HK1215308A1 - 基板處理裝置、器件製造方法以及圓筒光罩 - Google Patents

基板處理裝置、器件製造方法以及圓筒光罩

Info

Publication number
HK1215308A1
HK1215308A1 HK16103220.8A HK16103220A HK1215308A1 HK 1215308 A1 HK1215308 A1 HK 1215308A1 HK 16103220 A HK16103220 A HK 16103220A HK 1215308 A1 HK1215308 A1 HK 1215308A1
Authority
HK
Hong Kong
Prior art keywords
processing apparatus
substrate processing
device manufacturing
cylindrical mask
mask
Prior art date
Application number
HK16103220.8A
Other languages
English (en)
Inventor
加藤正紀
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1215308A1 publication Critical patent/HK1215308A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
HK16103220.8A 2013-04-30 2016-03-18 基板處理裝置、器件製造方法以及圓筒光罩 HK1215308A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013095647 2013-04-30
PCT/JP2014/058590 WO2014178244A1 (ja) 2013-04-30 2014-03-26 基板処理装置、デバイス製造方法及び円筒マスク

Publications (1)

Publication Number Publication Date
HK1215308A1 true HK1215308A1 (zh) 2016-08-19

Family

ID=51843379

Family Applications (3)

Application Number Title Priority Date Filing Date
HK18105549.5A HK1246405B (zh) 2013-04-30 2016-03-18 圓筒光罩
HK16103220.8A HK1215308A1 (zh) 2013-04-30 2016-03-18 基板處理裝置、器件製造方法以及圓筒光罩
HK18104875.2A HK1245419B (zh) 2013-04-30 2016-03-18 圓筒光罩

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK18105549.5A HK1246405B (zh) 2013-04-30 2016-03-18 圓筒光罩

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK18104875.2A HK1245419B (zh) 2013-04-30 2016-03-18 圓筒光罩

Country Status (6)

Country Link
JP (5) JP6269660B2 (zh)
KR (5) KR102096961B1 (zh)
CN (4) CN108227408B (zh)
HK (3) HK1246405B (zh)
TW (5) TWI610143B (zh)
WO (1) WO2014178244A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6269660B2 (ja) * 2013-04-30 2018-01-31 株式会社ニコン 基板処理装置、デバイス製造方法及び円筒マスク
KR102541913B1 (ko) * 2016-03-30 2023-06-13 가부시키가이샤 니콘 패턴 묘화 장치, 패턴 묘화 방법, 및 디바이스 제조 방법
WO2017199658A1 (ja) * 2016-05-19 2017-11-23 株式会社ニコン 基板支持装置、露光装置、および、パターニング装置
CN114096797B (zh) * 2020-01-31 2024-03-22 日本精工株式会社 旋转角度传感器、电动助力转向装置以及旋转角度传感器的制造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (ja) * 1983-07-18 1985-02-08 株式会社リコー 露光装置
JPH01128069A (ja) * 1987-11-12 1989-05-19 Dainippon Screen Mfg Co Ltd スリット走査露光式複写カメラの試写像露光装置
JPH01175730A (ja) * 1987-12-29 1989-07-12 Matsushita Electric Ind Co Ltd 露光装置
US5640227A (en) 1993-12-06 1997-06-17 Nikon Corporation Exposure apparatus and exposure method for minimizing defocusing of the transferred pattern
US6018383A (en) * 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
JP2000035677A (ja) * 1998-07-17 2000-02-02 Adtec Engineeng:Kk 露光装置
US6411362B2 (en) * 1999-01-04 2002-06-25 International Business Machines Corporation Rotational mask scanning exposure method and apparatus
AU2003211404A1 (en) * 2002-02-28 2003-09-09 Fujitsu Limited Dynamic pressure bearing manufacturing method, dynamic pressure bearing, and dynamic pressure bearing manufacturing device
JP2007227438A (ja) * 2006-02-21 2007-09-06 Nikon Corp 露光装置及び方法並びに光露光用マスク
JP4984631B2 (ja) 2006-04-28 2012-07-25 株式会社ニコン 露光装置及び方法、露光用マスク、並びにデバイス製造方法
TWI457723B (zh) * 2006-09-08 2014-10-21 尼康股份有限公司 A mask, an exposure device, and an element manufacturing method
JP2009026933A (ja) * 2007-07-19 2009-02-05 Konica Minolta Holdings Inc 電磁波遮蔽フィルムの製造方法及び電磁波遮蔽フィルム
JP2009237305A (ja) * 2008-03-27 2009-10-15 Mitsubishi Paper Mills Ltd マスクパターンフィルムの巻き付け機構及び露光装置
JP2011221536A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスク移動装置、露光装置、基板処理装置及びデバイス製造方法
US20130027684A1 (en) * 2010-04-13 2013-01-31 Tohru Kiuchi Exposure apparatus, substrate processing apparatus, and device manufacturing method
JP5724564B2 (ja) * 2010-04-13 2015-05-27 株式会社ニコン マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法
JP2012252076A (ja) * 2011-06-01 2012-12-20 Nikon Corp 露光装置
WO2013035489A1 (ja) * 2011-09-06 2013-03-14 株式会社ニコン 基板処理装置
WO2013035661A1 (ja) * 2011-09-07 2013-03-14 株式会社ニコン 基板処理装置
WO2013065429A1 (ja) * 2011-11-04 2013-05-10 株式会社ニコン 基板処理装置、及び基板処理方法
TWI641915B (zh) * 2012-01-12 2018-11-21 尼康股份有限公司 基板處理裝置、基板處理方法、及圓筒狀光罩
JP5594328B2 (ja) * 2012-07-19 2014-09-24 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法。
KR101405251B1 (ko) * 2012-09-10 2014-06-17 경북대학교 산학협력단 노광 장치 및 이를 사용한 기판 처리 장치
JP6269660B2 (ja) * 2013-04-30 2018-01-31 株式会社ニコン 基板処理装置、デバイス製造方法及び円筒マスク

Also Published As

Publication number Publication date
KR102019620B1 (ko) 2019-09-06
HK1245419B (zh) 2019-11-29
JP2019074769A (ja) 2019-05-16
CN108227408A (zh) 2018-06-29
TW202014807A (zh) 2020-04-16
JP6638835B2 (ja) 2020-01-29
TWI646407B (zh) 2019-01-01
JP6816814B2 (ja) 2021-01-20
CN105359040B (zh) 2018-01-19
KR101979562B1 (ko) 2019-05-16
CN107390480A (zh) 2017-11-24
HK1246405B (zh) 2020-05-15
TW201809909A (zh) 2018-03-16
JP2020064317A (ja) 2020-04-23
JPWO2014178244A1 (ja) 2017-02-23
CN105359040A (zh) 2016-02-24
TWI681263B (zh) 2020-01-01
JP2019070840A (ja) 2019-05-09
TWI610143B (zh) 2018-01-01
JP6269660B2 (ja) 2018-01-31
CN107390480B (zh) 2019-08-13
TWI717946B (zh) 2021-02-01
KR20180128520A (ko) 2018-12-03
CN107255910B (zh) 2019-04-02
KR20200019782A (ko) 2020-02-24
KR20160003181A (ko) 2016-01-08
CN107255910A (zh) 2017-10-17
KR102079793B1 (ko) 2020-02-21
JP2018081320A (ja) 2018-05-24
TWI677767B (zh) 2019-11-21
WO2014178244A1 (ja) 2014-11-06
JP6662473B2 (ja) 2020-03-11
KR20190104256A (ko) 2019-09-06
KR20180128521A (ko) 2018-12-03
KR102096961B1 (ko) 2020-04-03
KR101924255B1 (ko) 2018-11-30
CN108227408B (zh) 2020-02-14
TW201445262A (zh) 2014-12-01
JP6485535B2 (ja) 2019-03-20
TW201907244A (zh) 2019-02-16
TW201908880A (zh) 2019-03-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220328