting blade with the cutting piece on the cutting blade A sampling apparatus comprising: a cutting blade separating means for separating the cutting drive means from the cutting drive means. 請求項４に記載の試料採取装置において、前記切削片の熱変形温度付近の温度ガスを、前記切刃のすくい面に削り起こされた状態の前記切削片に吹き付けるための温度ガス吹付手段を具備したことを特徴とする試料採取装置。   5. The sampling apparatus according to claim 4, further comprising temperature gas spraying means for spraying a temperature gas in the vicinity of a heat deformation temperature of the cutting piece to the cutting piece in a state of being shaved and raised on the rake face of the cutting blade. A sampling device characterized by that. 請求項４または請求項５に記載の試料採取装置において、前記切刃の材料が、ダイヤモンドであることを特徴とする試料採取装置。   6. The sampling apparatus according to claim 4, wherein the cutting blade material is diamond.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007023651A1 (en) * 2005-08-03 2007-03-01 National University Corporation Tokyo University Of Marine Science And Technology Thin strip production device and thin strip production method
JP2011017696A (en) * 2009-06-09 2011-01-27 Techno Arc:Kk Method and device for analyzing surface
JP2013088333A (en) * 2011-10-20 2013-05-13 Daipura Uintesu Kk Sample analysis method, sample slice collection device, and cutting-edge for sample slice collection
JP2021085747A (en) * 2019-11-27 2021-06-03 ダイプラ・ウィンテス株式会社 Sample surface cutting method, manufacturing method for test section, and sample surface cutting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007023651A1 (en) * 2005-08-03 2007-03-01 National University Corporation Tokyo University Of Marine Science And Technology Thin strip production device and thin strip production method
JP2011017696A (en) * 2009-06-09 2011-01-27 Techno Arc:Kk Method and device for analyzing surface
JP2013088333A (en) * 2011-10-20 2013-05-13 Daipura Uintesu Kk Sample analysis method, sample slice collection device, and cutting-edge for sample slice collection
JP2021085747A (en) * 2019-11-27 2021-06-03 ダイプラ・ウィンテス株式会社 Sample surface cutting method, manufacturing method for test section, and sample surface cutting device
JP7398254B2 (en) 2019-11-27 2023-12-14 ダイプラ・ウィンテス株式会社 Sample surface cutting method, test section preparation method, and sample surface cutting device

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