JP2002075052A - Conductive resin composition and sheet - Google Patents
Conductive resin composition and sheetInfo
- Publication number
- JP2002075052A JP2002075052A JP2000262307A JP2000262307A JP2002075052A JP 2002075052 A JP2002075052 A JP 2002075052A JP 2000262307 A JP2000262307 A JP 2000262307A JP 2000262307 A JP2000262307 A JP 2000262307A JP 2002075052 A JP2002075052 A JP 2002075052A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- sheet
- melting point
- metal
- melt tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、極めて高度の導電
性及び優れた押出成形性を有する導電性樹脂組成物及び
それを押出成形してなる導電性シートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive resin composition having extremely high conductivity and excellent extrudability, and a conductive sheet obtained by extruding the composition.
【０００２】[0002]
【従来の技術】従来、各種樹脂からなる成形品に導電性
を付与した導電性樹脂成形品として、合成樹脂に導電性
フィラーを分散、混合した複合材料を用い成形した成形
品が知られている。導電性フィラーとして金属系、カー
ボン系などが使用されているが、高度の導電性を付与す
るには導電性フィラーの添加量を大幅に増加せざるを得
なく、その結果、成形性の悪化や、脆弱となり機械的強
度が低下するため添加量は制限され、得られる成形品の
導電性も体積固有抵抗値で１０−１Ω・ｃｍが限界であ
った。また、近年では特開平１０−２３７３３１号のよ
うにハンダを樹脂中に高度に分散させた系により体積固
有抵抗値１０−３Ω・ｃｍ以下を実現しているが、溶融
物は脆弱であり射出成形は可能であるが、押出成形やカ
レンダー成形は不可能であった。2. Description of the Related Art Conventionally, as a conductive resin molded article obtained by imparting conductivity to a molded article made of various resins, a molded article formed by using a composite material in which a conductive filler is dispersed and mixed in a synthetic resin is known. . Metal-based, carbon-based, etc. are used as conductive fillers, but in order to impart a high degree of conductivity, the amount of conductive fillers must be increased significantly, resulting in deterioration of moldability and In addition, the amount of addition was limited due to the brittleness and the decrease in mechanical strength, and the conductivity of the resulting molded product was limited to 10 -1 Ω · cm in terms of volume resistivity. In recent years, a system in which solder is highly dispersed in resin as in Japanese Patent Application Laid-Open No. Hei 10-237331 has realized a volume resistivity value of 10 −3 Ω · cm or less. Molding was possible, but extrusion molding and calendar molding were not possible.
【０００３】[0003]
【発明が解決しようとする課題】そこで、極めて高度の
導電性を有するとともに押出成形性に優れた導電性樹脂
組成物が求められていた。Therefore, there has been a demand for a conductive resin composition having an extremely high conductivity and excellent extrudability.
【０００４】[0004]
【課題を解決するための手段】本発明者は上記課題を解
決すべく鋭意検討した結果、本発明を完成するに至っっ
た。即ち本発明の要旨は、（ａ）熱可塑性樹脂あるいは
熱可塑性エラストマーを基質とし、これに（ｂ）融点が
３００℃以下の低融点金属、及び（ｃ）金属粉末を混合
してなり、溶融時の溶融張力が０．３〜１５ｇの樹脂組
成物及びそれを押出成形することで得られる導電性樹脂
シートにある。本発明の好ましい実施態様としては、
（ｂ）成分の低融点金属が、Ｐｂ／Ｓｎ、Ｐｂ／Ｓｎ／
Ｂｉ、Ｐｂ／Ｓｎ／Ａｇ、 Ｐｂ／Ａｇ、 Ｓｎ／Ａｇ、 Ｓ
ｎ／Ｂｉ、Ｓｎ／Ｃｕ、Ｓｎ／Ｚｎ系から選ばれた低融
点合金からなること、及び（ｃ）成分の金属粉末がＣ
ｕ、Ｎｉ、Ａｌ、Ｃｒ及びそれらの合金粉末からなり、
その平均粒径が１〜５０μｍの範囲であることを含んで
いる。The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, completed the present invention. That is, the gist of the present invention is that (a) a thermoplastic resin or a thermoplastic elastomer is used as a substrate, and (b) a low melting point metal having a melting point of 300 ° C. or less and (c) a metal powder are mixed. And a conductive resin sheet obtained by extruding the resin composition having a melt tension of 0.3 to 15 g. As a preferred embodiment of the present invention,
The low melting point metal of the component (b) is Pb / Sn, Pb / Sn /
Bi, Pb / Sn / Ag, Pb / Ag, Sn / Ag, S
n / Bi, Sn / Cu, Sn / Zn based low melting point alloy, and (c) component metal powder is C
u, Ni, Al, Cr and their alloy powders,
The average particle size is in the range of 1 to 50 μm.
【０００５】[0005]
【発明の実施の形態】以下、本発明を詳しく説明する。
本発明の導電性樹脂組成物及びシート、成形品は、その
材料が（ａ）熱可塑性樹脂あるいは熱可塑性エラストマ
ー、（ｂ）融点が３００℃以下の低融点金属、及び
（ｃ）金属粉末の混合物（以下、「混合材」という）か
らなり、溶融時の溶融張力（メルトテンション）が０．
３〜１５ｇであることに特徴がある。このように熱可塑
性樹脂あるいは熱可塑性エラストマーと導電性を付与す
るための金属成分を特定の組合せとすることにより、極
めて高度の導電性と他の特性をバランス良く付与できる
ことを見出し、さらに溶融張力向上剤などの添加により
溶融張力を０．３〜１５ｇの範囲に調整することによ
り、優れた押出成形性をも発現させたものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
The conductive resin composition, sheet and molded article of the present invention are a mixture of (a) a thermoplastic resin or a thermoplastic elastomer, (b) a low melting point metal having a melting point of 300 ° C. or less, and (c) a metal powder. (Hereinafter, referred to as a “mixed material”), and has a melt tension (melt tension) of 0.
It is characterized by being 3 to 15 g. By using a specific combination of a thermoplastic resin or a thermoplastic elastomer and a metal component for imparting conductivity in this way, it has been found that a very high degree of conductivity and other properties can be imparted in a well-balanced manner. By adjusting the melt tension to a range of 0.3 to 15 g by adding an agent or the like, excellent extrudability is also exhibited.
【０００６】混合材に用いられる（ａ）熱可塑性樹脂あ
るいは熱可塑性エラストマーとしては、オレフィン系、
スチレン系、塩ビ系、ウレタン系、エステル系、アミド
系など種々のタイプのものが使用可能である。押出シー
ト化やカレンダー成形においては軟質系のものが好適で
ある。As the thermoplastic resin or thermoplastic elastomer (a) used in the mixture, olefin-based thermoplastic resins and thermoplastic elastomers are used.
Various types such as styrene, PVC, urethane, ester, and amide can be used. In extrusion sheeting and calendering, soft materials are preferred.
【０００７】（ｂ）の融点が３００℃以下の低融点金属
には各種のものが使用できる。融点の測定方法は示差走
査熱量測定法（ＤＳＣ）に示差走査熱量測定法（ＤＳ
Ｃ）ににより測定すればよく、融点が３００℃を越える
金属では成形性が劣るという問題がある。具体的にはＰ
ｂ／Ｓｎ、Ｐｂ／Ｓｎ／Ｂｉ、Ｐｂ／Ｓｎ／Ａｇ、 Ｐｂ
／Ａｇ、Ｓｎ／Ａｇ、 Ｓｎ／Ｂｉ、Ｓｎ／Ｃｕ、Ｓｎ／
Ｚｎ系から選ばれたハンダ合金が好適に使用できる。
（ｃ）成分の金属粉末は上記低融点金属の分散助剤とな
るものであり、Ｃｕ、Ｎｉ、Ａｌ、Ｃｒ及びそれらの合
金粉末が好適に使用でき、その平均粒径が１〜５０μｍ
の範囲のものが好ましい。平均粒径は試料を透過型電子
顕微鏡により撮影し、写真から求めた数平均粒子径であ
る。平均粒径が１μｍ未満では混合の際のハンドリング
が困難であり、また５０μｍを越えるものでは分散性が
低下し易い傾向がある。Various metals can be used as the low-melting metal (b) having a melting point of 300 ° C. or lower. The melting point can be measured by the differential scanning calorimetry (DSC).
The measurement may be performed according to C), and there is a problem that a metal having a melting point exceeding 300 ° C. has poor moldability. Specifically, P
b / Sn, Pb / Sn / Bi, Pb / Sn / Ag, Pb
/ Ag, Sn / Ag, Sn / Bi, Sn / Cu, Sn /
A solder alloy selected from Zn-based can be suitably used.
The metal powder of the component (c) serves as a dispersing aid for the low-melting-point metal, and Cu, Ni, Al, Cr and alloy powders thereof can be suitably used, and the average particle size is 1 to 50 μm.
Are preferred. The average particle diameter is a number average particle diameter obtained by photographing a sample with a transmission electron microscope and obtaining the photograph. When the average particle size is less than 1 μm, handling during mixing is difficult, and when the average particle size exceeds 50 μm, the dispersibility tends to decrease.
【０００８】本発明では上記樹脂組成物の溶融時の溶融
張力は、０．３〜１５ｇに限定され、好ましくは０．５
〜１０ｇの範囲である。小さ過ぎると、押出した際にシ
ートが切れ易く、シートへの成形が困難となる。一方、
大き過ぎると、樹脂組成物の押出金型と冷却ロールとの
間で延展性が不足して押出特性が低下し、シートとした
際に表面がサメ肌状になるという問題がある。In the present invention, the melt tension of the above resin composition at the time of melting is limited to 0.3 to 15 g, preferably 0.5 to 15 g.
The range is from 10 to 10 g. If it is too small, the sheet tends to break when extruded, making it difficult to form the sheet. on the other hand,
If it is too large, there is a problem that the extensibility between the extrusion die of the resin composition and the cooling roll is insufficient, the extrusion characteristics are reduced, and the surface becomes shark-like when formed into a sheet.
【０００９】本発明でいう溶融張力は、溶融張力測定装
置（メーカー：東洋精機製作所製「キャピログラフ １
Ｂ」）にて測定した値であり、測定装置のキャピラリー
から出る溶融樹脂を１０ｍ／ｍｉｎで引取った際の樹脂
の張力を溶融張力としている。In the present invention, the melt tension is measured by a melt tension measuring device (manufactured by Toyo Seiki Seisaku-sho, “Capillograph 1”).
B "), and the tension of the resin when the molten resin coming out of the capillary of the measuring device is taken at 10 m / min is defined as the melt tension.
【００１０】ここで、前述した組成物に適宜溶融張力向
上剤などを添加し、樹脂組成物の溶融張力が０．３〜１
５ｇになるように調整する必要がある。適宜用いられる
溶融張力向上剤は、ポリテトラフルオロエチレン及び炭
素数５〜３０のアルキル（メタ）アクリレート系ポリマ
ーからなる組成物などがあり、混合剤の溶融時の張力を
向上させ、押出やカレンダー加工時の引き取り性を改良
する。市販のものとしては三菱レイヨン（株）製の「メ
タブレンＡ−３０００」などが知られている。Here, a melt tension improver or the like is appropriately added to the above-mentioned composition, and the melt tension of the resin composition is 0.3 to 1
It needs to be adjusted to 5 g. Suitable melt tension improvers include compositions composed of polytetrafluoroethylene and an alkyl (meth) acrylate polymer having 5 to 30 carbon atoms, and the like. The melt tension enhancer improves the tension of the mixture during melting, and is extruded or calendered. Improve time take-back. As a commercially available product, “METABLEN A-3000” manufactured by Mitsubishi Rayon Co., Ltd. is known.
【００１１】本発明の導電性樹脂組成物の製造方法は、
上記混合材の各成分を用い、混合したものを所定の温度
でニーダや二軸押出機等の混練機により混練後、造粒し
たものである。混練においては（ｃ）低融点金属が半溶
融状態となる温度が好ましく、マトリックスとなる熱可
塑性樹脂や熱可塑性エラストマーの溶融温度に応じて適
切な金属組成を選択し、低融点金属と分散助剤となる銅
粉、ニッケル粉末等の添加比率を適宜選択する必要があ
る。以上の方法で得られた造粒物は、十分な溶融張力を
有する事からＴダイ押出成形機やカレンダーによりシー
ト化が可能である。本発明にいうシートとは比較的肉厚
の薄い、１００μｍ程度のフイルムも含んでいる。The method for producing the conductive resin composition of the present invention comprises:
The mixture is kneaded with a kneader such as a kneader or a twin-screw extruder at a predetermined temperature using the components of the mixed material, and then granulated. In kneading, (c) a temperature at which the low-melting-point metal is in a semi-molten state is preferable. An appropriate metal composition is selected according to the melting temperature of the thermoplastic resin or the thermoplastic elastomer serving as a matrix. It is necessary to appropriately select the addition ratio of the copper powder, the nickel powder, and the like to be used. Since the granulated product obtained by the above method has a sufficient melt tension, it can be formed into a sheet by a T-die extruder or a calender. The sheet according to the present invention includes a relatively thin film of about 100 μm.
【００１２】以上述べたように、本発明の導電性シート
は、熱可塑性樹脂あるいは熱可塑性エラストマーに低融
点金属が含有されていることから、極めて高度の導電性
を有する一方で、適当な溶融張力となっているため、溶
融物が脆弱にならず、押出成形性に優れており、導電性
隔壁、導電性部材、帯電防止材、電磁波シールド材、電
極、コネクター、センサー、発熱体等の幅広い分野への
適用が可能である。As described above, the conductive sheet of the present invention has an extremely high conductivity because the thermoplastic resin or the thermoplastic elastomer contains a low melting point metal, while having an appropriate melt tension. The extrudability is excellent because the melt does not become brittle and has a wide range of fields such as conductive partitions, conductive members, antistatic materials, electromagnetic wave shielding materials, electrodes, connectors, sensors, and heating elements. It can be applied to
【００１３】[0013]
【実施例】以下、実施例について説明するが、本発明は
これに限定されるものではない。 （実施例）熱可塑性エラストマーとして「サントプレン
２０３−４０」／ＡＥＳジャパン社製、界面接着改質剤
として酸変成ポリオレフィン（「アドテックスＥＲ３２
０Ｐ」日本ポリオレフィン（株）製）を用い、低融点金
属として鉛フリーハンダ（Ｓｎ−４Ｃｕ−２Ｎｉ 融点
固相線２２５℃−液相線４８０℃）、金属粉末として
平均粒径１０μｍの銅粉を用いた。また溶融張力向上剤
として「メタブレンＡ−３０００」（三菱レイヨン
（株）製）を用いた。表１に示す配合比の各原料粉末を
混練機（森山製作所製、２軸加圧タイプ）を用いて溶融
混練後、プランジャー押出造粒機を用いて低融点金属含
有樹脂ペレットを作成した。得られたペレットの溶融張
力の測定を行うとともに、押出シート化テストを行っ
た。The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited thereto. (Example) "Santoprene 203-40" as a thermoplastic elastomer / manufactured by AES Japan, and an acid-modified polyolefin ("Adtex ER32") as an interfacial adhesion modifier
0P "manufactured by Nippon Polyolefin Co., Ltd., using lead-free solder (Sn-4Cu-2Ni melting point, solidus 225 ° C-liquidus 480 ° C) as a low melting point metal, and copper powder having an average particle diameter of 10 µm as a metal powder. Using. "METABLEN A-3000" (manufactured by Mitsubishi Rayon Co., Ltd.) was used as a melt tension improver. The respective raw material powders having the compounding ratios shown in Table 1 were melt-kneaded using a kneading machine (Moriyama Seisakusho, biaxial pressing type), and then a low-melting-point metal-containing resin pellet was prepared using a plunger extrusion granulator. The melt tension of the obtained pellets was measured, and an extruded sheeting test was performed.
【００１４】溶融張力の測定は、東洋精機製作所製「キ
ャピログラフ １Ｂ」を使用して樹脂温度２００℃、引
取速度１０ｍ／ｍｉｎ、ノズル径２．０９ｍｍφ、ノズ
ル長さ８ｍｍで溶融延伸し、測定した。The melt tension was measured by using a "Capillograph 1B" manufactured by Toyo Seiki Seisaku-sho, Ltd., at a resin temperature of 200.degree.
【００１５】１５０ｍｍ幅コートハンガーダイを具備し
た２軸押出機φ２５（東洋精機 ２Ｄ２５ＷＳ）を用い
て肉厚０．５ｍｍの押出シート化を行った。押出条件
は、シリンダー温度 ２００℃、スクリュ回転数５０
ｒ．ｐ．ｍ．、供給量２４５ｇ／ｍｉｎとした。得られ
たシートを目視で観察し、表面が平滑であった場合を
○、表面が平滑でなく、サメ肌状に荒れていた場合、或
いは上手く引き取れずにシートが切断された場合を×と
した。An extruded sheet having a thickness of 0.5 mm was formed using a twin-screw extruder φ25 (Toyo Seiki 2D25WS) equipped with a coat hanger die of 150 mm width. Extrusion conditions were as follows: cylinder temperature 200 ° C, screw rotation speed 50
r. p. m. And the supply amount was 245 g / min. The obtained sheet was visually observed, and the case where the surface was smooth was evaluated as ○, and the case where the surface was not smooth and rough like a shark skin, or the case where the sheet was cut without being pulled off well was evaluated as ×. .
【００１６】（比較例）表１に示す配合比を用いた以外
は、実施例と全く同様にシートを作成した。(Comparative Example) A sheet was prepared in exactly the same manner as in Example except that the compounding ratio shown in Table 1 was used.
【００１７】[0017]
【表１】 [Table 1]
【００１８】表１の結果から明らかなように本発明の組
成物は、成形性が大幅に改善され、得られたシートにお
いても優れた導電性を維持していることが分かる。As is evident from the results in Table 1, the composition of the present invention has greatly improved moldability and maintains excellent conductivity in the obtained sheet.
【００１９】[0019]
【発明の効果】上述したように、本発明の導電性樹脂組
成物は、熱可塑性樹脂あるいは熱可塑性エラストマーに
低融点金属が含有されていることから、極めて高度の導
電性を示し、さらに溶融張力向上剤を添加することによ
り優れた押出成形性も得られ、導電性隔壁、導電性部
材、帯電防止材、電磁波シールド材、電極、コネクタ
ー、センサー、発熱体などの幅広い分野への適用が可能
である。As described above, since the conductive resin composition of the present invention contains a low melting point metal in a thermoplastic resin or a thermoplastic elastomer, it exhibits extremely high conductivity, and further has a high melt tension. Excellent extrudability can be obtained by adding an enhancer, and it can be applied to a wide range of fields such as conductive partition walls, conductive members, antistatic materials, electromagnetic wave shielding materials, electrodes, connectors, sensors, and heating elements. is there.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｌ 101/00 Ｃ０８Ｌ 101/00 Ｈ０１Ｂ 1/00 Ｈ０１Ｂ 1/00 Ｌ Ｈ０１Ｒ 11/01 ５０１ Ｈ０１Ｒ 11/01 ５０１Ｚ Ｈ０５Ｋ 9/00 Ｈ０５Ｋ 9/00 Ｘ Ｆターム(参考） 4F071 AA14 AA22 AA24 AA43 AA53 AA54 AB06 AB07 AB08 AB09 AB12 AH12 BA01 BB04 BB06 BC01 4J002 BB001 BC021 BD031 CF001 CK021 CL001 DA077 DA087 DA097 DA117 DC006 DC007 FD200 GQ02 5E321 BB32 BB60 GG01 GG05 5G301 DA02 DA03 DA06 DA13 DA15 DA42 DD08 DD10 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) C08L 101/00 C08L 101/00 H01B 1/00 H01B 1/00 L H01R 11/01 501 H01R 11/01 501Z H05K 9/00 H05K 9/00 X F-term (reference) 4F071 AA14 AA22 AA24 AA43 AA53 AA54 AB06 AB07 AB08 AB09 AB12 AH12 BA01 BB04 BB06 BC01 4J002 BB001 BC021 BD031 CF001 CK021 CL001 DA077 DA087 DA097 DA117 DC01 DC001 GG05 5G301 DA02 DA03 DA06 DA13 DA15 DA42 DD08 DD10
Claims (4)
ラストマーを基質とし、これに（ｂ）融点が３００℃以
下の低融点金属、及び（ｃ）金属粉末を混合してなり、
溶融時の溶融張力が０．３〜１５ｇの導電性樹脂組成
物。1. A mixture comprising (a) a thermoplastic resin or a thermoplastic elastomer as a substrate, (b) a low-melting metal having a melting point of 300 ° C. or less, and (c) a metal powder,
A conductive resin composition having a melt tension at the time of melting of 0.3 to 15 g.
てなる導電性シート。2. A conductive sheet obtained by extruding the resin composition according to claim 1.
ｎ、Ｐｂ／Ｓｎ／Ｂｉ、Ｐｂ／Ｓｎ／Ａｇ、 Ｐｂ／Ａ
ｇ、 Ｓｎ／Ａｇ、 Ｓｎ／Ｂｉ、Ｓｎ／Ｃｕ、Ｓｎ／Ｚｎ
系から選ばれた低融点合金からなることを特徴とする請
求項１乃至２記載の樹脂組成物及び導電性シート。3. The low melting point metal of component (b) is Pb / S
n, Pb / Sn / Bi, Pb / Sn / Ag, Pb / A
g, Sn / Ag, Sn / Bi, Sn / Cu, Sn / Zn
The resin composition and the conductive sheet according to claim 1, wherein the resin composition is made of a low melting point alloy selected from a series.
ｌ、Ｃｒ及びそれらの合金粉末からなり、その平均粒径
が１〜５０μｍの範囲であることを特徴とする請求項１
乃至４記載の樹脂組成物及び導電性シート。4. The metal powder of component (c) is Cu, Ni, A
2. The powder of claim 1, wherein said powder is made of l, Cr or an alloy powder thereof, and has an average particle diameter in the range of 1 to 50 μm.
5. The resin composition and the conductive sheet according to items 4 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000262307A JP2002075052A (en) | 2000-08-31 | 2000-08-31 | Conductive resin composition and sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000262307A JP2002075052A (en) | 2000-08-31 | 2000-08-31 | Conductive resin composition and sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002075052A true JP2002075052A (en) | 2002-03-15 |
Family
ID=18750005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000262307A Pending JP2002075052A (en) | 2000-08-31 | 2000-08-31 | Conductive resin composition and sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002075052A (en) |
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| WO2009098938A1 (en) * | 2008-02-06 | 2009-08-13 | Namics Corporation | Thermosetting conductive paste and laminated ceramic electronic component possessing external electrodes formed using same. |
| JP5390408B2 (en) * | 2008-02-06 | 2014-01-15 | ナミックス株式会社 | Thermosetting conductive paste and multilayer ceramic electronic component having external electrodes formed using the same |
| KR101559605B1 (en) | 2008-02-06 | 2015-10-13 | 나믹스 가부시끼가이샤 | Thermosetting conductive paste and laminated ceramic electronic component possessing external electrodes formed using same |
| US20100326976A1 (en) * | 2008-02-18 | 2010-12-30 | Panasonic Corporation | Polymer heating element |
| US8519305B2 (en) * | 2008-02-18 | 2013-08-27 | Panasonic Corporation | Polymer heating element |
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| US11955742B2 (en) | 2015-07-07 | 2024-04-09 | Amphenol Fci Asia Pte. Ltd. | Electrical connector with cavity between terminals |
| US11539171B2 (en) | 2016-08-23 | 2022-12-27 | Amphenol Corporation | Connector configurable for high performance |
| US11757215B2 (en) | 2018-09-26 | 2023-09-12 | Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. | High speed electrical connector and printed circuit board thereof |
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