HK1184124A1 - Cover tape for packaging electronic component - Google Patents

Cover tape for packaging electronic component

Info

Publication number
HK1184124A1
HK1184124A1 HK13111636.2A HK13111636A HK1184124A1 HK 1184124 A1 HK1184124 A1 HK 1184124A1 HK 13111636 A HK13111636 A HK 13111636A HK 1184124 A1 HK1184124 A1 HK 1184124A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
cover tape
packaging electronic
packaging
tape
Prior art date
Application number
HK13111636.2A
Other languages
English (en)
Chinese (zh)
Inventor
增井健
平松正幸
Original Assignee
住友電木株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電木株式會社 filed Critical 住友電木株式會社
Publication of HK1184124A1 publication Critical patent/HK1184124A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D50/00—Closures with means for discouraging unauthorised opening or removal thereof, with or without indicating means, e.g. child-proof closures
    • B65D50/02—Closures with means for discouraging unauthorised opening or removal thereof, with or without indicating means, e.g. child-proof closures openable or removable by the combination of plural actions
    • B65D50/06—Closures with means for discouraging unauthorised opening or removal thereof, with or without indicating means, e.g. child-proof closures openable or removable by the combination of plural actions requiring the combination of different actions in succession
    • B65D50/067—Closures with means for discouraging unauthorised opening or removal thereof, with or without indicating means, e.g. child-proof closures openable or removable by the combination of plural actions requiring the combination of different actions in succession using integral or non-integral accessories, e.g. tool, key
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/40—Closed containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
HK13111636.2A 2010-09-30 2013-10-16 Cover tape for packaging electronic component HK1184124A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010221536 2010-09-30
JP2011072187 2011-03-29
PCT/JP2011/072150 WO2012043608A1 (ja) 2010-09-30 2011-09-28 電子部品包装用カバーテープ

Publications (1)

Publication Number Publication Date
HK1184124A1 true HK1184124A1 (en) 2014-01-17

Family

ID=45893047

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13111636.2A HK1184124A1 (en) 2010-09-30 2013-10-16 Cover tape for packaging electronic component

Country Status (10)

Country Link
US (1) US9127190B2 (ja)
EP (1) EP2623433B1 (ja)
JP (1) JP2012214252A (ja)
KR (1) KR101819777B1 (ja)
CN (1) CN103153810B (ja)
HK (1) HK1184124A1 (ja)
MY (1) MY170273A (ja)
SG (1) SG189015A1 (ja)
TW (1) TWI511907B (ja)
WO (1) WO2012043608A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564151B (zh) * 2011-03-30 2017-01-01 住友電木股份有限公司 薄膜及包裝體
SG10201801390VA (en) 2013-09-02 2018-04-27 Denka Company Ltd Cover film and electronic component package
JP6201751B2 (ja) * 2013-12-27 2017-09-27 住友ベークライト株式会社 包装用カバーテープ
CN105934396B (zh) 2014-01-29 2018-12-18 住友电木株式会社 电子部件包装用盖带
JP6357791B2 (ja) * 2014-02-12 2018-07-18 東ソー株式会社 易剥離性フィルム
JP2015166253A (ja) * 2014-03-04 2015-09-24 住友ベークライト株式会社 電子部品包装用カバーテープ及び電子部品包装体
JP2016023939A (ja) * 2014-07-16 2016-02-08 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR102337822B1 (ko) * 2014-08-15 2021-12-09 덴카 주식회사 커버 필름 및 이를 이용한 전자 부품 포장체
JP6507599B2 (ja) * 2014-12-01 2019-05-08 住友ベークライト株式会社 カバーテープ、電子部品包装用包材および電子部品包装体
WO2016143600A1 (ja) * 2015-03-10 2016-09-15 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品用包装体
JP2016182989A (ja) * 2015-03-27 2016-10-20 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体
CN105440966B (zh) * 2015-12-17 2018-03-06 浙江洁美电子科技股份有限公司 一种电子元器件用上胶带及其生产工艺
KR20190003470A (ko) * 2016-04-28 2019-01-09 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트
EP3338829A1 (en) * 2016-12-23 2018-06-27 Sanofi-Aventis Deutschland GmbH Medical device packaging
JP2018111523A (ja) * 2017-01-12 2018-07-19 信越ポリマー株式会社 耐熱カバーテープ及びその製造方法
JP6763421B2 (ja) * 2018-09-18 2020-09-30 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JPWO2020196031A1 (ja) * 2019-03-27 2020-10-01
JP7483334B2 (ja) * 2019-07-19 2024-05-15 出光ユニテック株式会社 積層シートおよび電子部品収容容器
TWI723492B (zh) * 2019-08-14 2021-04-01 錼創顯示科技股份有限公司 黏取元件、微型發光二極體光學檢修設備及光學檢修方法
JP6950773B1 (ja) * 2020-03-17 2021-10-13 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
KR102232958B1 (ko) 2020-12-08 2021-03-26 김동준 방수목적의 전자부품 이송 및 표면 실장을 위한 커버테이프 및 그 제조장치
WO2023043010A1 (ko) * 2021-09-14 2023-03-23 한화솔루션 주식회사 조색이 가능한 미끄럼 방지용 전도성 수지 조성물 및 이를 포함하는 다층 성형품

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997019140A1 (en) 1995-11-22 1997-05-29 Sumitomo Bakelite Company, Limited Cover tape for packaging electronic components
JP3563863B2 (ja) * 1996-02-09 2004-09-08 大日本印刷株式会社 カバーテープ
JP2000142786A (ja) 1998-11-13 2000-05-23 Shin Etsu Polymer Co Ltd トップテープ
JP2001294677A (ja) * 2000-04-14 2001-10-23 Denki Kagaku Kogyo Kk ヒートシール用フィルム
JP4453789B2 (ja) 2000-04-27 2010-04-21 アキレス株式会社 導電性カバーテープ
DE60213914T2 (de) 2001-06-26 2007-02-22 Sumitomo Bakelite Co. Ltd. Abdeckband zum Verpacken von elektronischen Komponenten
KR101035526B1 (ko) * 2004-04-26 2011-05-23 덴끼 가가꾸 고교 가부시키가이샤 커버 테이프 및 전자 부품 포장용 캐리어 테이프 시스템
JP2006188679A (ja) * 2004-12-09 2006-07-20 Toho Chem Ind Co Ltd 帯電防止剤及び帯電防止性を有する多層フィルム、シ−ト及び成形体
JP2006281452A (ja) * 2005-03-31 2006-10-19 Dainippon Ink & Chem Inc 帯電防止性積層シート及びその成形品
JP4899593B2 (ja) 2005-04-07 2012-03-21 住友ベークライト株式会社 電子部品包装用カバーテープ
KR100964050B1 (ko) * 2005-05-19 2010-06-16 닛토덴코 가부시키가이샤 포장재용 적층 테이프
JP2007002020A (ja) * 2005-06-21 2007-01-11 Mitsubishi Plastics Ind Ltd 精密部品用成形体
JP4982168B2 (ja) * 2006-12-21 2012-07-25 日本ポリプロ株式会社 静電防止シートおよびそれを用いた成型体
JP5137102B2 (ja) * 2007-03-07 2013-02-06 寛治 林 帯電防止性接着剤の主剤用溶液及び帯電防止性ドライラミネート用接着剤及び帯電防止性複合フィルム
JP5554561B2 (ja) 2007-04-11 2014-07-23 住友ベークライト株式会社 電子部品包装体

Also Published As

Publication number Publication date
KR101819777B1 (ko) 2018-01-17
EP2623433A1 (en) 2013-08-07
WO2012043608A1 (ja) 2012-04-05
MY170273A (en) 2019-07-16
US9127190B2 (en) 2015-09-08
CN103153810B (zh) 2015-01-14
TWI511907B (zh) 2015-12-11
JP2012214252A (ja) 2012-11-08
TW201233601A (en) 2012-08-16
CN103153810A (zh) 2013-06-12
SG189015A1 (en) 2013-05-31
US20130244027A1 (en) 2013-09-19
EP2623433B1 (en) 2018-12-19
KR20130114118A (ko) 2013-10-16
EP2623433A4 (en) 2014-06-04

Similar Documents

Publication Publication Date Title
HK1184124A1 (en) Cover tape for packaging electronic component
EP2637204A4 (en) PACKAGE FOR STORING ELECTRONIC COMPONENTS
EP2591412A4 (en) COVER FOR ELECTRONIC DEVICE
GB2484679B (en) Cases for portable electronic devices
HK1147167A2 (en) Electronic device
HK1198754A1 (zh) 用於電子裝置的加壓防水殼體
EP2613852A4 (en) ELECTRONIC COMPONENT HOUSING FOR INFLATABLE OBJECT
GB201100913D0 (en) Additive package for toner
EP2560242A4 (en) ELECTRONIC COMPONENT
GB2495862B (en) Cover tape
TWI368130B (en) Electronic device
HK1165771A1 (en) Cover tape for packaging electronic part and electronic part package
SG10201602865TA (en) Cover tape
EP2555268A4 (en) ELECTRONIC DEVICE
EP2444374A4 (en) HUMIDITY-RESISTANT FILM FOR ELECTRONIC DEVICES
EP2628690A4 (en) cover
GB2493464B (en) Electronic device
GB2477492B (en) Integrated circuit package
SG11201400174QA (en) Heat-sealing cover film for packaging electronic components
AU342867S (en) Case for electronic device
EP2722290A4 (en) COVER TAPE
EP2629493A4 (en) HOUSING FOR ELECTRONIC DEVICE
EP2538302A4 (en) ELECTRONIC DEVICE
EP2642248A4 (en) ELECTRONIC DEVICE
EP2637419A4 (en) ELECTRONIC DEVICE

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20191002