WO2007023288A3 - Solder alloy - Google Patents

Solder alloy Download PDF

Info

Publication number
WO2007023288A3
WO2007023288A3 PCT/GB2006/003167 GB2006003167W WO2007023288A3 WO 2007023288 A3 WO2007023288 A3 WO 2007023288A3 GB 2006003167 W GB2006003167 W GB 2006003167W WO 2007023288 A3 WO2007023288 A3 WO 2007023288A3
Authority
WO
WIPO (PCT)
Prior art keywords
solder alloy
alloy
antimony
germanium
gallium
Prior art date
Application number
PCT/GB2006/003167
Other languages
French (fr)
Other versions
WO2007023288A2 (en
Inventor
Brian Lewis
Bawa Singh
John Laughlin
Ranjit Pandher
Original Assignee
Fry Metals Inc
Setna Rohan Piloo
Brian Lewis
Bawa Singh
John Laughlin
Ranjit Pandher
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fry Metals Inc, Setna Rohan Piloo, Brian Lewis, Bawa Singh, John Laughlin, Ranjit Pandher filed Critical Fry Metals Inc
Priority to JP2008527511A priority Critical patent/JP2009506203A/en
Priority to KR1020087007074A priority patent/KR101339025B1/en
Priority to EP06779198A priority patent/EP1924394A2/en
Publication of WO2007023288A2 publication Critical patent/WO2007023288A2/en
Publication of WO2007023288A3 publication Critical patent/WO2007023288A3/en
Priority to US12/036,497 priority patent/US8641964B2/en
Priority to US12/036,528 priority patent/US20080159904A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

An alloy suitable for use in a ball grid array, the alloy comprising from 0.15 - 1.5 wt.% copper, from 0.1 - 4 wt.% silver, from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium, from 0 - 0.1 wt.% gallium, from 0 - 0.3 wt.% of one or more rare earth elements, from 0 - 0.3 wt.% indium, from 0 - 0.3 wt.% magnesium, from 0 - 0.3 wt.% calcium, from 0 - 0.3 wt.% silicon, from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc, from 0 - 1 wt.% antimony, and at least one of the following elements from 0.02 - 0.3 wt% nickel, from 0.008 - 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt, from 0.005 - 0.3 wt% chromium, from 0.02 - 0.3 wt% iron, and from 0.008 - 0.1 wt% zirconium, and the balance tin, together with unavoidable impurities.
PCT/GB2006/003167 2005-08-24 2006-08-24 Solder alloy WO2007023288A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008527511A JP2009506203A (en) 2005-08-24 2006-08-24 Solder alloy
KR1020087007074A KR101339025B1 (en) 2005-08-24 2006-08-24 Solder alloy
EP06779198A EP1924394A2 (en) 2005-08-24 2006-08-24 Solder alloy
US12/036,497 US8641964B2 (en) 2005-08-24 2008-02-25 Solder alloy
US12/036,528 US20080159904A1 (en) 2005-08-24 2008-02-25 Solder alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71091705P 2005-08-24 2005-08-24
US60/710,917 2005-08-24

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/036,497 Continuation-In-Part US8641964B2 (en) 2005-08-24 2008-02-25 Solder alloy
US12/036,528 Continuation-In-Part US20080159904A1 (en) 2005-08-24 2008-02-25 Solder alloy

Publications (2)

Publication Number Publication Date
WO2007023288A2 WO2007023288A2 (en) 2007-03-01
WO2007023288A3 true WO2007023288A3 (en) 2007-07-12

Family

ID=36691605

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2006/003167 WO2007023288A2 (en) 2005-08-24 2006-08-24 Solder alloy

Country Status (4)

Country Link
EP (1) EP1924394A2 (en)
JP (1) JP2009506203A (en)
KR (1) KR101339025B1 (en)
WO (1) WO2007023288A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102554504A (en) * 2011-12-28 2012-07-11 常熟市华银焊料有限公司 Self-soldering silver solder containing praseodymium, zirconium and gallium
CN102513727B (en) * 2011-12-28 2013-07-24 南京航空航天大学 Self-fluxing silver solder containing neodymium, zirconium and gallium

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2179815A4 (en) * 2007-08-24 2010-09-08 Toshiba Kk Bonding composition
EP2243590B1 (en) * 2008-02-22 2020-04-15 Nihon Superior Sha Co., Ltd Method of regulating nickel concentration in lead-free solder containing nickel
DE202009019184U1 (en) * 2009-08-29 2017-11-14 Umicore Ag & Co. Kg solder alloy
US20110281136A1 (en) * 2010-05-14 2011-11-17 Jenq-Gong Duh Copper-manganese bonding structure for electronic packages
WO2012137901A1 (en) * 2011-04-08 2012-10-11 株式会社日本スペリア社 Solder alloy
US9735126B2 (en) * 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
JP5777979B2 (en) * 2011-08-30 2015-09-16 日本アルミット株式会社 Solder alloy
WO2013038817A1 (en) * 2011-09-16 2013-03-21 株式会社村田製作所 Electroconductive material, and connection method and connection structure using same
CN102321830B (en) * 2011-10-24 2012-11-28 南京信息工程大学 Low-smelting point high-strength lead-bismuth rare earth alloy and preparation method thereof
KR101283580B1 (en) 2011-12-14 2013-07-05 엠케이전자 주식회사 Tin-based solder ball and semiconductor package including the same
US8932519B2 (en) 2012-04-09 2015-01-13 Senju Metal Industry Co., Ltd. Solder alloy
CN110900036B (en) 2012-10-09 2022-10-28 阿尔法组装解决方案公司 High-temperature reliable lead-free and antimony-free tin solder
CN102922164A (en) * 2012-11-01 2013-02-13 青岛英太克锡业科技有限公司 Sn-Zn solder for soft-soldering tin wires and preparation method thereof
JP2015077601A (en) * 2013-04-02 2015-04-23 千住金属工業株式会社 Lead-free solder alloy
CN103243234B (en) * 2013-04-27 2015-08-26 深圳市同方电子新材料有限公司 A kind of Electronic Packaging soldering serial low silver leadless solder and preparation method thereof
KR101688463B1 (en) * 2013-11-15 2016-12-23 덕산하이메탈(주) Solder alloy and solder ball
CN104275561A (en) * 2014-09-17 2015-01-14 明光市锐创电气有限公司 Environment-friendly lead-free soldering-aiding paste
CN104400248A (en) * 2014-10-24 2015-03-11 云南锡业锡材有限公司 Photovoltaic tin-alloy solder, and preparation method and use thereof
CN104759783B (en) * 2015-03-24 2017-02-01 广东工业大学 Low-silver lead-free solder and preparation method thereof
JP5880766B1 (en) 2015-05-26 2016-03-09 千住金属工業株式会社 Solder alloy, solder ball, chip solder, solder paste and solder joint
CN105551566A (en) * 2016-02-01 2016-05-04 安徽渡江电缆集团有限公司 Anti-static copper alloy cable
JP6365653B2 (en) * 2016-08-19 2018-08-01 千住金属工業株式会社 Solder alloy, solder joint and soldering method
CN106238951A (en) * 2016-08-26 2016-12-21 王泽陆 A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof
US20200398382A1 (en) * 2018-04-13 2020-12-24 Senju Metal Industry Co., Ltd. Solder paste
JP6439893B1 (en) * 2018-05-25 2018-12-19 千住金属工業株式会社 Solder ball, solder joint and joining method
CN109048114B (en) * 2018-09-20 2021-02-12 南京理工大学 Sn-Cu-Ni lead-free solder containing Ga and Nd
CN109848606B (en) * 2018-12-17 2020-08-07 中南大学 Sn-Ag-Cu lead-free solder with high interface bonding strength and preparation method thereof
JP7068370B2 (en) * 2020-03-19 2022-05-16 千住金属工業株式会社 Solder alloys, solder balls and solder fittings

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US6139979A (en) * 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
JP2001071173A (en) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk Non-leaded solder
EP1088615A2 (en) * 1999-09-29 2001-04-04 Nec Corporation Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1213089A1 (en) * 2000-12-11 2002-06-12 Nec Corporation Solder, method for processing surface of printed wiring board, and method for mounting electronic part
EP1231015A1 (en) * 2001-02-09 2002-08-14 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
JP2002239780A (en) * 2001-02-09 2002-08-28 Nippon Steel Corp Solder alloy, solder ball and electronic member having solder bump
EP1245328A1 (en) * 2001-03-01 2002-10-02 Senju Metal Industry Co., Ltd. Lead-free solder paste
EP1273384A1 (en) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
US6554180B1 (en) * 1999-08-20 2003-04-29 Senju Metal Industry Co., Ltd. Lead-free solder paste
JP2003230980A (en) * 2002-02-14 2003-08-19 Nippon Steel Corp Leadless solder alloy, solder ball and electronic member having solder bump
EP1410871A1 (en) * 2002-10-17 2004-04-21 Senju Metal Industry Co., Ltd. Lead-free solder ball
JP2004261863A (en) * 2003-01-07 2004-09-24 Senju Metal Ind Co Ltd Lead-free solder
WO2005048303A2 (en) * 2003-11-06 2005-05-26 Indium Corporation Of America Anti-tombstoning lead free alloys for surface mount reflow soldering

Family Cites Families (2)

* Cited by examiner, † Cited by third party
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TW516984B (en) * 1999-12-28 2003-01-11 Toshiba Corp Solder material, device using the same and manufacturing process thereof
JP2001267730A (en) * 2000-03-14 2001-09-28 Hitachi Metals Ltd Solder ball

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6139979A (en) * 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
US6554180B1 (en) * 1999-08-20 2003-04-29 Senju Metal Industry Co., Ltd. Lead-free solder paste
JP2001071173A (en) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk Non-leaded solder
EP1088615A2 (en) * 1999-09-29 2001-04-04 Nec Corporation Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1213089A1 (en) * 2000-12-11 2002-06-12 Nec Corporation Solder, method for processing surface of printed wiring board, and method for mounting electronic part
JP2002239780A (en) * 2001-02-09 2002-08-28 Nippon Steel Corp Solder alloy, solder ball and electronic member having solder bump
EP1231015A1 (en) * 2001-02-09 2002-08-14 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
EP1245328A1 (en) * 2001-03-01 2002-10-02 Senju Metal Industry Co., Ltd. Lead-free solder paste
EP1273384A1 (en) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
JP2003230980A (en) * 2002-02-14 2003-08-19 Nippon Steel Corp Leadless solder alloy, solder ball and electronic member having solder bump
EP1410871A1 (en) * 2002-10-17 2004-04-21 Senju Metal Industry Co., Ltd. Lead-free solder ball
JP2004261863A (en) * 2003-01-07 2004-09-24 Senju Metal Ind Co Ltd Lead-free solder
WO2005048303A2 (en) * 2003-11-06 2005-05-26 Indium Corporation Of America Anti-tombstoning lead free alloys for surface mount reflow soldering

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
K.S. KIM ET AL: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", MICROELECTRONICS RELIABILITY, vol. 43, no. 2, 2003, Elsevier Science, pages 259 - 267, XP008067189 *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 12 12 December 2002 (2002-12-12) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102554504A (en) * 2011-12-28 2012-07-11 常熟市华银焊料有限公司 Self-soldering silver solder containing praseodymium, zirconium and gallium
CN102513727B (en) * 2011-12-28 2013-07-24 南京航空航天大学 Self-fluxing silver solder containing neodymium, zirconium and gallium
CN102554504B (en) * 2011-12-28 2013-11-06 常熟市华银焊料有限公司 Self-soldering silver solder containing praseodymium, zirconium and gallium

Also Published As

Publication number Publication date
KR20080106887A (en) 2008-12-09
JP2009506203A (en) 2009-02-12
KR101339025B1 (en) 2013-12-09
EP1924394A2 (en) 2008-05-28
WO2007023288A2 (en) 2007-03-01

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