IT1316298B1 - Supporto a nastro per bga e dispositivo a semiconduttore utilizzantelo stesso - Google Patents

Supporto a nastro per bga e dispositivo a semiconduttore utilizzantelo stesso

Info

Publication number
IT1316298B1
IT1316298B1 IT2000MI000093A ITMI20000093A IT1316298B1 IT 1316298 B1 IT1316298 B1 IT 1316298B1 IT 2000MI000093 A IT2000MI000093 A IT 2000MI000093A IT MI20000093 A ITMI20000093 A IT MI20000093A IT 1316298 B1 IT1316298 B1 IT 1316298B1
Authority
IT
Italy
Prior art keywords
bga
same
semiconductor device
tape support
tape
Prior art date
Application number
IT2000MI000093A
Other languages
English (en)
Inventor
Yasuharu Kameyama
Norio Okabe
Original Assignee
Hitachi Cable
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable filed Critical Hitachi Cable
Publication of ITMI20000093A0 publication Critical patent/ITMI20000093A0/it
Publication of ITMI20000093A1 publication Critical patent/ITMI20000093A1/it
Application granted granted Critical
Publication of IT1316298B1 publication Critical patent/IT1316298B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
IT2000MI000093A 1999-01-26 2000-01-26 Supporto a nastro per bga e dispositivo a semiconduttore utilizzantelo stesso IT1316298B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01654899A JP3424581B2 (ja) 1999-01-26 1999-01-26 Ｂｇａ用テープキャリアおよびそれを用いた半導体装置

Publications (3)

Publication Number Publication Date
ITMI20000093A0 ITMI20000093A0 (it) 2000-01-26
ITMI20000093A1 ITMI20000093A1 (it) 2001-07-26
IT1316298B1 true IT1316298B1 (it) 2003-04-10

Family

ID=11919338

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2000MI000093A IT1316298B1 (it) 1999-01-26 2000-01-26 Supporto a nastro per bga e dispositivo a semiconduttore utilizzantelo stesso

Country Status (7)

Country Link
US (1) US6281570B1 (it)
JP (1) JP3424581B2 (it)
KR (1) KR100641854B1 (it)
DE (1) DE10002639B4 (it)
IT (1) IT1316298B1 (it)
SG (1) SG97137A1 (it)
TW (1) TW448519B (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4412828B2 (ja) * 2000-08-03 2010-02-10 Ｏｋｉセミコンダクタ株式会社 半導体パッケージの測定用ソケット及びその測定方法
JP2002252304A (ja) * 2001-02-23 2002-09-06 Toshiba Corp 半導体装置およびこれに用いられる支持基板
JP4103342B2 (ja) * 2001-05-22 2008-06-18 日立電線株式会社 半導体装置の製造方法
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
JP3625815B2 (ja) * 2002-11-12 2005-03-02 沖電気工業株式会社 半導体装置とその製造方法
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
CN104183574B (zh) * 2013-05-22 2017-02-08 中芯国际集成电路制造(上海)有限公司 半导体测试结构及测试方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136212A (ja) * 1991-11-15 1993-06-01 Hitachi Cable Ltd Ｔａｂ用テープキヤリアの製造方法
EP0737025A4 (en) * 1993-12-24 1998-06-17 Ibiden Co Ltd PRINTED CIRCUIT BOARD
DE19601388A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Leiterplatten-Trägervorrichtung
JP2891665B2 (ja) * 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
JP3480291B2 (ja) * 1998-01-08 2003-12-15 日立電線株式会社 半導体装置及び電子装置
JP2000286294A (ja) * 1999-03-30 2000-10-13 Hitachi Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
SG97137A1 (en) 2003-07-18
JP2000216203A (ja) 2000-08-04
KR100641854B1 (ko) 2006-11-03
ITMI20000093A0 (it) 2000-01-26
TW448519B (en) 2001-08-01
DE10002639B4 (de) 2007-09-13
ITMI20000093A1 (it) 2001-07-26
KR20000053603A (ko) 2000-08-25
US6281570B1 (en) 2001-08-28
DE10002639A1 (de) 2001-02-22
JP3424581B2 (ja) 2003-07-07

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