HRP20211480T1 - Legura za lemljenje - Google Patents
Legura za lemljenje Download PDFInfo
- Publication number
- HRP20211480T1 HRP20211480T1 HRP20211480TT HRP20211480T HRP20211480T1 HR P20211480 T1 HRP20211480 T1 HR P20211480T1 HR P20211480T T HRP20211480T T HR P20211480TT HR P20211480 T HRP20211480 T HR P20211480T HR P20211480 T1 HRP20211480 T1 HR P20211480T1
- Authority
- HR
- Croatia
- Prior art keywords
- less
- intermetallic compound
- rod
- solder alloy
- optionally
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title claims 3
- 239000000956 alloy Substances 0.000 title claims 3
- 229910000679 solder Inorganic materials 0.000 title claims 2
- 229910000765 intermetallic Inorganic materials 0.000 claims 4
- 238000005219 brazing Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Continuous Casting (AREA)
- Conductive Materials (AREA)
Claims (2)
1. Šipka za lemljenje, naznačena time, da posjeduje sastav legure koji u masenim postocima sadrži od 0,8% do 10% Cu, 0,03% do 0,4% Ni, opcionalno najmanje jedan od 0,3% ili manje P, 0,3% ili manje Ge, i 0,3% ili manje Ga, opcionalno najmanje jedan koji se bira iz najmanje jedne skupine od skupine koja se sastoji od najmanje jednog od In, Sb, Zn i Ag u ukupnoj količini od 5% ili manje, i skupine koja se sastoji od najmanje jednog od Mn, Cr, Co, Fe, Si, Al, Ti, i rijetkih zemnih elemenata u ukupnoj količini od 1% ili manje s preostalim dijelom koji je Sn i koji uključuje međumetalni spoj, pri čemu međumetalni spoj ima maksimalnu veličinu zrna od 100 μm ili manje u području koje je barem 50 μm udaljeno od površine šipke za lemljenje, dok je međumetalni spoj većinom (Cu, Ni)6Sn5.
2. Šipka za lemljenje u skladu s patentnim zahtjevom 1, naznačena time, da je zadovoljen sljedeći odnos (1):
maksimalna veličina zrna (μm) × udio površine (%) međumetalnog spoja u leguri za lemljenje ≤ 3000 μm ⋅ % ...... (1).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017255303A JP6369620B1 (ja) | 2017-12-31 | 2017-12-31 | はんだ合金 |
| EP18896544.6A EP3597356B1 (en) | 2017-12-31 | 2018-12-26 | Solder alloy |
| PCT/JP2018/047747 WO2019131718A1 (ja) | 2017-12-31 | 2018-12-26 | はんだ合金 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HRP20211480T1 true HRP20211480T1 (hr) | 2021-12-24 |
Family
ID=63104312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HRP20211480TT HRP20211480T1 (hr) | 2017-12-31 | 2018-12-26 | Legura za lemljenje |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US11123824B2 (hr) |
| EP (1) | EP3597356B1 (hr) |
| JP (1) | JP6369620B1 (hr) |
| KR (1) | KR102090548B1 (hr) |
| CN (1) | CN110612175B (hr) |
| ES (1) | ES2884792T3 (hr) |
| HR (1) | HRP20211480T1 (hr) |
| HU (1) | HUE055917T2 (hr) |
| MA (1) | MA47802A (hr) |
| MX (1) | MX2019012904A (hr) |
| MY (1) | MY185972A (hr) |
| PH (1) | PH12019502364A1 (hr) |
| PL (1) | PL3597356T3 (hr) |
| PT (1) | PT3597356T (hr) |
| TW (1) | TWI673130B (hr) |
| WO (1) | WO2019131718A1 (hr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| TW202403062A (zh) * | 2018-12-27 | 2024-01-16 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
| JP6721851B1 (ja) | 2019-06-28 | 2020-07-15 | 千住金属工業株式会社 | はんだ合金、鋳造物、形成物およびはんだ継手 |
| CN114173983A (zh) * | 2019-07-26 | 2022-03-11 | 日本斯倍利亚社股份有限公司 | 预制焊料和使用该预制焊料形成的焊料接合体 |
| JP6744972B1 (ja) | 2019-10-04 | 2020-08-19 | 有限会社 ナプラ | 接合構造部 |
| JP6799701B1 (ja) * | 2020-03-12 | 2020-12-16 | 有限会社 ナプラ | 金属粒子 |
| JP6890201B1 (ja) * | 2020-08-27 | 2021-06-18 | 有限会社 ナプラ | 接合材用合金インゴット |
| JP7007623B1 (ja) * | 2021-08-27 | 2022-01-24 | 千住金属工業株式会社 | はんだ合金及びはんだ継手 |
| CN113798725B (zh) * | 2021-10-13 | 2022-10-04 | 浙江强力控股有限公司 | 选择性波峰焊用免焊剂无铅焊料及其制备方法 |
| CN115383344B (zh) * | 2022-06-06 | 2024-02-06 | 桂林航天工业学院 | In-48Sn-xCuZnAl复合钎料及其制备方法与应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09122967A (ja) * | 1995-10-25 | 1997-05-13 | Tanaka Denshi Kogyo Kk | 複合半田材料 |
| JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
| US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| JP2004141910A (ja) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
| JP4318449B2 (ja) * | 2002-12-03 | 2009-08-26 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| US20040258556A1 (en) * | 2003-06-19 | 2004-12-23 | Nokia Corporation | Lead-free solder alloys and methods of making same |
| JP2005046882A (ja) * | 2003-07-29 | 2005-02-24 | Hitachi Metals Ltd | はんだ合金、はんだボール及びはんだ接合体 |
| JP5646230B2 (ja) * | 2009-07-22 | 2014-12-24 | 山陽特殊製鋼株式会社 | 鉛フリー接合材料およびその製造方法 |
| US20110303448A1 (en) | 2010-04-23 | 2011-12-15 | Iowa State University Research Foundation, Inc. | Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder |
| CN102029479A (zh) * | 2010-12-29 | 2011-04-27 | 广州有色金属研究院 | 一种低银无铅焊料合金及其制备方法和装置 |
| US9999945B2 (en) | 2011-04-08 | 2018-06-19 | Nihon Superior Co., Ltd. | Solder alloy |
| JP2013013916A (ja) * | 2011-07-04 | 2013-01-24 | Nihon Superior Co Ltd | 金属間化合物含有鉛フリーはんだ合金及びその製造方法 |
| JP2013252548A (ja) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | 微細部品接合用のソルダペースト |
| JP6283317B2 (ja) | 2012-11-30 | 2018-02-21 | 株式会社日本スペリア社 | 低融点ろう材 |
| KR102154882B1 (ko) | 2012-12-25 | 2020-09-10 | 미쓰비시 마테리알 가부시키가이샤 | 파워 모듈 |
| KR20160012878A (ko) | 2013-05-29 | 2016-02-03 | 신닛테츠스미킹 마테리알즈 가부시키가이샤 | 땜납 볼 및 전자 부재 |
| CN103753047B (zh) | 2013-11-20 | 2017-04-19 | 中国电子科技集团公司第四十一研究所 | 一种无铅钎料 |
| WO2015111587A1 (ja) | 2014-01-24 | 2015-07-30 | 新日鉄住金マテリアルズ株式会社 | 太陽電池用インターコネクタ及び太陽電池モジュール |
| JP5880766B1 (ja) * | 2015-05-26 | 2016-03-09 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
| CN105665956A (zh) | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
| JP2017196647A (ja) | 2016-04-28 | 2017-11-02 | 住友金属鉱山株式会社 | Ａｕ−Ｓｎ−Ａｇ−α系はんだ合金及びそのはんだ材料並びに該はんだ材料を用いて接合又は封止された実装基板 |
-
2017
- 2017-12-31 JP JP2017255303A patent/JP6369620B1/ja active Active
-
2018
- 2018-12-26 MY MYPI2019006081A patent/MY185972A/en unknown
- 2018-12-26 MA MA047802A patent/MA47802A/fr unknown
- 2018-12-26 MX MX2019012904A patent/MX2019012904A/es unknown
- 2018-12-26 PL PL18896544T patent/PL3597356T3/pl unknown
- 2018-12-26 HR HRP20211480TT patent/HRP20211480T1/hr unknown
- 2018-12-26 WO PCT/JP2018/047747 patent/WO2019131718A1/ja unknown
- 2018-12-26 HU HUE18896544A patent/HUE055917T2/hu unknown
- 2018-12-26 PT PT188965446T patent/PT3597356T/pt unknown
- 2018-12-26 KR KR1020197031277A patent/KR102090548B1/ko active IP Right Grant
- 2018-12-26 EP EP18896544.6A patent/EP3597356B1/en active Active
- 2018-12-26 US US16/605,744 patent/US11123824B2/en active Active
- 2018-12-26 CN CN201880028510.6A patent/CN110612175B/zh active Active
- 2018-12-26 ES ES18896544T patent/ES2884792T3/es active Active
- 2018-12-28 TW TW107147608A patent/TWI673130B/zh active
-
2019
- 2019-10-17 PH PH12019502364A patent/PH12019502364A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6369620B1 (ja) | 2018-08-08 |
| US11123824B2 (en) | 2021-09-21 |
| EP3597356A4 (en) | 2020-06-03 |
| KR102090548B1 (ko) | 2020-03-18 |
| WO2019131718A1 (ja) | 2019-07-04 |
| MX2019012904A (es) | 2019-12-11 |
| TWI673130B (zh) | 2019-10-01 |
| EP3597356B1 (en) | 2021-07-21 |
| PH12019502364B1 (en) | 2020-07-13 |
| JP2019118930A (ja) | 2019-07-22 |
| MA47802A (fr) | 2020-01-22 |
| KR20190123800A (ko) | 2019-11-01 |
| CN110612175A (zh) | 2019-12-24 |
| US20200376606A1 (en) | 2020-12-03 |
| TW201929994A (zh) | 2019-08-01 |
| PL3597356T3 (pl) | 2022-01-17 |
| ES2884792T3 (es) | 2021-12-13 |
| PT3597356T (pt) | 2021-08-20 |
| CN110612175B (zh) | 2020-10-27 |
| PH12019502364A1 (en) | 2020-07-13 |
| BR112020003649A2 (pt) | 2020-11-17 |
| HUE055917T2 (hu) | 2021-12-28 |
| EP3597356A1 (en) | 2020-01-22 |
| MY185972A (en) | 2021-06-14 |
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