JP2004080041A - 印刷パターン形成方法、プリントヘッド、印刷システム、集積回路、及び印刷システム操作方法 - Google Patents
印刷パターン形成方法、プリントヘッド、印刷システム、集積回路、及び印刷システム操作方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 58
- 238000011017 operating method Methods 0.000 title 1
- 238000013461 design Methods 0.000 claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 75
- 230000008569 process Effects 0.000 description 29
- 238000010586 diagram Methods 0.000 description 9
- 238000012937 correction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000001914 filtration Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000010187 selection method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ink Jet (AREA)
- Dot-Matrix Printers And Others (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
【解決手段】 パターンレイアウトを複数の設計層に分割する。この複数の設計層の第1の設計層は上記パターンレイアウトからの第1の複数のレイアウトエレメントから構成され、第1の複数のレイアウトエレメントが第1の基準軸に平行である。該第1の基準軸に位置合わせされる第1の印刷方向に基板を横切るプリントヘッドで複数の印刷パスを構成することによって、基板上に上記複数の設計層の上記第1の設計層を印刷するために第1の印刷動作を実行する。これにより、同質の印刷パターンを基板上に生成することができる。
【選択図】 図8
Description
Xact(n)=Xexp(n)+Sx(Xexp(n)-Xexp(0)) ・・・(1)
ここで、Xact(n)は、プリントヘッドにおけるn番目のエジェクタの実際のX軸位置であり、Xexp(n)は該n番目のエジェクタの設計上の(期待される)X軸位置であり、Xexp(0)は、プリントヘッドにおける基準エジェクタ(即ち、上述のプリントヘッドに対するカメラ位置の決定において使用されたエジェクタ)の設計上のX軸位置である。例えば、図19のグラフでは、Xexp(0)は図15及び図16におけるエジェクタ540(0)の設計上のX軸位置になる。同じように、傾きSyは、図20に示されるように、スポットの期待Y軸位置(Yexp)に対してプロットされる各スポットごとのY軸オフセットのグラフでの最適ラインに対して決定されることができる。傾きSyは、以下のようにエジェクタのY軸位置に対し補正ファクタを付与する。
Yact(n)=Yexp(n)+Sy(Yexp(n)-Yexp(0)) ・・・ (2)
ここで、Yact(n)はプリントヘッドにおけるn番目のエジェクタの実際のY軸位置であり、Yexp(n)は、該n番目のエジェクタの設計上の(期待される)Y軸位置であり、Yexp(0)は、基準エジェクタの設計上のY軸位置である。このように、エジェクタ位置への熱影響は効果的に補正できる。このプロセスは図21に示されるフローチャートのステップ801乃至807に要約される。
Claims (5)
- 第1の設計層が、パターンレイアウトの、第1の基準軸に平行である第1の複数のレイアウトエレメントを含む複数の設計層に該パターンレイアウトを分割し、
前記第1の基準軸に位置合わせされる第1の印刷方向に基板を横切ってプリントヘッドで複数の印刷パスを形成することによって、該基板上に前記複数の設計層の前記第1の設計層を印刷するために第1の印刷動作を実行する、
プリントヘッドを有する印刷システムを用いてパターンレイアウトから印刷パターンを形成するための方法。 - 平行しない第1と第2の方向に印刷するように構成される、印刷システム用のプリントヘッドであって、
エジェクタベースと、
前記エジェクタベースに取り付けられ、前記第1の方向及び前記第2の方向に対し斜行する第1のライン上に配列される第1の複数のエジェクタと、
を含む、プリントヘッド。 - 基板を支持するためのステージと、
プリントヘッドと、
パターンの印刷中に第1の印刷方向に前記基板を横切って前記プリントヘッドを移動させるように構成される位置決め機構と、
前記位置決め機構及び前記プリントヘッドを制御するためのシステムコントローラと、
を含み、
前記システムコントローラが、
パターンレイアウトからの全てがパターンレイアウトの第1の基準軸に平行である第1の複数の特徴から構成される第1の設計層を、該パターンレイアウトから抽出するための論理と、
前記第1の基準軸が第1の印刷方向に位置合わせされるように前記第1の設計層を印刷するための論理と、
を有する、パターンレイアウトからのパターンを基板上に印刷するための印刷システム。 - 印刷特徴の全てが、平滑化エッジと同質的構造とを示す、印刷特徴を含む集積回路。
- パターンレイアウトから印刷パターンを作成するために、プリントヘッドと、基板を支持するためのステージと、を含む印刷システムを操作するための方法であって、
印刷システムを較正し、
第1の設計層がパターンレイアウトからの、第1の基準軸に平行である第1の複数のレイアウトエレメントを有する複数の設計層に、パターンレイアウトを分割し、
前記第1の基準軸に位置合わせされる第1の印刷方向において、基板を横切ってプリントヘッドで複数の印刷パスを形成することによって、前記複数の設計層の前記第1の設計層を該基板上に印刷するために第1の印刷動作を実行する、方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/224,701 US6890050B2 (en) | 2002-08-20 | 2002-08-20 | Method for the printing of homogeneous electronic material with a multi-ejector print head |
Publications (2)
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JP2004080041A true JP2004080041A (ja) | 2004-03-11 |
JP4592267B2 JP4592267B2 (ja) | 2010-12-01 |
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JP2003293664A Expired - Fee Related JP4592267B2 (ja) | 2002-08-20 | 2003-08-15 | 印刷パターン形成方法、印刷システム、および、印刷システム操作方法 |
Country Status (4)
Country | Link |
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US (7) | US6890050B2 (ja) |
EP (1) | EP1392091B1 (ja) |
JP (1) | JP4592267B2 (ja) |
DE (1) | DE60329738D1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
US20050142293A1 (en) | 2005-06-30 |
US6890050B2 (en) | 2005-05-10 |
US20040036731A1 (en) | 2004-02-26 |
DE60329738D1 (de) | 2009-12-03 |
EP1392091A3 (en) | 2004-12-01 |
US7997680B2 (en) | 2011-08-16 |
US20100231637A1 (en) | 2010-09-16 |
US7549719B2 (en) | 2009-06-23 |
US20040196329A1 (en) | 2004-10-07 |
US7303244B2 (en) | 2007-12-04 |
US8104863B2 (en) | 2012-01-31 |
US7963628B2 (en) | 2011-06-21 |
EP1392091A2 (en) | 2004-02-25 |
US20100231636A1 (en) | 2010-09-16 |
JP4592267B2 (ja) | 2010-12-01 |
EP1392091B1 (en) | 2009-10-21 |
US20100231638A1 (en) | 2010-09-16 |
US7992958B2 (en) | 2011-08-09 |
US20090201325A1 (en) | 2009-08-13 |
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