JP2001501569A - 移送並びに引渡し装置 - Google Patents
移送並びに引渡し装置Info
- Publication number
- JP2001501569A JP2001501569A JP10516079A JP51607998A JP2001501569A JP 2001501569 A JP2001501569 A JP 2001501569A JP 10516079 A JP10516079 A JP 10516079A JP 51607998 A JP51607998 A JP 51607998A JP 2001501569 A JP2001501569 A JP 2001501569A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- armature
- devices
- transfer
- magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/121—Perforated article handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
- Y10T29/53065—Responsive to work or work-related machine element with means to fasten by deformation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Types And Forms Of Lifts (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.互いに対して対向して駆動されて、引渡し領域へ移動可能な2つの装置( 1、7;20、40)と、 引渡し領域において作用するように制御可能で、前記装置の一方において磁気 的な材料からなる少なくとも1つの部分(11、13;29、35、50、52 )を有する磁石装置(11、13;29、50、52)と、 前記領域において制御可能な磁石装置と作用結合される少なくとも1つの接極 子部分(15、31)と、を有し、 前記接極子部分が一方の装置における磁気的な材料からなる部分と共に、工作 物を保持するホルダを形成し、かつ制御可能な磁石装置の制御によって前記装置 へ取り付けること、並びにその装置から取り外すことが可能な、 真空処理装置のための工作物(5、25)を移送して引き渡す装置であって、 制御可能な磁石装置が、互いに対して移動可能な装置(1、7;20、40) の他方の装置においても、磁気的な材料からなる少なくとも1つの部分を有し、 かつ接極子部分(15、31、33)が他方の装置に設けられた部分と共に、工 作物のためのホルダを形成し、その場合に接極子部分が制御可能な磁石装置によ って、装置(1、7;20、40)の一方または他方へ引き付けられることが可 能であることを特徴とする装置。 2.接極子部分(15、31)が、工作物のための取り外し可能な固定機構( 17、37)を有することを特徴とする請求項1に記載の装置。 3.中央孔を備えたディスク形状の工作物のための、請求項1ま たは2のいずれか1項に記載の装置であって、 接極子が略マッシュルーム形状に形成されており、かつ好ましくは中央孔を備 えた円形ディスク形状の工作物のための取り外し可能な固定機構を有することを 特徴とする装置。 4.ディスク形状の工作物のための、請求項1から3のいずれか1項に記載の 装置であって、 接極子部分(33)がフレーム状に形成されており、かつ好ましくは工作物の ための固定機構を有することを特徴とする装置。 5.接極子部分に、工作物のための取り外し可能な固定機構が、弾性的な締付 け装置および/または係止装置、好ましくはボール係止装置の形状で設けられて いることを特徴とする請求項1から4のいずれか1項に記載の装置。 6.制御可能な磁石装置が、前記装置(7、40)の一方において駆動されて 移動する、磁気的な材料からなる少なくとも1つの部分(50、52)を有し、 好ましくは装置に設けられているすべての磁石が永久磁石であることを特徴とす る請求項1から5のいずれか1項に記載の装置。 7.前記移動可能な部分が、前記装置の一方の装置から他方の装置の方向へ作 用する線形駆動装置と作用結合されており、その線形駆動装置が好ましくはピス トン/シリンダ装置(46、48)によって形成されていることを特徴とする請 求項6に記載の装置。 8.前記装置の一方が、他方の装置方向へ移動可能な少なくとも1つのタペッ ト(42)を有し、その場合にタペットと磁気的な材料からなる部分が互いに独 立して、好ましくは同じ方向へ移動可能であることを特徴とする請求項6または 7に記載の装置。 9.タペットの移動に作用する第1のシリンダ室(56)と、部分へ作用する 第2のシリンダ室(57)とを有するダブルシリンダ 装置(60)が設けられていることを特徴とする請求項8に記載の装置。 10.接極子部分が、工作物の表面処理のためのマスキング部材を形成するこ とを特徴とする請求項1から9のいずれか1項に記載の装置。 11.工作物を差し入れる、または処理を受けさせるための少なくとも1つの 開口部と、請求項8または9に記載の装置とを有する真空処理装置のチャンバに おいて、 タペットと開口端縁が一緒になって、それが間隙シールであるにしろ、あるい は真空密シールであるにしろ、取り外し可能なシールを形成することを特徴とす る真空処理装置のチャンバ。 12.請求項1から10ないしは11のいずれか1項に記載の少なくとも1つ の装置またはチャンバを備えた設備。 13.真空処理装置内で互いに対して移動可能な、駆動される2つの装置を用 いて、かつそれらの装置間で工作物を移送して引き渡す方法において、 工作物を連動させる連動子が、一方の装置または他方の装置に磁気的に保持さ れ、かつ引渡し領域において連動子と工作物のために磁気的な保持力が一方の装 置から他方の装置へ切換え制御されることを特徴とする工作物を移送して引き渡 す方法。 14.請求項1から10のいずれか1項に記載の装置および/または請求項1 1に記載のチャンバおよび/または請求項12に記載の設備および/または請求 項13に記載の方法を、非磁気的な材料からなる、中央孔を備え得る円形ディス ク形状の工作物に、好ましくはミニディスク、コンパクトディスク、ハードディ スク、MOディスクまたは半導体ウェファに、使用すること。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH238696 | 1996-10-01 | ||
CH2386/96 | 1996-10-01 | ||
PCT/CH1997/000344 WO1998014632A1 (de) | 1996-10-01 | 1997-09-17 | Transport- und übergabeeinrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001501569A true JP2001501569A (ja) | 2001-02-06 |
JP4213217B2 JP4213217B2 (ja) | 2009-01-21 |
Family
ID=4232575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51607998A Expired - Fee Related JP4213217B2 (ja) | 1996-10-01 | 1997-09-17 | 移送並びに引渡し装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US5882171A (ja) |
EP (1) | EP0931175B1 (ja) |
JP (1) | JP4213217B2 (ja) |
AT (1) | ATE196932T1 (ja) |
DE (2) | DE29707683U1 (ja) |
WO (1) | WO1998014632A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180126438A (ko) * | 2017-03-17 | 2018-11-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 캐리어, 진공 시스템 및 진공 시스템을 동작시키는 방법 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0591706B1 (de) * | 1992-10-06 | 2002-04-24 | Unaxis Balzers Aktiengesellschaft | Kammer für den Transport von Werkstücken |
US6086125A (en) * | 1997-11-05 | 2000-07-11 | Daimlerchrysler Corporation | Magnetic holding device |
DE29812696U1 (de) * | 1998-07-16 | 1999-12-16 | Fairchild Technologies GmbH Geräte zur Halbleitertechnologie, 71665 Vaihingen | Einrichtung zum Halten von scheibenförmigen Kunststoffsubstraten |
DE10058770A1 (de) * | 2000-11-27 | 2002-06-06 | Singulus Technologies Ag | Vorrichtung zum Aufsetzen und Abnehmen von Masken auf ein bzw. von einem Substrat bei einer Bearbeitung des Substrats im Vakuum |
US6461085B1 (en) * | 2001-03-16 | 2002-10-08 | Toda Citron Technologies, Inc. | Sputter pallet loader |
JP3983113B2 (ja) * | 2002-06-20 | 2007-09-26 | Tdk株式会社 | 円板状基板用成膜装置に対する基板の受け渡し方法、基板受け渡しシステム、および当該方法を用いたディスク状記録媒体の製造方法 |
JP3957173B2 (ja) * | 2002-06-20 | 2007-08-15 | Tdk株式会社 | 円板状基板用成膜装置に対する基板の受け渡し方法、当該方法に用いられる基板受け渡し機構および基板ホルダ、および当該方法を用いたディスク状記録媒体の製造方法 |
US20040004362A1 (en) * | 2002-07-02 | 2004-01-08 | Dan Love | Magnetic grapple |
US6935828B2 (en) * | 2002-07-17 | 2005-08-30 | Transfer Engineering And Manufacturing, Inc. | Wafer load lock and magnetically coupled linear delivery system |
EP1595148B8 (en) * | 2003-02-06 | 2006-09-13 | DACHI s.r.l. | Gripping device capable to grip a vial or other containers without using mechanical fingers or other mechanical gripping devices |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US7967961B2 (en) * | 2004-08-30 | 2011-06-28 | Ulvac, Inc | Film forming apparatus |
KR101563380B1 (ko) * | 2007-12-28 | 2015-11-06 | 램 리써치 코포레이션 | 웨이퍼 캐리어 드라이브 장치 및 이를 동작시키는 방법 |
EP2161826B1 (de) * | 2008-09-09 | 2011-03-16 | Siemens Aktiengesellschaft | Transfervorrichtung mit dynamisch veränderbaren Antriebsbereichen |
US8062384B2 (en) * | 2009-06-12 | 2011-11-22 | Miasole | Systems, methods and apparatuses for magnetic processing of solar modules |
US9105778B2 (en) * | 2009-06-12 | 2015-08-11 | Apollo Precision (Kunming) Yuanhong Limited | Systems methods and apparatuses for magnetic processing of solar modules |
CH706662A1 (de) * | 2012-06-14 | 2013-12-31 | Oc Oerlikon Balzers Ag | Transport- und Übergabevorrichtung für scheibenförmige Substrate, Vakuumbehandlungsanlage und Verfahren zur Herstellung behandelter Substrate. |
US9694990B2 (en) | 2012-06-14 | 2017-07-04 | Evatec Ag | Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates |
CN104517876B (zh) * | 2013-09-30 | 2018-11-27 | 韩华泰科株式会社 | 封装件运送器组件 |
CN109956271B (zh) * | 2019-04-02 | 2024-03-22 | 江苏丁是丁精密科技有限公司 | 一种针对五金件的运输传送带 |
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1996
- 1996-10-10 US US08/728,634 patent/US5882171A/en not_active Expired - Lifetime
-
1997
- 1997-04-28 DE DE29707683U patent/DE29707683U1/de not_active Expired - Lifetime
- 1997-09-17 JP JP51607998A patent/JP4213217B2/ja not_active Expired - Fee Related
- 1997-09-17 EP EP97938732A patent/EP0931175B1/de not_active Expired - Lifetime
- 1997-09-17 DE DE59702470T patent/DE59702470D1/de not_active Expired - Lifetime
- 1997-09-17 WO PCT/CH1997/000344 patent/WO1998014632A1/de active IP Right Grant
- 1997-09-17 AT AT97938732T patent/ATE196932T1/de not_active IP Right Cessation
-
1999
- 1999-04-01 US US09/283,251 patent/US6453543B1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180126438A (ko) * | 2017-03-17 | 2018-11-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 캐리어, 진공 시스템 및 진공 시스템을 동작시키는 방법 |
JP2019513182A (ja) * | 2017-03-17 | 2019-05-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | キャリア、真空システム及び真空システムを操作する方法 |
KR102140569B1 (ko) | 2017-03-17 | 2020-08-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 캐리어, 진공 시스템 및 진공 시스템을 동작시키는 방법 |
Also Published As
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US6453543B1 (en) | 2002-09-24 |
JP4213217B2 (ja) | 2009-01-21 |
DE29707683U1 (de) | 1997-06-26 |
ATE196932T1 (de) | 2000-10-15 |
EP0931175A1 (de) | 1999-07-28 |
DE59702470D1 (de) | 2000-11-16 |
WO1998014632A1 (de) | 1998-04-09 |
US5882171A (en) | 1999-03-16 |
EP0931175B1 (de) | 2000-10-11 |
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