JP4592267B2 - 印刷パターン形成方法、印刷システム、および、印刷システム操作方法 - Google Patents
印刷パターン形成方法、印刷システム、および、印刷システム操作方法 Download PDFInfo
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ink Jet (AREA)
- Dot-Matrix Printers And Others (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
Xact(n)=Xexp(n)+Sx(Xexp(n)-Xexp(0)) ・・・(1)
ここで、Xact(n)は、プリントヘッドにおけるn番目のエジェクタの実際のX軸位置であり、Xexp(n)は該n番目のエジェクタの設計上の(期待される)X軸位置であり、Xexp(0)は、プリントヘッドにおける基準エジェクタ(即ち、上述のプリントヘッドに対するカメラ位置の決定において使用されたエジェクタ)の設計上のX軸位置である。例えば、図19のグラフでは、Xexp(0)は図15及び図16におけるエジェクタ540(0)の設計上のX軸位置になる。同じように、傾きSyは、図20に示されるように、スポットの期待Y軸位置(Yexp)に対してプロットされる各スポットごとのY軸オフセットのグラフでの最適ラインに対して決定されることができる。傾きSyは、以下のようにエジェクタのY軸位置に対し補正ファクタを付与する。
Yact(n)=Yexp(n)+Sy(Yexp(n)-Yexp(0)) ・・・ (2)
ここで、Yact(n)はプリントヘッドにおけるn番目のエジェクタの実際のY軸位置であり、Yexp(n)は、該n番目のエジェクタの設計上の(期待される)Y軸位置であり、Yexp(0)は、基準エジェクタの設計上のY軸位置である。このように、エジェクタ位置への熱影響は効果的に補正できる。このプロセスは図21に示されるフローチャートのステップ801乃至807に要約される。
Claims (3)
- パターンレイアウトを複数の設計層に分割し、
前記複数の設計層の第1の設計層は前記パターンレイアウトの第1の複数のレイアウトエレメントを含み、該第1の複数のレイアウトエレメントのすべては第1の基準軸に平行であり、
前記複数の設計層の第2の設計層は前記パターンレイアウトの第2の複数のレイアウトエレメントを含み、該第2の複数のレイアウトエレメントのすべては前記第1の基準軸とは異なる第2の基準軸に平行であり、
前記第1の基準軸に位置合わせされる第1の印刷方向に基板を横切ってプリントヘッドで複数の印刷パスを形成することによって、該基板上に前記複数の設計層の前記第1の設計層を印刷するために第1の印刷動作を実行し、
前記第2の基準軸に位置合わせされる第2の印刷方向に基板を横切ってプリントヘッドで複数の印刷パスを形成することによって、該基板上に前記複数の設計層の前記第2の設計層を印刷するために第2の印刷動作を実行する、
プリントヘッドを有する印刷システムを用いてパターンレイアウトから印刷パターンを基板に形成するための方法。 - 基板を支持するためのステージと、
プリントヘッドと、
パターンの印刷中に第1の印刷方向に前記基板を横切って、前記プリントヘッドを移動させるように構成される第1の位置決め機構と、
パターンの印刷中に前記第1の印刷方向とは異なる第2の方向に前記基板を横切って、前記プリントヘッドを移動させるように構成される第2の位置決め機構と、
前記第1の位置決め機構、第2の位置決め機構、および前記プリントヘッドを制御するためのシステムコントローラと、
を含み、
前記システムコントローラが、
第1の設計層が前記パターンレイアウトの第1の複数のレイアウトエレメントを含み、該第1の複数のレイアウトエレメントのすべてが第1の基準軸に平行であるように、該パターンレイアウトから該第1の設計層を抽出するための論理と、
前記第1の基準軸が前記第1の印刷方向に位置合わせされるように前記第1の設計層を印刷するための論理と、
第2の設計層が前記パターンレイアウトの第2の複数のレイアウトエレメントを含み、該第2の複数のレイアウトエレメントのすべてが第2の基準軸に平行であるように、該パターンレイアウトから該第2の設計層を抽出するための論理と、
前記第2の基準軸が前記第2の印刷方向に位置合わせされるように前記第2の設計層を印刷するための論理と、
を有する、パターンレイアウトからのパターンを基板に印刷するための印刷システム。 - パターンレイアウトから印刷パターンを作成するために、プリントヘッドと、基板を支持するためのステージと、を含む印刷システムを操作するための方法であって、
前記プリントヘッドの前記ステージに対する位置を較正し、
前記パターンレイアウトを複数の設計層に分割し、
前記複数の設計層の第1の設計層は前記パターンレイアウトの第1の複数のレイアウトエレメントを含み、
前記第1の複数のレイアウトエレメントは第1の基準軸に平行であり、
前記第1の基準軸に位置合わせされる第1の印刷方向において、基板を横切ってプリントヘッドで複数の印刷パスを形成することによって、前記複数の設計層の前記第1の設計層を該基板上に印刷するために第1の印刷動作を実行し、
前記複数の設計層の第2の設計層は前記パターンレイアウトの第2の複数のレイアウトエレメントを含み、
前記第2の複数のレイアウトエレメントは前記第1の基準軸とは異なる第2の基準軸に平行であり、
前記第2の基準軸に位置合わせされる第2の印刷方向において、基板を横切ってプリントヘッドで複数の印刷パスを形成することによって、前記複数の設計層の前記第2の設計層を該基板上に印刷するために第2の印刷動作を実行する、
方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/224,701 US6890050B2 (en) | 2002-08-20 | 2002-08-20 | Method for the printing of homogeneous electronic material with a multi-ejector print head |
Publications (2)
Publication Number | Publication Date |
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JP2004080041A JP2004080041A (ja) | 2004-03-11 |
JP4592267B2 true JP4592267B2 (ja) | 2010-12-01 |
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Application Number | Title | Priority Date | Filing Date |
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JP2003293664A Expired - Fee Related JP4592267B2 (ja) | 2002-08-20 | 2003-08-15 | 印刷パターン形成方法、印刷システム、および、印刷システム操作方法 |
Country Status (4)
Country | Link |
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US (7) | US6890050B2 (ja) |
EP (1) | EP1392091B1 (ja) |
JP (1) | JP4592267B2 (ja) |
DE (1) | DE60329738D1 (ja) |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AUPQ130999A0 (en) * | 1999-06-30 | 1999-07-22 | Silverbrook Research Pty Ltd | A method and apparatus (IJ47V11) |
GB2379413A (en) * | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Printhead alignment method |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
US7559619B2 (en) * | 2002-08-20 | 2009-07-14 | Palo Alto Research Center Incorporated | Digital lithography using real time quality control |
US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
JP3693050B2 (ja) * | 2002-09-24 | 2005-09-07 | セイコーエプソン株式会社 | 印刷制御装置における印刷位置の調整 |
US7087444B2 (en) * | 2002-12-16 | 2006-08-08 | Palo Alto Research Center Incorporated | Method for integration of microelectronic components with microfluidic devices |
JP4689159B2 (ja) * | 2003-10-28 | 2011-05-25 | 株式会社半導体エネルギー研究所 | 液滴吐出システム |
US7309563B2 (en) * | 2003-12-19 | 2007-12-18 | Palo Alto Research Center Incorporated | Patterning using wax printing and lift off |
JP4419015B2 (ja) * | 2004-03-04 | 2010-02-24 | リコープリンティングシステムズ株式会社 | インクジェット塗布方法及び装置 |
CN1710489A (zh) * | 2004-06-18 | 2005-12-21 | 松下电器产业株式会社 | 药液涂敷装置及药液涂敷方法 |
US20060123194A1 (en) * | 2004-12-02 | 2006-06-08 | Claudio Alex Cukierkopf | Variable effective depth write buffer and methods thereof |
WO2006076609A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
WO2006076604A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
US20060176350A1 (en) * | 2005-01-14 | 2006-08-10 | Howarth James J | Replacement of passive electrical components |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076605A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Circuit modeling and selective deposition |
TW200642785A (en) | 2005-01-14 | 2006-12-16 | Cabot Corp | Metal nanoparticle compositions |
JP2006195863A (ja) * | 2005-01-17 | 2006-07-27 | Fujitsu Ten Ltd | エラー検出装置 |
TWI390735B (zh) | 2005-01-28 | 2013-03-21 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
TWI505473B (zh) * | 2005-01-28 | 2015-10-21 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
US7459400B2 (en) * | 2005-07-18 | 2008-12-02 | Palo Alto Research Center Incorporated | Patterned structures fabricated by printing mask over lift-off pattern |
JP5100070B2 (ja) * | 2005-09-22 | 2012-12-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7756600B2 (en) | 2005-09-22 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US20070068404A1 (en) * | 2005-09-29 | 2007-03-29 | Edwin Hirahara | Systems and methods for additive deposition of materials onto a substrate |
JP5455370B2 (ja) * | 2005-10-07 | 2014-03-26 | コーニンクレッカ フィリップス エヌ ヴェ | 基板上への物質の液滴の制御された位置決めのためのインクジェット装置、物質の液滴の制御された位置決めのための方法、印刷プロセス中の物質の変質を決定するための方法、及び、インクジェット装置の使用 |
US8637138B2 (en) | 2005-12-27 | 2014-01-28 | Palo Alto Research Center Incorporated | Layered structures on thin substrates |
US7816146B2 (en) * | 2005-12-27 | 2010-10-19 | Palo Alto Research Center Incorporated | Passive electronic devices |
US7784173B2 (en) * | 2005-12-27 | 2010-08-31 | Palo Alto Research Center Incorporated | Producing layered structures using printing |
US7365022B2 (en) * | 2006-01-20 | 2008-04-29 | Palo Alto Research Center Incorporated | Additive printed mask process and structures produced thereby |
US7498119B2 (en) * | 2006-01-20 | 2009-03-03 | Palo Alto Research Center Incorporated | Process for forming a feature by undercutting a printed mask |
JP5369367B2 (ja) * | 2006-03-28 | 2013-12-18 | 凸版印刷株式会社 | 薄膜トランジスタおよびその製造方法 |
US7384568B2 (en) * | 2006-03-31 | 2008-06-10 | Palo Alto Research Center Incorporated | Method of forming a darkfield etch mask |
US20070289467A1 (en) * | 2006-06-16 | 2007-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Direct printing lithography system and method |
US7347530B2 (en) * | 2006-06-22 | 2008-03-25 | Orbotech Ltd | Inkjet printing of color filters |
US7524015B2 (en) * | 2006-12-20 | 2009-04-28 | Palo Alto Research Center Incorporated | Method of printing smooth micro-scale features |
US8079656B2 (en) * | 2006-12-22 | 2011-12-20 | Palo Alto Research Center Incorporated | Method for decimation of images |
US7926900B2 (en) * | 2006-12-22 | 2011-04-19 | Palo Alto Research Center Incorporated | Method of printing with high spot placement accuracy |
US7835583B2 (en) * | 2006-12-22 | 2010-11-16 | Palo Alto Research Center Incorporated | Method of separating vertical and horizontal components of a rasterized image |
JP5371240B2 (ja) * | 2006-12-27 | 2013-12-18 | 株式会社半導体エネルギー研究所 | 配線の作製方法 |
US9164037B2 (en) * | 2007-01-26 | 2015-10-20 | Palo Alto Research Center Incorporated | Method and system for evaluation of signals received from spatially modulated excitation and emission to accurately determine particle positions and distances |
US8821799B2 (en) | 2007-01-26 | 2014-09-02 | Palo Alto Research Center Incorporated | Method and system implementing spatially modulated excitation or emission for particle characterization with enhanced sensitivity |
GB2446884B (en) * | 2007-02-20 | 2012-02-01 | Dtg Int Gmbh | Screen printing machine |
TWI327047B (en) * | 2007-03-21 | 2010-07-01 | Ind Tech Res Inst | Method for calculating ink-jet printing data |
US8968985B2 (en) * | 2007-03-30 | 2015-03-03 | Palo Alto Research Center Incorporated | Method and system for patterning a mask layer |
DE102007019073A1 (de) * | 2007-04-23 | 2008-11-06 | Ekra Automatisierungssysteme Gmbh Asys Group | Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate |
US7681986B2 (en) * | 2007-06-12 | 2010-03-23 | Applied Materials, Inc. | Methods and apparatus for depositing ink onto substrates |
US7955783B2 (en) * | 2007-11-09 | 2011-06-07 | Palo Alto Research Center Incorporated | Lamination for printed photomask |
US8551556B2 (en) * | 2007-11-20 | 2013-10-08 | Palo Alto Research Center Incorporated | Method for obtaining controlled sidewall profile in print-patterned structures |
US20090139868A1 (en) * | 2007-12-03 | 2009-06-04 | Palo Alto Research Center Incorporated | Method of Forming Conductive Lines and Similar Features |
US20090155732A1 (en) * | 2007-12-13 | 2009-06-18 | Palo Alto Research Center Incorporated | Method for Patterning Using Phase-Change Material |
US8765226B2 (en) | 2007-12-13 | 2014-07-01 | Palo Alto Research Center Incorporated | Method for patterning using phase-change material |
US8629981B2 (en) | 2008-02-01 | 2014-01-14 | Palo Alto Research Center Incorporated | Analyzers with time variation based on color-coded spatial modulation |
US8373860B2 (en) | 2008-02-01 | 2013-02-12 | Palo Alto Research Center Incorporated | Transmitting/reflecting emanating light with time variation |
US20100112220A1 (en) * | 2008-11-03 | 2010-05-06 | Molecular Imprints, Inc. | Dispense system set-up and characterization |
US20100214338A1 (en) * | 2009-02-26 | 2010-08-26 | Hewlett-Packard Development Company, L.P. | Compensation for thermal distortion in a printing system |
JP5251609B2 (ja) * | 2009-03-03 | 2013-07-31 | 株式会社リコー | 記録装置、制御方法及びプログラム |
JP5245943B2 (ja) * | 2009-03-13 | 2013-07-24 | 株式会社リコー | 記録装置、制御方法及びプログラム |
US8322811B2 (en) * | 2009-12-17 | 2012-12-04 | Ricoh Production Print Solutions LLC | Multi-pass calibration in fixed printhead array printers |
US9156204B2 (en) * | 2010-05-17 | 2015-10-13 | Synerdyne Corporation | Hybrid scanner fabricator |
WO2012037214A1 (en) | 2010-09-14 | 2012-03-22 | Ppg Industries Ohio, Inc. | Low density and high strength fiber glass for ballistic applications |
JP5923935B2 (ja) * | 2010-11-25 | 2016-05-25 | セイコーエプソン株式会社 | 液体吐出装置、及び、液体吐出方法 |
US9649811B2 (en) * | 2011-04-17 | 2017-05-16 | Stratasys Ltd. | System and method for additive manufacturing of an object |
US9029800B2 (en) | 2011-08-09 | 2015-05-12 | Palo Alto Research Center Incorporated | Compact analyzer with spatial modulation and multiple intensity modulated excitation sources |
US8723140B2 (en) | 2011-08-09 | 2014-05-13 | Palo Alto Research Center Incorporated | Particle analyzer with spatial modulation and long lifetime bioprobes |
US20130084404A1 (en) * | 2011-09-30 | 2013-04-04 | Semes Co., Ltd. | Apparatuses and methods for treating substrate |
US20130136850A1 (en) * | 2011-11-29 | 2013-05-30 | Illinois Tool Works Inc. | Method for depositing materials on a substrate |
US20130133574A1 (en) * | 2011-11-29 | 2013-05-30 | Illinois Tool Works Inc. | Material deposition system for depositing materials on a substrate |
MY168052A (en) * | 2012-01-02 | 2018-10-11 | Mutracx Int B V | Inkjetsystem for printing a printed circuit board |
NL2008066C2 (en) * | 2012-01-02 | 2013-07-03 | Mutracx B V | Method and inkjet system for printing an ink pattern on a substrate. |
CN103386821A (zh) * | 2012-05-11 | 2013-11-13 | 四川优的科技有限公司 | 流水线打标信息采集*** |
WO2014024627A1 (ja) * | 2012-08-06 | 2014-02-13 | シャープ株式会社 | 発光装置および発光装置の製造方法 |
US9411779B2 (en) * | 2012-09-28 | 2016-08-09 | Illinois Tool Works Inc. | Method of dispensing material based on edge detection |
KR20140093109A (ko) * | 2013-01-17 | 2014-07-25 | 삼성디스플레이 주식회사 | 인쇄 장치 |
US9591268B2 (en) * | 2013-03-15 | 2017-03-07 | Qiagen Waltham, Inc. | Flow cell alignment methods and systems |
US20150104562A1 (en) * | 2013-10-10 | 2015-04-16 | Omega Optics, Inc. | Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems |
JP2014064022A (ja) * | 2013-11-11 | 2014-04-10 | Canon Inc | インプリント装置 |
WO2015081347A1 (en) | 2013-11-29 | 2015-06-04 | Michael Knox | Apparatus and method for the manufacturing of printed wiring boards and component attachment |
US10548231B2 (en) | 2013-11-29 | 2020-01-28 | Botfactory Inc. | Apparatus for depositing conductive and nonconductive material to form a printed circuit |
WO2015095991A1 (zh) * | 2013-12-23 | 2015-07-02 | 北京美科艺数码科技发展有限公司 | 喷墨打印装置及打印方法 |
US10082417B2 (en) * | 2013-12-30 | 2018-09-25 | Nordson Corporation | Calibration methods for a viscous fluid dispensing system |
WO2015107789A1 (ja) * | 2014-01-16 | 2015-07-23 | コニカミノルタ株式会社 | 二次元画像形成装置、三次元造形装置、二次元画像形成方法および三次元造形方法 |
CN106457304B (zh) | 2014-06-17 | 2021-03-02 | 科迪华公司 | 打印***组件和方法 |
CN104376178A (zh) * | 2014-11-25 | 2015-02-25 | 中国兵器工业集团第二一四研究所苏州研发中心 | 一种集成电路布图登记所需图层的制作方法 |
US9991412B2 (en) * | 2014-12-05 | 2018-06-05 | Solarcity Corporation | Systems for precision application of conductive adhesive paste on photovoltaic structures |
US9899546B2 (en) | 2014-12-05 | 2018-02-20 | Tesla, Inc. | Photovoltaic cells with electrodes adapted to house conductive paste |
US10386799B2 (en) | 2015-05-05 | 2019-08-20 | Palo Alto Research Center Incorporated | Method and system for defining a 3D printed object |
US9566799B1 (en) * | 2015-10-14 | 2017-02-14 | Funai Electric Co., Ltd. (Jp) | Imaging apparatus and method for reducing banding |
WO2018022034A1 (en) | 2016-07-27 | 2018-02-01 | Hewlett-Packard Development Company, L.P. | Forming three-dimensional (3d) electronic parts |
CN106739501B (zh) * | 2017-02-03 | 2018-06-29 | 盐城工学院 | 一种喷印机及印制电路板喷印*** |
US10946411B2 (en) * | 2018-01-15 | 2021-03-16 | Tokyo Electron Limited | System and method for fluid dispense and coverage control |
CN110065317A (zh) * | 2019-04-29 | 2019-07-30 | 南通东川数码科技有限公司 | 一种自打印光栅定位***及打印方法 |
CN114683729B (zh) * | 2022-06-01 | 2022-08-26 | 芯体素(杭州)科技发展有限公司 | 一种Mini-LED背光板反射层的打印方法及装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09300664A (ja) * | 1996-05-15 | 1997-11-25 | Canon Inc | カラーフィルタの製造方法及び製造装置及びカラーフィルタ及び表示装置及びこの表示装置を備えた装置及びプリント方法 |
JPH11274671A (ja) * | 1998-03-25 | 1999-10-08 | Seiko Epson Corp | 電気回路、その製造方法および電気回路製造装置 |
DE19842379A1 (de) * | 1998-09-16 | 2000-05-11 | Tron Elektronik Gmbh F | Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen |
JP2000202357A (ja) * | 1998-04-24 | 2000-07-25 | Cambridge Display Technol Ltd | 高分子膜の選択的付着方法 |
JP2002225259A (ja) * | 2000-11-21 | 2002-08-14 | Seiko Epson Corp | 材料の吐出方法、及び吐出装置、カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、el装置の製造方法及び製造装置、並びに電子機器 |
JP2002273868A (ja) * | 2001-01-15 | 2002-09-25 | Seiko Epson Corp | 材料の吐出装置、及び吐出方法、カラーフィルタの製造装置及び製造方法、液晶装置の製造装置及び製造方法、el装置の製造装置及び製造方法、並びにそれら方法により製造される電子機器 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2839534B2 (ja) | 1989-02-28 | 1998-12-16 | 株式会社東芝 | 印刷機および印刷方法 |
US5689428A (en) * | 1990-09-28 | 1997-11-18 | Texas Instruments Incorporated | Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture |
US5250956A (en) * | 1991-10-31 | 1993-10-05 | Hewlett-Packard Company | Print cartridge bidirectional alignment in carriage axis |
US5404020A (en) * | 1993-04-30 | 1995-04-04 | Hewlett-Packard Company | Phase plate design for aligning multiple inkjet cartridges by scanning a reference pattern |
FR2708233B1 (fr) | 1993-07-27 | 1995-09-01 | Matra Communication | Procédé et dispositif d'impression par points. |
JPH07276630A (ja) * | 1994-04-12 | 1995-10-24 | Rohm Co Ltd | インクジェットプリントヘッド及びインクジェットプリンタ |
US5984470A (en) * | 1995-04-20 | 1999-11-16 | Canon Kabushiki Kaisha | Apparatus for producing color filter with alignment error detection |
JPH09234862A (ja) * | 1995-12-26 | 1997-09-09 | Seiko Epson Corp | インクジェットプリンタ及びその駆動方法 |
JPH1134303A (ja) * | 1997-07-15 | 1999-02-09 | Brother Ind Ltd | 記録装置 |
US6273538B1 (en) * | 1997-09-12 | 2001-08-14 | Citizen Watch Co., Ltd. | Method of driving ink-jet head |
US6109722A (en) * | 1997-11-17 | 2000-08-29 | Hewlett-Packard Company | Ink jet printing system with pen alignment and method |
JP4028067B2 (ja) | 1998-02-26 | 2007-12-26 | 東芝テック株式会社 | 記録ヘッドの駆動方法 |
US6786563B1 (en) * | 2001-04-18 | 2004-09-07 | Elesys, Inc. | Interleaving apparatus and methods for radial printing |
US6158344A (en) * | 1998-12-03 | 2000-12-12 | Hewlett-Packard Company | Linefeed calibration using an integrated optical sensor |
US6328418B1 (en) * | 1999-08-11 | 2001-12-11 | Hitachi Koki Co., Ltd | Print head having array of printing elements for printer |
US6386671B1 (en) | 1999-12-29 | 2002-05-14 | Hewlett-Packard Company | Orientation independent indicia for print media |
JP3645776B2 (ja) * | 2000-02-24 | 2005-05-11 | 武藤工業株式会社 | インクジェットプリンタ |
US6460958B2 (en) * | 2000-02-29 | 2002-10-08 | Minolta Co., Ltd. | Three-dimensional object printing apparatus and method |
WO2002003322A1 (de) | 2000-07-03 | 2002-01-10 | Isa Conductive Microsystems Gmbh | Verfahren zum herstellen eines kartenförmigen datenträgers und vorrichtung zur durchführung des verfahrens |
JP4182657B2 (ja) * | 2000-10-17 | 2008-11-19 | セイコーエプソン株式会社 | インクジェット式記録装置 |
US6478401B1 (en) * | 2001-07-06 | 2002-11-12 | Lexmark International, Inc. | Method for determining vertical misalignment between printer print heads |
US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
-
2002
- 2002-08-20 US US10/224,701 patent/US6890050B2/en not_active Expired - Lifetime
-
2003
- 2003-08-15 DE DE60329738T patent/DE60329738D1/de not_active Expired - Lifetime
- 2003-08-15 JP JP2003293664A patent/JP4592267B2/ja not_active Expired - Fee Related
- 2003-08-15 EP EP03255073A patent/EP1392091B1/en not_active Expired - Lifetime
-
2004
- 2004-04-15 US US10/824,994 patent/US7303244B2/en not_active Expired - Lifetime
- 2004-12-20 US US11/019,038 patent/US7549719B2/en not_active Expired - Lifetime
-
2009
- 2009-04-22 US US12/428,326 patent/US7963628B2/en not_active Expired - Fee Related
-
2010
- 2010-05-25 US US12/787,371 patent/US7997680B2/en not_active Expired - Fee Related
- 2010-05-25 US US12/787,367 patent/US7992958B2/en not_active Expired - Fee Related
- 2010-05-25 US US12/787,362 patent/US8104863B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09300664A (ja) * | 1996-05-15 | 1997-11-25 | Canon Inc | カラーフィルタの製造方法及び製造装置及びカラーフィルタ及び表示装置及びこの表示装置を備えた装置及びプリント方法 |
JPH11274671A (ja) * | 1998-03-25 | 1999-10-08 | Seiko Epson Corp | 電気回路、その製造方法および電気回路製造装置 |
JP2000202357A (ja) * | 1998-04-24 | 2000-07-25 | Cambridge Display Technol Ltd | 高分子膜の選択的付着方法 |
DE19842379A1 (de) * | 1998-09-16 | 2000-05-11 | Tron Elektronik Gmbh F | Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen |
JP2002225259A (ja) * | 2000-11-21 | 2002-08-14 | Seiko Epson Corp | 材料の吐出方法、及び吐出装置、カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、el装置の製造方法及び製造装置、並びに電子機器 |
JP2002273868A (ja) * | 2001-01-15 | 2002-09-25 | Seiko Epson Corp | 材料の吐出装置、及び吐出方法、カラーフィルタの製造装置及び製造方法、液晶装置の製造装置及び製造方法、el装置の製造装置及び製造方法、並びにそれら方法により製造される電子機器 |
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US7997680B2 (en) | 2011-08-16 |
EP1392091B1 (en) | 2009-10-21 |
US20090201325A1 (en) | 2009-08-13 |
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US7303244B2 (en) | 2007-12-04 |
JP2004080041A (ja) | 2004-03-11 |
US7963628B2 (en) | 2011-06-21 |
US20040036731A1 (en) | 2004-02-26 |
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US7549719B2 (en) | 2009-06-23 |
EP1392091A3 (en) | 2004-12-01 |
US8104863B2 (en) | 2012-01-31 |
US20100231638A1 (en) | 2010-09-16 |
DE60329738D1 (de) | 2009-12-03 |
EP1392091A2 (en) | 2004-02-25 |
US20100231637A1 (en) | 2010-09-16 |
US7992958B2 (en) | 2011-08-09 |
US6890050B2 (en) | 2005-05-10 |
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