HK1215307A1 - 基板處理裝置、器件製造方法、掃描曝光方法、曝光裝置、器件製造系統以及器件製造方法 - Google Patents
基板處理裝置、器件製造方法、掃描曝光方法、曝光裝置、器件製造系統以及器件製造方法Info
- Publication number
- HK1215307A1 HK1215307A1 HK16103193.1A HK16103193A HK1215307A1 HK 1215307 A1 HK1215307 A1 HK 1215307A1 HK 16103193 A HK16103193 A HK 16103193A HK 1215307 A1 HK1215307 A1 HK 1215307A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- device manufacturing
- exposure
- substrate processing
- processing apparatus
- scanning exposure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087650 | 2013-04-18 | ||
JP2013154965 | 2013-07-25 | ||
PCT/JP2014/058109 WO2014171270A1 (ja) | 2013-04-18 | 2014-03-24 | 基板処理装置、デバイス製造方法、走査露光方法、露光装置、デバイス製造システム及びデバイス製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1215307A1 true HK1215307A1 (zh) | 2016-08-19 |
Family
ID=51731223
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18114874.2A HK1255723A1 (zh) | 2013-04-18 | 2016-03-18 | 掃描曝光裝置 |
HK16103193.1A HK1215307A1 (zh) | 2013-04-18 | 2016-03-18 | 基板處理裝置、器件製造方法、掃描曝光方法、曝光裝置、器件製造系統以及器件製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18114874.2A HK1255723A1 (zh) | 2013-04-18 | 2016-03-18 | 掃描曝光裝置 |
Country Status (6)
Country | Link |
---|---|
JP (4) | JP6269658B2 (zh) |
KR (5) | KR102204689B1 (zh) |
CN (4) | CN107908083B (zh) |
HK (2) | HK1255723A1 (zh) |
TW (4) | TWI707211B (zh) |
WO (1) | WO2014171270A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111781806B (zh) * | 2015-10-30 | 2023-06-16 | 株式会社尼康 | 基板处理装置 |
US10983389B2 (en) | 2016-03-04 | 2021-04-20 | Applied Materials, Inc. | Wire grid polarizer manufacturing method |
US10541165B2 (en) * | 2016-11-10 | 2020-01-21 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port backplane |
CN106950801A (zh) * | 2017-04-16 | 2017-07-14 | 合肥芯碁微电子装备有限公司 | 一种无掩膜激光直写光刻设备的快速边缘曝光方法 |
CN111566559B (zh) * | 2018-01-10 | 2023-12-12 | 凸版印刷株式会社 | 光掩模 |
JP7232586B2 (ja) * | 2018-07-31 | 2023-03-03 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP7358970B2 (ja) * | 2018-12-26 | 2023-10-11 | 株式会社デンソーウェーブ | 光学的情報読取装置 |
CN109760407A (zh) * | 2019-03-09 | 2019-05-17 | 深圳市正鑫源实业有限公司 | 智能凸版印刷压印力的控制方法及其凸版印刷*** |
US10880528B1 (en) * | 2019-10-31 | 2020-12-29 | Christie Digital Systems Usa, Inc. | Device, system and method for modulating light using a phase light modulator and a spatial light modulator |
TWI724867B (zh) * | 2020-04-16 | 2021-04-11 | 光群雷射科技股份有限公司 | 轉印式滾輪的製造方法及轉印式滾輪 |
CN111510141B (zh) * | 2020-06-03 | 2023-09-15 | 江苏集萃微纳自动化***与装备技术研究所有限公司 | 微型原子钟物理封装及微型原子钟 |
CN111965954B (zh) * | 2020-09-09 | 2022-12-30 | 中国科学院光电技术研究所 | 一种掩模与基底相对同轴旋转的曝光装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3101473B2 (ja) * | 1993-11-05 | 2000-10-23 | キヤノン株式会社 | 露光方法及び該露光方法を用いるデバイス製造方法 |
JP2000035677A (ja) * | 1998-07-17 | 2000-02-02 | Adtec Engineeng:Kk | 露光装置 |
KR200214060Y1 (ko) * | 1998-12-31 | 2001-09-25 | 배진원 | 벨트장력 조절장치 |
KR100927560B1 (ko) * | 2002-01-29 | 2009-11-23 | 가부시키가이샤 니콘 | 이미지 형성 상태 조정 시스템, 노광 방법 및 노광 장치, 그리고 프로그램 및 정보 기록 매체 |
JP2007227438A (ja) * | 2006-02-21 | 2007-09-06 | Nikon Corp | 露光装置及び方法並びに光露光用マスク |
JP2009528561A (ja) * | 2006-02-28 | 2009-08-06 | マイクロニック レーザー システムズ アクチボラゲット | 基材を処理し、解析する、プラットフォーム、装置、システム、及び方法 |
JP4984631B2 (ja) | 2006-04-28 | 2012-07-25 | 株式会社ニコン | 露光装置及び方法、露光用マスク、並びにデバイス製造方法 |
TWI457723B (zh) * | 2006-09-08 | 2014-10-21 | 尼康股份有限公司 | A mask, an exposure device, and an element manufacturing method |
JP5181451B2 (ja) * | 2006-09-20 | 2013-04-10 | 株式会社ニコン | マスク、露光装置及び露光方法、並びにデバイス製造方法 |
JP2008216653A (ja) | 2007-03-05 | 2008-09-18 | Fujifilm Corp | 露光装置のフォトマスク保持構造、及び保持方法 |
JP5282895B2 (ja) * | 2009-03-06 | 2013-09-04 | 株式会社ニコン | 露光装置、露光方法、およびデバイス製造方法 |
JP2011033907A (ja) * | 2009-08-04 | 2011-02-17 | Nikon Corp | 照明装置、露光装置、照明方法、露光方法及びデバイス製造方法 |
JP2011104957A (ja) * | 2009-11-20 | 2011-06-02 | Ihi Corp | 印刷装置の印圧制御方法及び装置 |
JP2011221536A (ja) * | 2010-04-13 | 2011-11-04 | Nikon Corp | マスク移動装置、露光装置、基板処理装置及びデバイス製造方法 |
US20130027684A1 (en) * | 2010-04-13 | 2013-01-31 | Tohru Kiuchi | Exposure apparatus, substrate processing apparatus, and device manufacturing method |
JP5724564B2 (ja) | 2010-04-13 | 2015-05-27 | 株式会社ニコン | マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法 |
WO2013035696A1 (ja) | 2011-09-05 | 2013-03-14 | 株式会社ニコン | 基板搬送装置及び基板処理装置 |
WO2013035489A1 (ja) * | 2011-09-06 | 2013-03-14 | 株式会社ニコン | 基板処理装置 |
WO2013035661A1 (ja) * | 2011-09-07 | 2013-03-14 | 株式会社ニコン | 基板処理装置 |
JP2013213983A (ja) * | 2012-04-03 | 2013-10-17 | Nikon Corp | 露光装置及びデバイス製造方法 |
WO2013157356A1 (ja) * | 2012-04-19 | 2013-10-24 | 株式会社ニコン | マスクユニット及び基板処理装置 |
-
2014
- 2014-03-24 CN CN201711078129.4A patent/CN107908083B/zh active Active
- 2014-03-24 KR KR1020207017897A patent/KR102204689B1/ko active IP Right Grant
- 2014-03-24 KR KR1020197034564A patent/KR102126981B1/ko active IP Right Grant
- 2014-03-24 KR KR1020197004930A patent/KR102005701B1/ko active IP Right Grant
- 2014-03-24 CN CN201611264164.0A patent/CN106933066B/zh active Active
- 2014-03-24 WO PCT/JP2014/058109 patent/WO2014171270A1/ja active Application Filing
- 2014-03-24 CN CN201480034715.7A patent/CN105339846B/zh active Active
- 2014-03-24 KR KR1020197021656A patent/KR102062509B1/ko active IP Right Grant
- 2014-03-24 CN CN201810312226.3A patent/CN108710263B/zh active Active
- 2014-03-24 JP JP2015512375A patent/JP6269658B2/ja active Active
- 2014-03-24 KR KR1020157032598A patent/KR101956973B1/ko active IP Right Grant
- 2014-03-31 TW TW108131088A patent/TWI707211B/zh active
- 2014-03-31 TW TW103111893A patent/TWI610142B/zh active
- 2014-03-31 TW TW106134986A patent/TWI640841B/zh active
- 2014-03-31 TW TW107130374A patent/TWI672568B/zh active
-
2016
- 2016-03-18 HK HK18114874.2A patent/HK1255723A1/zh unknown
- 2016-03-18 HK HK16103193.1A patent/HK1215307A1/zh not_active IP Right Cessation
-
2017
- 2017-03-08 JP JP2017044411A patent/JP6380583B2/ja active Active
- 2017-12-26 JP JP2017250254A patent/JP6515993B2/ja active Active
-
2019
- 2019-04-16 JP JP2019078021A patent/JP6773168B2/ja active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20230328 |