JP2002265728A - Conductive resin molding - Google Patents
Conductive resin moldingInfo
- Publication number
- JP2002265728A JP2002265728A JP2001064637A JP2001064637A JP2002265728A JP 2002265728 A JP2002265728 A JP 2002265728A JP 2001064637 A JP2001064637 A JP 2001064637A JP 2001064637 A JP2001064637 A JP 2001064637A JP 2002265728 A JP2002265728 A JP 2002265728A
- Authority
- JP
- Japan
- Prior art keywords
- conductive resin
- melting point
- metal
- resin molded
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、極めて高度の導電
性、及び優れた成形性や機械的強度を有するとともに難
燃性、耐熱性に優れた導電性樹脂成形品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive resin molded article having extremely high conductivity, excellent moldability and mechanical strength, and excellent flame retardancy and heat resistance.
【０００２】[0002]
【従来の技術】従来、各種樹脂からなる成形品に導電性
を付与した導電性樹脂成形品として、合成樹脂に導電性
フィラーを分散、混合した複合材料を用い成形した成形
品が知られている。導電性フィラーとして金属系、カー
ボン系などが使用されているが、高度の導電性を付与す
るには導電性フィラーの添加量を大幅に増加せざるを得
なく、その結果、成形性の悪化や、脆弱となり機械的強
度が低下するため添加量は制限され、得られる成形品の
導電性も体積固有抵抗値で１０−１Ω・ｃｍが限界であ
った。また、通常の熱可塑性樹脂をマトリックスとした
場合は、難燃性や耐熱性などの観点から、電気・電子部
品関連の用途への適用が困難であった。2. Description of the Related Art Conventionally, as a conductive resin molded article obtained by imparting conductivity to a molded article made of various resins, a molded article formed by using a composite material in which a conductive filler is dispersed and mixed in a synthetic resin is known. . Metal-based, carbon-based, etc. are used as the conductive filler, but in order to impart a high degree of conductivity, the amount of the conductive filler must be significantly increased, resulting in deterioration of the moldability and In addition, the amount of addition was limited due to the brittleness and the decrease in mechanical strength, and the conductivity of the resulting molded product was limited to 10 -1 Ω · cm in terms of volume resistivity. Further, when a normal thermoplastic resin is used as a matrix, it is difficult to apply the matrix to uses related to electric and electronic parts from the viewpoint of flame retardancy and heat resistance.
【０００３】[0003]
【発明が解決しようとする課題】そこで、極めて高度の
導電性を有するとともに、成形性及び機械的強度、耐熱
性も優れた導電性難燃樹脂成形品が求められていた。Accordingly, there has been a demand for a conductive flame-retardant resin molded product having an extremely high conductivity and excellent moldability, mechanical strength and heat resistance.
【０００４】[0004]
【課題を解決するための手段】本発明者は上記課題を解
決すべく鋭意検討した結果、本発明を完成するに至っっ
た。即ち本発明の要旨は、（ａ）熱可塑性フッ素樹脂を
基質とし、これに（ｂ）融点が３００℃以下の低融点金
属、及び（ｃ）金属粉末を混合してなる導電性樹脂成形
品にある。The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, completed the present invention. That is, the gist of the present invention is to provide a conductive resin molded product obtained by mixing (a) a thermoplastic fluororesin as a substrate, (b) a low-melting metal having a melting point of 300 ° C. or less, and (c) a metal powder. is there.
【０００５】本発明の好ましい実施態様としては、下記
が挙げられる。 （ａ）熱可塑性フッ素樹脂が成形品全体の２０〜８０容
量％の範囲であるとともに、（ｂ）及び（ｃ）を合わせ
た金属成分中の（ｃ）金属粉末の割合が１０〜３０容量
％の範囲である導電性樹脂成形品。 （ａ）熱可塑性フッ素樹脂の硬度がデュロメータＡ硬さ
で３５以上、デュロメータＤ硬さ６０以下の範囲である
ことを特徴とする導電性樹脂成形品。また、（ｃ）成分
の低融点金属が、Ｐｂ／Ｓｎ、Ｐｂ／Ｓｎ／Ｂｉ、Ｐｂ
／Ｓｎ／Ａｇ、 Ｐｂ／Ａｇ、 Ｓｎ／Ａｇ、 Ｓｎ／Ｂｉ、
Ｓｎ／Ｃｕ、Ｓｎ／Ｚｎ系から選ばれた低融点合金から
なることを特徴とする導電性樹脂成形品。さらに、
（ｄ）成分の金属粉末がＣｕ、Ｎｉ、Ａｌ、Ｃｒ及びそ
れらの合金粉末からなり、その平均粒径が１〜５０μｍ
の範囲であることを特徴とする導電性樹脂成形品及び、
シート状に成形してなる導電性樹脂成形品を含んでい
る。[0005] Preferred embodiments of the present invention include the following. (A) The thermoplastic fluororesin is in the range of 20 to 80% by volume of the whole molded article, and the ratio of the metal powder (c) in the metal component obtained by combining (b) and (c) is 10 to 30% by volume. Conductive resin molded products in the range of (A) A conductive resin molded product, wherein the hardness of the thermoplastic fluororesin is in a range of 35 or more in durometer A hardness and 60 or less in durometer D hardness. Further, the low melting point metal of the component (c) is Pb / Sn, Pb / Sn / Bi, Pb
/ Sn / Ag, Pb / Ag, Sn / Ag, Sn / Bi,
A conductive resin molded product comprising a low melting point alloy selected from the group consisting of Sn / Cu and Sn / Zn. further,
The metal powder of the component (d) is composed of Cu, Ni, Al, Cr and their alloy powder, and has an average particle size of 1 to 50 μm.
A conductive resin molded product characterized by being in the range of,
It includes a conductive resin molded product formed into a sheet.
【０００６】[0006]
【発明の実施の形態】以下、本発明を詳しく説明する。
本発明の導電性樹脂成形品は、その材料が（ａ）熱可塑
性フッ素樹脂、（ｂ）融点が３００℃以下の低融点金
属、及び（ｃ）金属粉末の混合物（以下、「混合材」と
いう）からなることに特徴がある。このように熱可塑性
フッ素樹脂と導電性を付与するための金属成分を特定の
組合せとすることにより、極めて高度の導電性と他の特
性をバランス良く付与できることを見出したものであ
り、混合材においては （ａ）熱可塑性フッ素樹脂を組成物全体の２０〜８０容
量％、好ましくは４０〜６０容量％の範囲で含有するこ
とが好ましい。熱可塑性フッ素樹脂が８０容量％を越え
ると導電性が発現し難い傾向にあり、２０容量％未満で
は、流動性が低下して成形性に劣り易い。 （ａ）熱可塑性フッ素樹脂の硬度がデュロメータＡ硬さ
で３５以上、デュロメータＤ硬さ６０以下の範囲、好ま
しくはデュロメータＡ硬さで５０以上、デュロメータＤ
硬さ５０以下であることが好ましい。ブレンド物の硬度
がデュロメータＡ硬さで３５未満では、柔らかすぎて成
形が困難となり、デュロメータＤ硬さ６０以上では、脆
性改質の効果が失われる。（ｃ）の金属粉末は低融点金
属の分散助剤として作用し、金属成分中の（ｃ）金属粉
末の割合を１０〜３０容量％、好ましくは１５〜２５容
量％の範囲とすることが好ましい。１０容量％未満で
は、分散状態が悪くなり、また３０容量％を越えると流
動性が低下するとともに脆化しやすく、さらに導電性も
低下する傾向が見られる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
The conductive resin molded article of the present invention is made of a mixture of (a) a thermoplastic fluororesin, (b) a low melting point metal having a melting point of 300 ° C. or less, and (c) a metal powder (hereinafter, referred to as “mixture”). ). By using a specific combination of the thermoplastic fluororesin and the metal component for imparting conductivity in this manner, it has been found that a very high degree of conductivity and other properties can be imparted in a well-balanced manner. It is preferable that (a) the thermoplastic fluororesin be contained in the range of 20 to 80% by volume, preferably 40 to 60% by volume of the whole composition. When the content of the thermoplastic fluororesin exceeds 80% by volume, conductivity tends to be hardly exhibited, and when the content is less than 20% by volume, the fluidity is reduced and the moldability is likely to be inferior. (A) The hardness of the thermoplastic fluororesin is 35 or more in durometer A hardness and 60 or less in durometer D hardness, preferably 50 or more in durometer A hardness, durometer D
The hardness is preferably 50 or less. If the hardness of the blend is less than 35 in durometer A hardness, it is too soft and molding is difficult, and if the durometer D hardness is 60 or more, the effect of brittleness modification is lost. The metal powder (c) acts as a dispersing aid for the low melting point metal, and the proportion of the metal powder (c) in the metal component is preferably in the range of 10 to 30% by volume, preferably 15 to 25% by volume. . If the content is less than 10% by volume, the dispersion state is deteriorated. If the content exceeds 30% by volume, the fluidity tends to be reduced, the embrittlement is liable to occur, and the conductivity tends to be reduced.
【０００７】混合材に用いられる（ａ）熱可塑性フッ素
樹脂としては、テトラフルオロエチレン−ヘキサフルオ
ロプロピレン−ビニリデンフロライドからなる熱可塑性
フッ素樹脂などが挙げられる。市販のものとしては「ダ
イニオン」（住友スリーエム（株）製）がある。また、
これらの樹脂に難燃性が阻害されないレベルで他の樹脂
をブレンドすることも可能である。As the (a) thermoplastic fluororesin used in the mixture, a thermoplastic fluororesin composed of tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride and the like can be mentioned. As a commercially available product, "Dynion" (manufactured by Sumitomo 3M Limited) is available. Also,
It is also possible to blend these resins with other resins at a level at which flame retardancy is not impaired.
【０００８】（ｂ）の融点が３００℃以下の低融点金属
には各種のものが使用できる。融点の測定方法は示差走
査熱量測定法（ＤＳＣ）に示差走査熱量測定法（ＤＳ
Ｃ）ににより測定すればよく、融点が３００℃を越える
金属では成形性が劣るという問題がある。具体的にはＰ
ｂ／Ｓｎ、Ｐｂ／Ｓｎ／Ｂｉ、Ｐｂ／Ｓｎ／Ａｇ、 Ｐｂ
／Ａｇ、Ｓｎ／Ａｇ、 Ｓｎ／Ｂｉ、Ｓｎ／Ｃｕ、Ｓｎ／
Ｚｎ系から選ばれた低融点合金が好適に使用できる。
（ｃ）成分の金属粉末は上記低融点金属の分散助剤とな
るものであり、Ｃｕ、Ｎｉ、Ａｌ、Ｃｒ及びそれらの合
金粉末が好適に使用でき、その平均粒径が１〜５０μｍ
の範囲のものが好ましい。平均粒径は試料を透過型電子
顕微鏡により撮影し、写真から求めた数平均粒子径であ
る。平均粒径が１μｍ未満では混合の際のハンドリング
が困難であり、また５０μｍを越えるものでは分散性が
低下し易い傾向がある。Various kinds of low melting point metals having a melting point of 300 ° C. or lower can be used. The melting point can be measured by the differential scanning calorimetry (DSC).
The measurement may be performed according to C), and there is a problem that a metal having a melting point exceeding 300 ° C. has poor moldability. Specifically, P
b / Sn, Pb / Sn / Bi, Pb / Sn / Ag, Pb
/ Ag, Sn / Ag, Sn / Bi, Sn / Cu, Sn /
A low melting point alloy selected from Zn-based can be suitably used.
The metal powder of the component (c) serves as a dispersing aid for the low-melting-point metal, and Cu, Ni, Al, Cr and alloy powders thereof can be suitably used, and the average particle size is 1 to 50 μm.
Are preferred. The average particle diameter is a number average particle diameter obtained by photographing a sample with a transmission electron microscope and obtaining the photograph. When the average particle size is less than 1 μm, handling during mixing is difficult, and when the average particle size exceeds 50 μm, the dispersibility tends to decrease.
【００１０】本発明の導電性樹脂成形品の製造方法は、
上記混合材の各成分を用い、混合したものを所定の温度
でニーダや二軸押出機等の混練機により混練後、造粒し
たものを使用する方法が好ましい。混練においては
（ｃ）低融点金属が半溶融状態となる温度が好ましく、
マトリックスとなる樹脂ブレンド物の溶融温度に応じて
適切な金属組成を選択し、低融点金属と分散助剤となる
銅粉、ニッケル粉末等の添加比率を適宜選択する必要が
ある。以上の方法で得られた造粒物は、使用目的に対応
する形状の金型を用いて射出成形法、トランスファー成
形法、プレス成形法等の通常の成形法により賦形し、成
形品とすることができる。また、Ｔダイ押出成形機等に
よりシート化も可能である。The method for producing a conductive resin molded article of the present invention comprises:
It is preferable to use a mixture obtained by kneading the mixture at a predetermined temperature using a kneader such as a kneader or a twin-screw extruder, and then granulating the mixture using the components of the above-mentioned mixture. In kneading, (c) a temperature at which the low-melting point metal is in a semi-molten state is preferable,
It is necessary to select an appropriate metal composition in accordance with the melting temperature of the resin blend serving as the matrix, and to appropriately select the addition ratio of the low melting point metal and the copper powder, nickel powder, etc. serving as the dispersing aid. The granulated product obtained by the above method is formed into a molded product by a normal molding method such as an injection molding method, a transfer molding method, and a press molding method using a mold having a shape corresponding to a purpose of use. be able to. Further, a sheet can be formed by a T-die extruder or the like.
【００１１】以上述べたように、本発明の導電性成形品
は、熱可塑性フッ素樹脂に低融点金属が含有されている
ことから、極めて高度の導電性を有する一方で、成形性
及び機械的強度、耐熱性に優れており、難燃性を有する
ことから導電性隔壁、導電性部材、帯電防止材、電磁波
シールド材、電極、コネクター、センサー、発熱体等の
電気、電子分野への適用が可能である。As described above, the conductive molded article of the present invention has a very high conductivity because the thermoplastic fluororesin contains the low melting point metal, while having a high moldability and a high mechanical strength. It has excellent heat resistance and flame retardancy, so it can be applied to the electrical and electronic fields such as conductive partitions, conductive members, antistatic materials, electromagnetic wave shielding materials, electrodes, connectors, sensors, and heating elements. It is.
【００１２】[0012]
【実施例】以下、実施例について説明するが、本発明は
これに限定されるものではない。 （実施例１）熱可塑性フッ素樹脂としてダイニオンＴＨ
Ｖ(ＴＨＶ５００Ｇ／住友スリーエム（株）製)を用い
た。硬度はデューロメータＤ硬さで５４となった。低融
点金属として鉛フリーハンダ（Ｓｎ−４Ｃｕ−２Ｎｉ
融点 固相線２２５℃−液相線４８０℃）、金属粉末と
して平均粒径１０μｍの銅粉を用いた。あらかじめ各原
料を物理混合し（熱可塑性フッ素樹脂５０容量％、低融
点金属４５容量％、金属粉末５容量％）、２軸押出機
（「２Ｄ２５−Ｓ」東洋精機（株）製）を用いて溶融混
練後、低融点金属含有樹脂ペレットを作成した。The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited thereto. (Example 1) Dynion TH as a thermoplastic fluororesin
V (THV500G / Sumitomo 3M Ltd.) was used. The hardness was 54 in durometer D hardness. Lead-free solder (Sn-4Cu-2Ni) as low melting point metal
Melting point: solidus line 225 ° C-liquidus line 480 ° C), and copper powder having an average particle diameter of 10 µm was used as the metal powder. Each raw material is physically mixed in advance (50% by volume of thermoplastic fluororesin, 45% by volume of low melting point metal, 5% by volume of metal powder), and using a twin screw extruder ("2D25-S" manufactured by Toyo Seiki Co., Ltd.) After melt-kneading, a low melting point metal-containing resin pellet was prepared.
【００１３】押出条件は以下の通りである。 シリンダー温度： ２００℃ スクリュ回転数： ２０ｒ．ｐ．ｍ． その後、雌型と雄型とを対向させた射出成型用金型（１
１０ｍｍ×７５ｍｍ肉厚１ｍｍの矩形状キャビティ）内
に上記の低融点金属含有樹脂ペレットを以下の条件で射
出成形を行った。 金型温度 ： ４０℃ シリンダー温度 ： ２００℃ スクリュ回転数 ： ５０ｒ．ｐ．ｍ． 射出率 ： ６０ｃｍ３／秒 射出圧力 ： ８０Ｍｐａ 背圧 ： ２Ｍｐａ 保圧時間 ：４０秒The extrusion conditions are as follows. Cylinder temperature: 200 ° C Screw rotation speed: 20r. p. m. Thereafter, the injection mold (1) in which the female mold and the male mold are opposed to each other.
The low-melting-point metal-containing resin pellets were injection-molded in a rectangular cavity having a size of 10 mm × 75 mm and a thickness of 1 mm) under the following conditions. Mold temperature: 40 ° C Cylinder temperature: 200 ° C Screw rotation speed: 50r. p. m. Injection rate: 60 cm 3 / sec Injection pressure: 80 Mpa Back pressure: 2 Mpa Holding time: 40 seconds
【００１４】冷却後、脱型し目的とする成形品を得た。
得られた成形品の特性は以下の通りであった。 シャルピー衝撃値 ：破壊せず 体積固有抵抗値 ：４．１４×１０−４Ω・ｃｍ 難燃性 ：ＵＬ−９４ Ｖ−０相当 衝撃試験はＪＩＳ Ｋ７１１１に準拠（シャルピ−フラ
ットワイズノッチなし試験片幅 １０ｍｍ、支点間距離
２０ｍｍ、試験速度 ０．５ｍｍ／分） 硬度はＪＩＳ Ｋ７２１５に準拠 難燃性はＵＬ規格に準拠After cooling, the mold was removed to obtain the desired molded product.
The characteristics of the obtained molded product were as follows. Charpy impact value: not destroyed Volume resistivity value: 4.14 × 10 −4 Ω · cm Flame retardancy: equivalent to UL-94 V-0 Impact test conforms to JIS K7111 (Test piece width without Charpy-flatwise notch) (10 mm, distance between supports 20 mm, test speed 0.5 mm / min) Hardness conforms to JIS K7215 Flame retardant conforms to UL standard
【００１５】（実施例２）熱可塑性フッ素樹脂としてダ
イニオンＴＨＶ(ＴＨＶ５００Ｇ／住友スリーエム
（株）製)を用いた。ブレンド物の硬度はデューロメー
タＤ硬さで４０となった。低融点金属として鉛フリーハ
ンダ（Ｓｎ−４Ｃｕ−２Ｎｉ 融点 固相線２２５℃−
液相線４８０℃）、金属粉末として平均粒径１０μｍの
銅粉を用いた。あらかじめ各原料粉末を物理混合し（熱
可塑性フッ素樹脂５０容量％、低融点金属４５容量％、
金属粉末５容量％）、２軸押出機（「２Ｄ２５−Ｓ」東
洋精機（株）製）を用いて溶融混練後、低融点金属含有
樹脂ペレットを作成した。押出条件は以下の通りであ
る。(Example 2) Dynion THV (THV500G, manufactured by Sumitomo 3M Limited) was used as a thermoplastic fluororesin. The hardness of the blend was 40 in Durometer D hardness. Lead-free solder (Sn-4Cu-2Ni melting point, solidus 225 ° C)
(Liquidus line 480 ° C.), and copper powder having an average particle size of 10 μm was used as the metal powder. Physical mixing of each raw material powder in advance (50% by volume of thermoplastic fluororesin, 45% by volume of low melting metal,
After melting and kneading using a twin screw extruder (“2D25-S” manufactured by Toyo Seiki Co., Ltd.), a low melting point metal-containing resin pellet was prepared. Extrusion conditions are as follows.
【００１６】シリンダー温度： ２００℃ スクリュ回転数： ４０ｒ．ｐ．ｍ． その後、Ｔダイ押出機により厚さ１ｍｍのシート成形を
下記の条件で行った。 シリンダー温度 ： ２００℃ 口金温度 ：２００℃ スクリュ回転数 ： ５０ｒ．ｐ．ｍ． 上記条件にて幅１５０、肉厚１ｍｍのシートが容易に得
られた。得られた成形品の特性は以下の通りであった。 シャルピー衝撃値 ：破壊せず 体積固有抵抗値 ：２．２５×１０−４Ω・ｃｍ 難燃性 ：ＵＬ−９４ Ｖ−０相当 衝撃試験はＪＩＳ Ｋ７１１１に準拠（シャルピ−フラ
ットワイズノッチなし試験片幅 １０ｍｍ、支点間距離
２０ｍｍ、試験速度 ０．５ｍｍ／分） 硬度はＪＩＳ Ｋ７２１５に準拠 難燃性はＵＬ規格に準拠Cylinder temperature: 200 ° C. Screw rotation speed: 40 r. p. m. Thereafter, a sheet having a thickness of 1 mm was formed by a T-die extruder under the following conditions. Cylinder temperature: 200 ° C Cap temperature: 200 ° C Screw rotation speed: 50r. p. m. Under the above conditions, a sheet having a width of 150 and a thickness of 1 mm was easily obtained. The characteristics of the obtained molded product were as follows. Charpy impact value: Not destroyed Volume specific resistance value: 2.25 × 10 −4 Ω · cm Flame retardancy: Equivalent to UL-94 V-0 Impact test conforms to JIS K7111 (Test piece width without Charpy-flat wise notch) (10 mm, distance between supports 20 mm, test speed 0.5 mm / min) Hardness conforms to JIS K7215 Flame retardant conforms to UL standard
【００１７】[0017]
【発明の効果】上述したように、本発明の導電性樹脂成
形品は、熱可塑性フッ素樹脂に低融点金属が含有されて
いることから、極めて高度の導電性を有する一方で、成
形性及び機械的強度、耐熱性に優れており、難燃性を有
することから導電性隔壁、導電性部材、帯電防止材、電
磁波シールド材、電極、コネクター、センサー、発熱体
等の電気、電子分野への適用が可能である。As described above, the conductive resin molded article of the present invention has extremely high conductivity because the thermoplastic fluororesin contains a low melting point metal, while having high moldability and mechanical properties. It has excellent mechanical strength and heat resistance, and has flame retardancy, so it can be applied to the electrical and electronic fields such as conductive partitions, conductive members, antistatic materials, electromagnetic wave shielding materials, electrodes, connectors, sensors, and heating elements. Is possible.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F071 AA27 AB06 AB07 AB08 AB09 AB12 AF37 AH12 BA01 BB05 BB06 4J002 BD121 BD141 BD151 BD161 DA067 DA077 DA087 DA097 DC006 FD116 FD117 GQ02 5G301 AA20 DA02 DA03 DA04 DA06 DA10 DA13 DA15 DA47 DD05 DD08 DE02 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA27 AB06 AB07 AB08 AB09 AB12 AF37 AH12 BA01 BB05 BB06 4J002 BD121 BD141 BD151 BD161 DA067 DA077 DA087 DA097 DC006 FD116 FD117 GQ02 5G301 AA20 DA02 DA03 DA04 DA02 DA10 DD13 DA15
Claims (6)
これに（ｂ）融点が３００℃以下の低融点金属、及び
（ｃ）金属粉末を混合してなる導電性樹脂成形品。(1) using a thermoplastic fluororesin as a substrate,
A conductive resin molded product obtained by mixing (b) a low melting point metal having a melting point of 300 ° C. or less and (c) a metal powder.
の２０〜８０容量％の範囲であるとともに、（ｂ）及び
（ｃ）を合わせた金属成分中の（ｃ）金属粉末の割合が
１０〜３０容量％の範囲であることを特徴とする請求項
１記載の導電性樹脂成形品。2. The ratio of the metal powder (c) in the metal component (b) and (c) together with (a) the thermoplastic fluororesin is in the range of 20 to 80% by volume of the whole molded article. The conductive resin molded product according to claim 1, wherein the content is in a range of 10 to 30% by volume.
ロメータＡ硬さで３５以上、デュロメータＤ硬さ６０以
下の範囲であることを特徴とする請求項１又は２記載の
導電性樹脂成形品。3. The conductive resin molded article according to claim 1, wherein (a) the thermoplastic fluororesin has a durometer A hardness of 35 or more and a durometer D hardness of 60 or less. .
ｎ、Ｐｂ／Ｓｎ／Ｂｉ、Ｐｂ／Ｓｎ／Ａｇ、 Ｐｂ／Ａ
ｇ、 Ｓｎ／Ａｇ、 Ｓｎ／Ｂｉ、Ｓｎ／Ｃｕ、Ｓｎ／Ｚｎ
系から選ばれた低融点合金からなることを特徴とする請
求項１乃至３のいずれか１項に記載の導電性樹脂成形
品。4. The low melting point metal of component (c) is Pb / S
n, Pb / Sn / Bi, Pb / Sn / Ag, Pb / A
g, Sn / Ag, Sn / Bi, Sn / Cu, Sn / Zn
The conductive resin molded article according to any one of claims 1 to 3, comprising a low melting point alloy selected from the group consisting of:
ｌ、Ｃｒ及びそれらの合金粉末からなり、その平均粒径
が１〜５０μｍの範囲であることを特徴とする請求項１
乃至４のいずれか１項に記載の導電性樹脂成形品。5. The metal powder of component (d) is Cu, Ni, A
2. The powder of claim 1, wherein said powder is made of l, Cr or an alloy powder thereof, and has an average particle diameter in the range of 1 to 50 μm.
5. The conductive resin molded product according to any one of items 4 to 4.
のいずれか１項に記載の導電性樹脂成形品。6. A sheet according to claim 1, which is formed into a sheet.
The conductive resin molded product according to any one of the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001064637A JP2002265728A (en) | 2001-03-08 | 2001-03-08 | Conductive resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001064637A JP2002265728A (en) | 2001-03-08 | 2001-03-08 | Conductive resin molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002265728A true JP2002265728A (en) | 2002-09-18 |
Family
ID=18923426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001064637A Pending JP2002265728A (en) | 2001-03-08 | 2001-03-08 | Conductive resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002265728A (en) |
-
2001
- 2001-03-08 JP JP2001064637A patent/JP2002265728A/en active Pending
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