JPS6212257B2 - - Google Patents
Info
- Publication number
- JPS6212257B2 JPS6212257B2 JP5597278A JP5597278A JPS6212257B2 JP S6212257 B2 JPS6212257 B2 JP S6212257B2 JP 5597278 A JP5597278 A JP 5597278A JP 5597278 A JP5597278 A JP 5597278A JP S6212257 B2 JPS6212257 B2 JP S6212257B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- weight
- plasticizer
- polyamide resin
- nitrile rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004014 plasticizer Substances 0.000 claims description 18
- 229920000459 Nitrile rubber Polymers 0.000 claims description 17
- 229920006122 polyamide resin Polymers 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000011342 resin composition Substances 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 6
- 238000004898 kneading Methods 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 17
- 230000000704 physical effect Effects 0.000 description 7
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 6
- 229920002292 Nylon 6 Polymers 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- -1 etc. Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000006230 acetylene black Substances 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006232 furnace black Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- RQUXYBHREKXNKT-UHFFFAOYSA-N n-butyl-4-methylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=C(C)C=C1 RQUXYBHREKXNKT-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- RGDDVTHQUAQTIE-UHFFFAOYSA-N 2-pentadecylphenol Chemical compound CCCCCCCCCCCCCCCC1=CC=CC=C1O RGDDVTHQUAQTIE-UHFFFAOYSA-N 0.000 description 1
- KHBQMWCZKVMBLN-UHFFFAOYSA-N Benzenesulfonamide Chemical compound NS(=O)(=O)C1=CC=CC=C1 KHBQMWCZKVMBLN-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 101100208721 Mus musculus Usp5 gene Proteins 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- YRJGYGPIEHIQPP-UHFFFAOYSA-N n-cyclohexylbenzenesulfonamide Chemical compound C=1C=CC=CC=1S(=O)(=O)NC1CCCCC1 YRJGYGPIEHIQPP-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は導電性を有し、しかも物性の良好なポ
リアミド樹脂組成物を提供するものであり、さら
に詳しくは、ポリアミド樹脂に炭素または金属よ
りなる導電性微粒子もしくは繊維状物質、ポリア
ミドと相溶性のある可塑剤およびニトリルゴムを
均一に混練分散することにより物性の良好な導電
性ポリアミド樹脂組成物を得るものである。
プラスチツクスは本来絶縁材料でありこれまで
電気電子技術の分野で広く応用されてきたが、最
近プラスチツクスに導電性を付与する試みが盛ん
になつてきた。このような傾向は材料に新しくよ
り高度な機能を与え付加価値を得ようとする動き
の現われであり、近い将来いろいろな形で電気製
品の中に応用されることが期待できる。
このような背景の中ですでにポリアミド樹脂に
導電性を持たせることは行われており、その方法
は導電性物質をポリアミド樹脂に均一に分散させ
導電性物質の相互連結により導電路を形成させて
得られる。しかしながら、導電性を高めるために
は導電性物質を多量必要となりポリアミドの持つ
本来の優れた物性を相当に損われることになり、
用途開発の大きな障害となつているのが現状であ
る。
本発明者らはその欠点を改良すべく鋭意研究を
重ねた結果、ポリアミド樹脂に導電性物質を添加
しただけの従来の組成物にさらにポリアミドと相
溶性のある可塑剤およびニトリルゴムを添加する
ことにより目的を達することができた。すなわ
ち、可塑剤およびニトリルゴムを添加した導電性
ポリアミド組成物は従来の組成物に比べて衝撃強
さが顕しく改良されると同時に導電性も向上させ
ることができる。従つて、導電性物質をその分に
匹敵するだけ少なくできるためさらにポリアミド
樹脂本来の物性の維持に有利となる。
以下、具体的に本発明を説明する。
本発明の対象となるポリアミド樹脂はナイロン
６，ナイロン66，ナイロン610，ナイロン11，ナ
イロン12などの単独重合体およびこれらの２種以
上の混合物もしくは共重合を挙げることができる
が、一般に分子鎖中にアミド基を有する直鎖状ポ
リマーであればよい。
本発明に使用できる導電性物質は微粒子状のも
のと繊維状のものがある。導電性微粒子としては
アセチレンブラツク，コンダクテイブフアーネス
ブラツク，コンダクテイブチヤンネルブラツク等
のカーボンブラツクまたはグラフアイト等の炭素
微粒子およびAl，Cu，Fe，Ni，Sn，Ti，Zn等あ
るいは真ちゆう、ブロンズ等の合金微粒子を用い
ることができる。尚、導電性微粒子の大きさは20
μ以下であるが、好ましくは５μ以下である。ま
た導電性繊維としては炭素繊維および金属繊維を
用いることができ、その直径は１〜20μが好まし
い。
本発明における導電性ポリアミド樹脂組成物の
導電率は10-8Ω-1cm-1以上であり、それを満足す
るためには導電性物質を少なくとも10〜40重量％
添加する必要がある。導電性繊維では長いほど少
量の添加で良いが、導電性に方向性がみられる。
導電性微粒子では繊維より多量の添加をしなけれ
ばならないが、方向性が少ない利点がある。ま
た、添加量が40重量％以上の場合導電率は勿論高
くなるが、ポリアミド樹脂組成物の製造および加
工が困難なこととたとえ製造加工ができても物性
の向上が望めず、また経剤性の面からも好ましく
ない。
本発明に用いる可塑剤はポリアミド樹脂と相溶
性がよく、しかも可塑化作用のある物質である。
たとえばベンゼンスルホンアミド，Ｎ―ブチルベ
ンゼンスルホンアミド，Ｎ―シクロヘキシルベン
ゼンスルホンアミド，パラトルエンスルホンアミ
ド，Ｎ―ブチルパラトルエンスルホンアミド等の
スルホンアミド系可塑剤あるいはパラオキシベン
ゾエートオクチルエステル，ペンタデシルフエノ
ール等のフエノール系可塑剤等が用いられる。し
かしポリアミド樹脂と相溶性のある可塑剤であれ
ばこれらに限つたものではない。本発明に必要な
可塑剤の添加量は５〜20重量％であり、５重量％
未満では耐衝撃性の向上が乏しく、20重量％を越
えるとポリアミド樹脂の特性である機械的強さ、
耐熱性、耐摩耗性などを損ねたり、可塑剤がブル
ーミングを起こしたりするので好ましくない。
本発明に用いられるニトリルゴムは添加量は20
重量％以下である。また可塑剤とニトリルゴムの
総添加量は全体の５〜50重量％であり、それらの
比率はどんな割合でもよいが、可塑剤／ニトリル
ゴムの比率が0.5以上であることが好ましい。
さらに本発明は上記添加剤以外に導電性および
物性を大きく損わない範囲で滑剤、分散剤、離型
剤、耐熱剤、耐候剤、難燃剤等を添加することが
できる。
本発明においてポリアミド樹脂に導電性物質、
可塑剤およびニトリルゴムを混練する方法として
均一に分散できる装置であればよく、一度に混練
が困難な場合は二度以上の混練を行つても良い
が、結果として四成分が均一に分散した状態の組
成物が得られることが必要である。
以下、実施例でもつて本発明の効果を詳細に説
明するが、本発明はこれらに限定されるものでは
ない。
尚、本実施例に示す体積抵抗率はASTM―Ｄ
―257の方法、アイゾツト衝撃強さはASTM―Ｄ
―256の方法に従つて行つた。体積抵抗率につい
ては直径100mmφ、厚さ3.2mmの円板を用い、これ
を23℃50％RHの雰囲気に48時間放置してから測
定に供した。またアイゾツト衝撃強さは長さ63.5
mm、一辺の長さ12.7mmの角柱状の試験片に規定の
ノツチをつけ、これを23℃50％RHの雰囲気に96
時間放置してから測定を行つた。
実施例 １
ナイロン６ペレツトにコンダクテイブフアーネ
スブラツク（平均粒径20mμ）、Ｎブチルベンゼ
ンスルホンアミドおよび粉末状のニトリルゴム
（アクリロニトリル成分40％）を表１の組成にな
るようそれぞれタンブラーでブレンドしその後
250℃に設定したベント式二軸押出機で均一に混
練し、ガツト状に押出し水冷後カツターでペレツ
ト化し減圧乾燥後試験片の成形を行つた。表１に
各組成物について体積抵抗率とアイゾツト衝撃強
さの測定結果を示す。
The present invention provides a polyamide resin composition that is electrically conductive and has good physical properties.More specifically, the present invention provides a polyamide resin composition that is conductive and has good physical properties. A conductive polyamide resin composition with good physical properties is obtained by uniformly kneading and dispersing a certain plasticizer and nitrile rubber. Plastics are originally insulating materials and have been widely applied in the field of electrical and electronic technology, but recently there has been an increase in attempts to impart electrical conductivity to plastics. This trend is an expression of the movement to add new value to materials by giving them new and more advanced functions, and we can expect them to be applied in various forms in electrical products in the near future. Against this background, attempts have already been made to make polyamide resin conductive.The method is to uniformly disperse conductive substances in polyamide resin and form conductive paths by interconnecting the conductive substances. can be obtained. However, in order to increase conductivity, a large amount of conductive substance is required, which considerably impairs the original excellent physical properties of polyamide.
The current situation is a major obstacle to the development of new applications. The inventors of the present invention have conducted extensive research in order to improve this drawback, and have discovered that a plasticizer and nitrile rubber that are compatible with polyamide are further added to the conventional composition, in which a conductive substance is simply added to polyamide resin. I was able to reach my goal. That is, a conductive polyamide composition to which a plasticizer and nitrile rubber are added can significantly improve impact strength and improve conductivity as compared to conventional compositions. Therefore, the amount of conductive material can be reduced by a corresponding amount, which is further advantageous in maintaining the original physical properties of the polyamide resin. The present invention will be specifically explained below. Polyamide resins that are the object of the present invention include homopolymers such as nylon 6, nylon 66, nylon 610, nylon 11, and nylon 12, as well as mixtures or copolymers of two or more of these. Any linear polymer having an amide group may be used. The conductive substances that can be used in the present invention include those in the form of fine particles and those in the form of fibers. Examples of conductive fine particles include carbon black such as acetylene black, conductive furnace black, conductive channel black, carbon fine particles such as graphite, and Al, Cu, Fe, Ni, Sn, Ti, Zn, etc., or brass. Fine alloy particles such as bronze can be used. Furthermore, the size of the conductive fine particles is 20
It is not more than μ, preferably not more than 5 μ. Further, carbon fibers and metal fibers can be used as the conductive fibers, and the diameter thereof is preferably 1 to 20 μm. The conductivity of the conductive polyamide resin composition in the present invention is 10 -8 Ω -1 cm -1 or more, and in order to satisfy this, at least 10 to 40% by weight of the conductive substance is required.
need to be added. For conductive fibers, the longer they are, the smaller the amount of addition required, but the conductivity is directional.
Although conductive fine particles must be added in larger amounts than fibers, they have the advantage of having less directionality. In addition, if the amount added is 40% by weight or more, the electrical conductivity will of course increase, but it is difficult to manufacture and process the polyamide resin composition, and even if it can be manufactured and processed, no improvement in physical properties can be expected. It is also unfavorable from this point of view. The plasticizer used in the present invention is a substance that has good compatibility with the polyamide resin and has a plasticizing effect.
For example, sulfonamide plasticizers such as benzenesulfonamide, N-butylbenzenesulfonamide, N-cyclohexylbenzenesulfonamide, para-toluenesulfonamide, and N-butylparatoluenesulfonamide, or phenols such as paraoxybenzoate octyl ester and pentadecylphenol. A plasticizer or the like is used. However, the plasticizer is not limited to these as long as it is compatible with the polyamide resin. The amount of plasticizer added necessary for the present invention is 5 to 20% by weight, and 5% by weight.
If it is less than 20% by weight, there will be little improvement in impact resistance, and if it exceeds 20% by weight, the mechanical strength, which is a characteristic of polyamide resin, will deteriorate.
It is not preferable because it impairs heat resistance, abrasion resistance, etc., and the plasticizer causes blooming. The amount of nitrile rubber used in the present invention is 20
% by weight or less. Further, the total amount of plasticizer and nitrile rubber added is 5 to 50% by weight of the whole, and although any ratio may be used, it is preferable that the ratio of plasticizer/nitrile rubber is 0.5 or more. Furthermore, in the present invention, in addition to the above-mentioned additives, lubricants, dispersants, mold release agents, heat resistant agents, weathering agents, flame retardants, etc. can be added within ranges that do not significantly impair conductivity and physical properties. In the present invention, a conductive substance is added to the polyamide resin.
As a method of kneading the plasticizer and nitrile rubber, any device that can uniformly disperse the plasticizer and nitrile rubber may be used.If kneading is difficult at once, kneading may be performed two or more times, but the result is a state in which the four components are uniformly dispersed. It is necessary to obtain a composition of Hereinafter, the effects of the present invention will be explained in detail with reference to Examples, but the present invention is not limited thereto. The volume resistivity shown in this example is ASTM-D.
-257 method, Izotsu impact strength is ASTM-D
- I followed the method of 256. For volume resistivity, a disk with a diameter of 100 mmφ and a thickness of 3.2 mm was used, and the disk was left in an atmosphere of 23° C. and 50% RH for 48 hours before measurement. In addition, the Izotsu impact strength is 63.5 in length.
A prismatic test piece with a side length of 12.7 mm was made with a specified notch and placed in an atmosphere of 23°C and 50% RH for 96°C.
After leaving it for a while, measurements were taken. Example 1 Nylon 6 pellets were blended with conductive furnace black (average particle size 20 mμ), N-butylbenzenesulfonamide, and powdered nitrile rubber (acrylonitrile content 40%) in a tumbler to give the composition shown in Table 1.
The mixture was uniformly kneaded using a vented twin-screw extruder set at 250°C, extruded into a gut shape, cooled with water, pelletized using a cutter, dried under reduced pressure, and then molded into test pieces. Table 1 shows the measurement results of volume resistivity and Izot impact strength for each composition.
【表】
表１より明らかなように可塑剤とニトリルゴを
添加しない導電性組成物に比べアイゾツト衝撃強
さの良好な導電性組成物が得られることがわか
る。また、体積抵抗率では可塑剤およびニトリル
ゴムの添加量が多くなるほど低くなり、すなわち
導電性が向上し同じ導電率を得るために導電性物
質の量を減らすことができる。
実施例 ２
ナイロン６にパラオキシベンゾエートオクチル
エステル17.65重量％、豆粒状のニトリルゴム
11.76重量％を65mmφの押出機で混練しペレツト
化した後、この組成物にアセチレンブラツク15重
量％を添加しベント式二軸押出機で均一に混練し
実施例１と同様にして試験片を得た。この組成物
はアセチレンブラツク（平均粒径50mμ）15重量
％、パラオキシベンゾエートオクチルエステル15
重量％、ブチルゴム10重量％を有する導電性ナイ
ロン６組成物であり、体積抵抗率は3.7×104Ω・
cm、アイゾツト衝撃強さは15Kg・cm／cmノツチで
あり、可塑剤およびニトリルゴムを添加しない組
成物に比べ体積抵抗率は低下し、衝撃強さは著し
く優れていることがわかる。
実施例 ３
ナイロン66に３mmにカツトした炭素繊維（直径
10μ）およびＮブチルベンゼンスルホンアミド、
粉末状のニトリルゴム（アクリロニトリル成分48
％）を表２の組成になるようそれぞれ実施例１と
同様にして試験片を作成し測定を行つた。その結
果を表２に示す。[Table] As is clear from Table 1, a conductive composition with better Izod impact strength can be obtained than a conductive composition without the addition of a plasticizer and nitrile rubber. In addition, the volume resistivity decreases as the amount of plasticizer and nitrile rubber added increases, that is, the conductivity improves and the amount of conductive substance can be reduced to obtain the same conductivity. Example 2 Nylon 6, paraoxybenzoate octyl ester 17.65% by weight, nitrile rubber in the form of beans
After kneading 11.76% by weight in a 65 mmφ extruder and pelletizing it, 15% by weight of acetylene black was added to this composition and uniformly kneaded in a vented twin-screw extruder to obtain a test piece in the same manner as in Example 1. Ta. This composition contains 15% by weight of acetylene black (average particle size 50 mμ), 15% of paraoxybenzoate octyl ester.
It is a conductive nylon 6 composition with 10% by weight of butyl rubber and a volume resistivity of 3.7×10 4 Ω・
cm, Izot impact strength was 15 Kg·cm/cm notch, indicating that the volume resistivity was lower and the impact strength was significantly superior compared to the composition without the addition of plasticizer and nitrile rubber. Example 3 Carbon fiber cut to 3 mm in nylon 66 (diameter
10μ) and N-butylbenzenesulfonamide,
Powdered nitrile rubber (acrylonitrile component 48
Test pieces were prepared and measured in the same manner as in Example 1 so that the compositions (%) were as shown in Table 2. The results are shown in Table 2.
【表】
表２の結果よりナイロン66に炭素繊維、可塑
剤、ニトリルゴムを添加した導電性ナイロン66組
成物は優れた衝撃強さおよび体積抵抗率の低下が
みられる。
実施例 ４
ナイロン６にアルミニウム粉末（平均粒径２
μ）を30重量％、Ｎブチルパラトルエンスルホン
アミド15重量％、粉末状のニトリルゴム（アクリ
ロニトリル成分40％）15重量％を実施例１と同様
にして試験片を作成し測定を行つた。その結果、
体積抵抗率は7.4×104Ω・cm、アイゾツト衝撃強
さは7.2Kg・cm／cmノツチであつた。また、ナイ
ロン６にアルミ粉末を30重量％だけ添加した組成
物を同様にして作成し測定したところ、体積抵抗
率は3.2×106Ω・cm、アイゾツト衝撃強さは1.5
Kg・cm／cmノツチであり、本発明の効果がよく現
われていることがわかる。[Table] From the results in Table 2, the conductive nylon 66 composition in which carbon fiber, plasticizer, and nitrile rubber are added to nylon 66 has excellent impact strength and a decrease in volume resistivity. Example 4 Aluminum powder (average particle size 2) on nylon 6
A test piece was prepared in the same manner as in Example 1 using 30% by weight of N-butyl para-toluenesulfonamide, 15% by weight of powdered nitrile rubber (40% acrylonitrile component), and measurements were performed. the result,
The volume resistivity was 7.4×10 4 Ω·cm, and the isot impact strength was 7.2 Kg·cm/cm notch. In addition, when a composition in which 30% by weight of aluminum powder was added to nylon 6 was similarly prepared and measured, the volume resistivity was 3.2×10 6 Ω・cm and the Izot impact strength was 1.5.
Kg・cm/cm notch, and it can be seen that the effects of the present invention are clearly exhibited.
Claims (1)
粒子もしくは繊維状の導電性物質(A)を10〜40重量
％、ポリアミドと相溶性のある可塑剤(B)を５〜20
重量％及びニトリルゴム(C)を2.0〜20重量％の割
合で均一に混練することを特徴とする導電性ポリ
アミド樹脂組成物。 ２ (B)及び(C)が全体の５〜50重量％であり、しか
もその比率が(B)／(C)≧0.5である特許請求の範囲
第１項記載の導電性ポリアミド樹脂組成物。[Claims] 1. 10 to 40% by weight of carbon or metal fine particles or fibrous conductive substance (A) based on the polyamide resin, and 5 to 20% of a plasticizer (B) compatible with the polyamide.
1. A conductive polyamide resin composition characterized by uniformly kneading nitrile rubber (C) in a proportion of 2.0 to 20% by weight. 2. The conductive polyamide resin composition according to claim 1, wherein (B) and (C) account for 5 to 50% by weight of the total, and the ratio thereof is (B)/(C)≧0.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5597278A JPS54146849A (en) | 1978-05-10 | 1978-05-10 | Conductive polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5597278A JPS54146849A (en) | 1978-05-10 | 1978-05-10 | Conductive polyamide resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54146849A JPS54146849A (en) | 1979-11-16 |
| JPS6212257B2 true JPS6212257B2 (en) | 1987-03-17 |
Family
ID=13013982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5597278A Granted JPS54146849A (en) | 1978-05-10 | 1978-05-10 | Conductive polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54146849A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012107243A (en) * | 1997-12-23 | 2012-06-07 | Arkema France | Antistatic composition based on polyamide |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58198544A (en) * | 1982-05-17 | 1983-11-18 | Otsuka Chem Co Ltd | Thermoplastic resin composition |
| JPS59213730A (en) * | 1983-05-18 | 1984-12-03 | Mishima Seishi Kk | Conductive film and its manufacture |
| JPH0657772B2 (en) * | 1985-12-13 | 1994-08-03 | 東芝ケミカル株式会社 | Conductive elastomer composition |
| EP1652887B1 (en) * | 2002-03-04 | 2012-10-31 | Arkema France | Polyamide-based composition for the making of flexible hoses containing oil or gas |
| US20050263202A1 (en) * | 2004-05-20 | 2005-12-01 | Cheng Paul P | Polymeric fuel system components |
-
1978
- 1978-05-10 JP JP5597278A patent/JPS54146849A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012107243A (en) * | 1997-12-23 | 2012-06-07 | Arkema France | Antistatic composition based on polyamide |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54146849A (en) | 1979-11-16 |
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