HUE034927T2 - Szilícium gél kompozíció és ennek alkalmazása - Google Patents

Szilícium gél kompozíció és ennek alkalmazása

Info

Publication number
HUE034927T2
HUE034927T2 HUE14780632A HUE14780632A HUE034927T2 HU E034927 T2 HUE034927 T2 HU E034927T2 HU E14780632 A HUE14780632 A HU E14780632A HU E14780632 A HUE14780632 A HU E14780632A HU E034927 T2 HUE034927 T2 HU E034927T2
Authority
HU
Hungary
Prior art keywords
gel composition
silicone gel
silicone
composition
gel
Prior art date
Application number
HUE14780632A
Other languages
English (en)
Inventor
Hiroji Enami
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of HUE034927T2 publication Critical patent/HUE034927T2/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/398—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing boron or metal atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Dispersion Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
HUE14780632A 2013-09-03 2014-08-29 Szilícium gél kompozíció és ennek alkalmazása HUE034927T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013182085 2013-09-03

Publications (1)

Publication Number Publication Date
HUE034927T2 true HUE034927T2 (hu) 2018-07-30

Family

ID=51659980

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE14780632A HUE034927T2 (hu) 2013-09-03 2014-08-29 Szilícium gél kompozíció és ennek alkalmazása

Country Status (7)

Country Link
US (2) US9951186B2 (hu)
EP (1) EP3041903B1 (hu)
KR (1) KR102242607B1 (hu)
CN (1) CN105612219B (hu)
HU (1) HUE034927T2 (hu)
TW (1) TWI638858B (hu)
WO (1) WO2015034029A1 (hu)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE034927T2 (hu) * 2013-09-03 2018-07-30 Dow Corning Toray Co Ltd Szilícium gél kompozíció és ennek alkalmazása
JP6409704B2 (ja) * 2015-07-24 2018-10-24 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
DE102015014581A1 (de) 2015-11-12 2017-05-18 Nele Schmidt Prolamine enthaltende Gele, Verfahren zu ihrer Herstellung und ihre Verwendung
JP6831403B2 (ja) * 2016-07-13 2021-02-17 ダウ シリコーンズ コーポレーション 金属非プロトン性オルガノシランオキシド化合物を含有する配合物
EP3484899B1 (en) 2016-07-13 2020-09-16 Dow Silicones Corporation Metal aprotic organosilanoxide compound
TWI763735B (zh) 2016-12-09 2022-05-11 美商道康寧公司 組成物、光漫散器和由其所形成之裝置、及相關方法
WO2018211981A1 (ja) 2017-05-18 2018-11-22 東レ・ダウコーニング株式会社 フルオロアルキル基含有硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えたトランスデューサー等
CN108024176A (zh) * 2017-12-26 2018-05-11 海鹰企业集团有限责任公司 将有机硅凝胶用作深水换能器及其阵缆压力补偿材料的方法
JP6923475B2 (ja) * 2018-03-23 2021-08-18 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び光半導体装置
JP7151770B2 (ja) * 2018-08-03 2022-10-12 信越化学工業株式会社 シリコーンゲル組成物及びその硬化物並びにパワーモジュール
JP7147966B2 (ja) * 2019-04-01 2022-10-05 信越化学工業株式会社 自己接着性シリコーンゲル組成物及びその硬化物からなるシリコーンゲル
CN111234771A (zh) * 2019-05-24 2020-06-05 深圳市鑫东邦科技有限公司 一种单组份加成型硅凝胶及其制备方法
EP4181183A1 (en) 2020-07-13 2023-05-17 Dow Toray Co., Ltd. Silicone gel composition, cured product thereof, and use therefor
CN112322048A (zh) * 2020-11-03 2021-02-05 杭州之江新材料有限公司 一种有机硅凝胶组合物及其制备方法和应用
CN113652194B (zh) * 2021-08-19 2023-05-05 广东万木新材料科技有限公司 一种苯基聚硅氧烷胶黏剂及其制备方法
CN114045122A (zh) * 2021-11-04 2022-02-15 埃肯有机硅（上海）有限公司 医用双面胶带及其制造方法
CN117777729B (zh) * 2023-12-29 2024-07-12 四川大学青岛研究院 透光耐候型有机硅凝胶及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL289728A (hu) 1962-03-15
JPS6056190B2 (ja) 1980-04-11 1985-12-09 東芝シリコ−ン株式会社 ポリオルガノシロキサン組成物
JPS6116295A (ja) 1984-07-04 1986-01-24 Hitachi Ltd 立軸ポンプの可動翼翼角度制御装置
JPH0696698B2 (ja) 1988-04-25 1994-11-30 信越化学工業株式会社 耐熱性シリコーン系感圧接着剤組成物
JPH0660282B2 (ja) 1989-04-12 1994-08-10 信越化学工業株式会社 耐熱性シリコーンゲル組成物
EP0440168A3 (en) 1990-01-30 1993-01-07 Dow Corning Toray Silicone Company, Limited One-part curable organosiloxane composition
JP3088011B2 (ja) 1990-01-30 2000-09-18 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性オルガノポリシロキサン組成物
JPH09183904A (ja) * 1995-12-28 1997-07-15 Toray Dow Corning Silicone Co Ltd オルガノポリシロキサン組成物
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP4875251B2 (ja) 2001-04-26 2012-02-15 東レ・ダウコーニング株式会社 シリコーンゲル組成物
JP5410762B2 (ja) 2006-12-28 2014-02-05 東レ・ダウコーニング株式会社 加熱硬化性シリコーンゴム組成物
JP2008291148A (ja) 2007-05-25 2008-12-04 Shin Etsu Chem Co Ltd 耐熱性に優れたシリコーンゲル組成物
JP5667740B2 (ja) * 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010106223A (ja) * 2008-10-31 2010-05-13 Dow Corning Toray Co Ltd 電気・電子部品用封止・充填剤および電気・電子部品
HUE034927T2 (hu) * 2013-09-03 2018-07-30 Dow Corning Toray Co Ltd Szilícium gél kompozíció és ennek alkalmazása
JP6609403B2 (ja) 2014-07-08 2019-11-20 株式会社Ｎｔｔファシリティーズ 構造物検証システム、構造物検証装置、構造物検証プログラム

Also Published As

Publication number Publication date
US20180208719A1 (en) 2018-07-26
EP3041903A1 (en) 2016-07-13
KR102242607B1 (ko) 2021-04-22
TW201518419A (zh) 2015-05-16
EP3041903B1 (en) 2017-08-16
CN105612219B (zh) 2018-12-14
US9951186B2 (en) 2018-04-24
CN105612219A (zh) 2016-05-25
US20160215099A1 (en) 2016-07-28
WO2015034029A1 (en) 2015-03-12
KR20160051830A (ko) 2016-05-11
TWI638858B (zh) 2018-10-21

Similar Documents

Publication Publication Date Title
HUE034927T2 (hu) Szilícium gél kompozíció és ennek alkalmazása
HK1223975A1 (zh) 含納米氣泡的組合物及其用途
ZA201602510B (en) Strigolactone formulations and uses thereof
SG10201800419VA (en) Patient interface and aspects thereof
GB201317286D0 (en) Composition and Use
IL286759A (en) Therapeutic methods and preparations
PL3013769T3 (pl) Zestaw ogniotrwały i jego zastosowanie
EP2968474A4 (en) SKIN COMPOSITIONS AND USES
HK1220920A1 (zh) 治療性組合物和其用途
EP2987839A4 (en) LAYER COMPOSITION AND ENDOSCOPE DEVICE
GB201305277D0 (en) Novel combination and use
EP2957297A4 (en) MICRO NEEDLE COATING COMPOSITION AND MICRO NEEDLE DEVICE
GB201301626D0 (en) Composition comprising 15-OHEPA and methods of using the same
EP2968107A4 (en) COSMETIC COMPOSITIONS AND USES THEREOF
GB201321693D0 (en) Composition and uses thereof
EP3007720A4 (en) COMPOSITION COMPRISING THE GC MACROPHAGE ACTIVATION FACTOR AND USES THEREOF
SG11201510150VA (en) Immunotherapy composition and use thereof
GB201602663D0 (en) Medical instrument and application thereof
IL244751A0 (en) Cyclic thianouracil-carboxamides and their use
EP2954908A4 (en) COATING COMPOSITION AND MEDICAL DEVICE
GB201301979D0 (en) New composition and use thereof
GB201318151D0 (en) Composition and device
HK1223852A1 (zh) 睪丸酮凝膠組合物及相關方法
IL246134A0 (en) Gel preparations containing testosterone and their uses
HK1213776A1 (zh) 包含顆粒和凝膠的化妝品