CN105440966B - 一种电子元器件用上胶带及其生产工艺 - Google Patents
一种电子元器件用上胶带及其生产工艺 Download PDFInfo
- Publication number
- CN105440966B CN105440966B CN201510947105.2A CN201510947105A CN105440966B CN 105440966 B CN105440966 B CN 105440966B CN 201510947105 A CN201510947105 A CN 201510947105A CN 105440966 B CN105440966 B CN 105440966B
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive layer
- thermal adhesive
- adhesive tape
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 34
- 238000005516 engineering process Methods 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 79
- 239000012790 adhesive layer Substances 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000003208 petroleum Substances 0.000 claims abstract description 6
- 229920006124 polyolefin elastomer Polymers 0.000 claims abstract description 6
- 229920006132 styrene block copolymer Polymers 0.000 claims abstract description 6
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims abstract description 6
- 150000003505 terpenes Chemical class 0.000 claims abstract description 6
- 235000007586 terpenes Nutrition 0.000 claims abstract description 6
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims description 22
- 238000007765 extrusion coating Methods 0.000 claims description 11
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 11
- 229920002635 polyurethane Polymers 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 239000003643 water by type Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 3
- JSLMNNPQKHONFW-UHFFFAOYSA-N benzene naphthalene-1-carboxylic acid Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)O.C1=CC=CC=C1 JSLMNNPQKHONFW-UHFFFAOYSA-N 0.000 claims 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 claims 1
- 150000004040 pyrrolidinones Chemical class 0.000 claims 1
- 239000004615 ingredient Substances 0.000 abstract description 3
- 239000011229 interlayer Substances 0.000 abstract description 3
- 238000005461 lubrication Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000003068 static effect Effects 0.000 abstract description 3
- -1 hexamethyl phosphoric acid Chemical compound 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000011017 operating method Methods 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及一种电子元器件用上胶带及其生产工艺,上胶带包括热粘合层、热粘合层之上的中间层和中间层之上的基材层以及涂覆于所述热粘合层的粘贴面的防静电层,所述热粘合层的主成分包括下列重量百分比的组分:30~80wt%乙烯基聚合物、5~15wt%聚烯烃弹性体、5~20wt%氢化石油树脂、5~20wt%萜烯树脂、5~15wt%氢化苯乙烯嵌段共聚物。本发明通过对热粘合层和防静电层的配方组分进行改进,一方面通过热粘合层本身的改进来提高热粘合层的耐热性,另一方面,通过防静电层降低了热粘合层和基材层间的摩擦系数,起到了润滑作用,有效防止了热粘合层和基材层发生粘连,又能明显提高上胶带的防静电能力,避免静电导致电子元器件的破损。
Description
技术领域
本发明涉及一种电子元器件用上胶带及其生产工艺,属于电子元器件载带技术领域。
背景技术
电子元器件在运输过程中,需要借助载带,为了防止电子元器件掉出载带的口袋,需要用上胶带将载带上表面进行封装。现有的上胶带包括基材层与热粘合层,通过热粘合层与载带热粘合进行密封,如专利号为CN103153810B的中国发明专利公开的一种电子部件包装用盖带,具有合适透明度并能抑制剥离时静电的产生,但是在热粘合时,由于热粘合层软化点过低,热封过程中,有粘附元器件的风险,储存、使用时热粘合层和基材层易发生粘连;而且,抗静电的效果不明显,经常会碰到电子元器件的贴附,甚至破坏。上胶带的结构与组分需要进一步改进。
发明内容
本发明的目的是提供一种电子元器件用上胶带,通过对热粘合层的组分做出改进,有效防止了热粘合层与基材层的粘连,降低粘连电子元器件的风险,防静电效果显著。
本发明还有一目的是通过上述上胶带的生产工艺,通过简单的工艺,实现各层的功能,降低了生产成本,减少生产能耗。
为了实现本发明的第一目的,采用如下的技术方案:一种电子元器件用上胶带,包括与载带的上表面的粘接的热粘合层、覆盖于所述热粘合层之上的中间层和覆盖于所述中间层之上的基材层以及涂覆于所述热粘合层的粘贴面的防静电层,所述热粘合层的主成分包括下列重量百分比的组分:
30~80wt%乙烯基聚合物、
5~15wt%聚烯烃弹性体、
5~20wt%氢化石油树脂、
5~20wt%萜烯树脂、
5~15wt%氢化苯乙烯嵌段共聚物;
所述防静电层的主成分包括下列重量百分比的组分:
5~40wt%PEDOT-PSS水分散液、
15~25wt%水性聚氨酯粘合树脂、
25~45wt%溶剂、
15~25wt%去离子水、
1~6wt%极性改善剂、
0.5~2wt%表面活性剂、
0.1 ~1wt%防粘剂、
0.1~1wt%硅烷偶联剂。
通过实施上述技术方案,改进了热粘合层的配方组分,保持良好流动性的同时可提高热粘合层的耐热性,有效防止了热粘合层与基材层的粘连,降低粘连电子元器件的风险;改进后的防静电层有不受环境温湿度影响,附着力好,防静电性持久等优点,在保持良好附着力的同时,不影响热封;防粘连剂的加入,降低了热粘合层和基材层间的摩擦系数,起到了润滑作用,有效防止了热粘合层和基材层发生粘连。
作为上述技术方案的优选,水性聚氨酯粘合树脂采用有机硅改性的水性聚氨酯粘合树脂。
作为上述技术方案的优选,所述极性改善剂为N-甲基吡咯烷酮、六甲基磷酸三酰胺和四甲基乙二胺中的一种或几种混合物。
作为上述技术方案的优选,所述基材层原料为聚对苯二甲酸乙二醇酯,所述的中间层为聚乙烯树脂层。
作为上述技术方案的优选,所述中间层的厚度为10~30 μm,所述热粘合层的厚度为10~30 μm,
作为上述技术方案的优选,所述载带还包括设置在所述基材层与所述中间层之间的连接层,所述连接层的成分为单组分或多组分聚氨酯粘合剂,厚度为1~5μm。
为了达到本发明的第二目的,采用如下的技术方案:一种电子元器件用上胶带的生产工艺,(1)以聚对苯二甲酸乙二醇酯为原料,双向拉伸形成基材层;(2)在所述基材层上通过挤出涂覆方式,得到中间层;(3)在所述中间层上通过挤出涂覆方式,得到热粘合层;(4)在所述热粘合层上涂覆防静电层,并烘干,得到上胶带。
作为优选,步骤(4)所述的烘干,采用两段式烘干方式,第一段,温度控制100-110℃,停留时间15-30s;第二段温度控制70-85℃,停留时间10-20s。
作为优选,步骤(4)所述的烘干采用烘箱,第一段所述烘箱的长度为6-9m,第二段所述烘箱的长度为3-6m。
通过实施上述技术方案,本发明通过对热粘合层和防静电层的配方组分进行改进,一方面通过热粘合层本身的改进来提高热粘合层的耐热性,另一方面,通过防静电层降低了热粘合层和基材层间的摩擦系数,起到了润滑作用,有效防止了热粘合层和基材层发生粘连,又能明显提高上胶带的防静电能力,表面电阻率可达E+07~E+08,避免静电导致电子元器件的破损。
具体实施方式
下面结合具体的实施例,对本发明作进一步详细说明。
实施例1:
一种电子元器件用上胶带,包括与载带的上表面的粘接的热粘合层、覆盖于所述热粘合层之上的中间层和覆盖于所述中间层之上的基材层以及涂覆于所述热粘合层的粘贴面的防静电层;中间层厚度为20 μm,热粘合层的厚度为15μm。
基材层原料为聚对苯二甲酸乙二醇酯,所述的中间层为聚乙烯树脂层;
中间层为聚乙烯树脂层;
所述热粘合层包括下列重量百分比的组分:
30wt%乙烯基聚合物、
15wt%聚烯烃弹性体、
20wt%氢化石油树脂、
20wt%萜烯树脂、
15wt%氢化苯乙烯嵌段共聚物;
所述防静电层的包括下列重量百分比的组分:
5wt%PEDOT-PSS水分散液、
25wt%有机硅改性的水性聚氨酯粘合树脂、
45wt%溶剂、
15wt%去离子水、
6wt%N-甲基吡咯烷酮、
2wt%表面活性剂、
1wt%防粘剂、
1wt%硅烷偶联剂。
上述原料通过下述具体的操作步骤制备上胶带:
(1)以聚对苯二甲酸乙二醇酯为原料,双向拉伸形成基材层;(2)以聚乙烯树脂层为原料,在所述基材层上通过挤出涂覆方式,得到中间层;
(3)通过热粘合层的上述配比的原料在所述中间层上通过挤出涂覆方式,得到热粘合层;
(4)通过防静电层的上述配比原料,得到防静电液,在所述热粘合层上涂覆防静电液,并烘干,得到涂覆后的防静电层,整体即得到上胶带;采用烘箱两段式烘干方式,第一段烘箱的长度为7m,温度控制105℃,停留时间20s;第二段烘箱的长度为5m,温度控制80℃,停留时间15s。
实施例2:
一种电子元器件用上胶带,包括与载带的上表面的粘接的热粘合层、覆盖于所述热粘合层之上的粘合层,覆盖于连接层之上的中间层和覆盖于所述中间层之上的基材层以及涂覆于所述热粘合层的粘贴面的防静电层;中间层厚度为10 μm,热粘合层的厚度为10μm,连接层的厚度为1~5μm,本实施例优选2μm。
基材层原料为聚对苯二甲酸乙二醇酯,所述的中间层为聚乙烯树脂层;
中间层为聚乙烯树脂层;
所述热粘合层包括下列重量百分比的组分:
60wt%乙烯基聚合物、
10wt%聚烯烃弹性体、
10wt%氢化石油树脂、
10wt%萜烯树脂、
10wt%氢化苯乙烯嵌段共聚物;
所述防静电层的包括下列重量百分比的组分:
40wt%PEDOT-PSS水分散液、
15wt%有机硅改性的水性聚氨酯粘合树脂、
25wt%溶剂、
18wt%去离子水、
1wt%六甲基磷酸三酰胺、
0.8wt%表面活性剂、
0.1 wt%防粘剂、
0.1wt%硅烷偶联剂。
上述原料通过下述具体的操作步骤制备上胶带:
(1)以聚对苯二甲酸乙二醇酯为原料,双向拉伸形成基材层;
(2)通过连接层的组分,在所述基材层上通过挤出涂覆方式,得到连接层;
(3)以聚乙烯树脂层为原料,在所述连接层上通过挤出涂覆方式,得到中间层;
(4)通过热粘合层的上述配比的原料在所述中间层上通过挤出涂覆方式,得到热粘合层;
(5)通过防静电层的上述配比原料,得到防静电液,在所述热粘合层上涂覆防静电液,并烘干,得到涂覆后的防静电层,整体即得到上胶带;采用烘箱两段式烘干方式,第一段烘箱的长度为9m,温度控制110℃,停留时间15s;第二段烘箱的长度为6m,温度控制85℃,停留时间10s。
实施例3:
一种电子元器件用上胶带,包括与载带的上表面的粘接的热粘合层、覆盖于所述热粘合层之上的中间层和覆盖于所述中间层之上的基材层以及涂覆于所述热粘合层的粘贴面的防静电层;中间层厚度为30 μm,热粘合层的厚度为10 μm。
基材层原料为聚对苯二甲酸乙二醇酯,所述的中间层为聚乙烯树脂层;
中间层为聚乙烯树脂层;
所述热粘合层包括下列重量百分比的组分:
80wt%乙烯基聚合物、
5wt%聚烯烃弹性体、
5wt%氢化石油树脂、
5wt%萜烯树脂、
5wt%氢化苯乙烯嵌段共聚物;
所述防静电层的包括下列重量百分比的组分:
10wt%PEDOT-PSS水分散液、
25wt%有机硅改性的水性聚氨酯粘合树脂、
45wt%溶剂、
15wt%去离子水、
3wt%极性改善剂、
0.5wt%表面活性剂、
0.5wt%防粘剂、
1wt%硅烷偶联剂。
所述极性改善剂的N-甲基吡咯烷酮和四甲基乙二胺按质量比为2:1混合的混合物。
上述原料通过下述具体的操作步骤制备上胶带:
(1)以聚对苯二甲酸乙二醇酯为原料,双向拉伸形成基材层;
(2)以聚乙烯树脂层为原料,在所述基材层上通过挤出涂覆方式,得到中间层;
(3)通过热粘合层的上述配比的原料在所述中间层上通过挤出涂覆方式,得到热粘合层;
(4)通过防静电层的上述配比原料,得到防静电液,在所述热粘合层上涂覆防静电液,并烘干,得到涂覆后的防静电层,整体即得到上胶带;采用烘箱两段式烘干方式,第一段烘箱的长度为6m,温度控制100℃,停留时间30s;第二段烘箱的长度为5m,温度控制70℃,停留时间20s。
Claims (9)
1.一种电子元器件用上胶带,包括与载带的上表面粘接的热粘合层、覆盖于所述热粘合层之上的中间层和覆盖于所述中间层之上的基材层以及涂覆于所述热粘合层的粘贴面的防静电层,其特征在于,所述热粘合层的主成分包括下列重量百分比的组分:
30~80wt%乙烯基聚合物、
5~15wt%聚烯烃弹性体、
5~20wt%氢化石油树脂、
5~20wt%萜烯树脂、
5~15wt%氢化苯乙烯嵌段共聚物;
所述防静电层的主成分包括下列重量百分比的组分:
5~40wt%PEDOT-PSS水分散液、
15~25wt%水性聚氨酯粘合树脂、
25~45wt%溶剂、
15~25wt%去离子水、
1~6wt%极性改善剂、
0.5~2wt%表面活性剂、
0.1 ~1wt%防粘剂、
0.1~1wt%硅烷偶联剂。
2.根据权利要求1所述一种电子元器件用上胶带,其特征在于,水性聚氨酯粘合树脂采用有机硅改性的水性聚氨酯粘合树脂。
3.根据权利要求1所述一种电子元器件用上胶带,其特征在于,所述极性改善剂为N-甲基吡咯烷酮、六甲基磷酸三酰胺和四甲基乙二胺中的一种或几种混合物。
4.根据权利要求1所述一种电子元器件用上胶带,其特征在于,所述基材层原料为聚对苯二甲酸乙二醇酯,所述的中间层为聚乙烯树脂层。
5.根据权利要求4所述一种电子元器件用上胶带,其特征在于,所述中间层的厚度为10~30 μm,所述热粘合层的厚度为10~30 μm。
6.根据权利要求1所述一种电子元器件用上胶带,其特征在于,所述载带还包括设置在所述基材层与所述中间层之间的连接层,所述连接层的成分为单组分或多组分聚氨酯粘合剂,所述连接层的厚度为1~5μm。
7.如权利要求1所述一种电子元器件用上胶带的生产工艺,其特征在于,(1)以聚对苯二甲酸乙二醇酯为原料,双向拉伸形成基材层;(2)在所述基材层上通过挤出涂覆方式,得到中间层;(3)在所述中间层上通过挤出涂覆方式,得到热粘合层;(4)在所述热粘合层上涂覆防静电层,并烘干,得到上胶带。
8.根据权利要求7所述一种电子元器件用上胶带的生产工艺,其特征在于,步骤(4)所述的烘干,采用两段式烘干方式,第一段,温度控制100-110℃,停留时间15-30s;第二段温度控制70-85℃,停留时间10-20s。
9.根据权利要求7所述一种电子元器件用上胶带的生产工艺,其特征在于,步骤(4)所述的烘干采用烘箱,第一段所述烘箱的长度为6-9m,第二段所述烘箱的长度为3-6m。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510947105.2A CN105440966B (zh) | 2015-12-17 | 2015-12-17 | 一种电子元器件用上胶带及其生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510947105.2A CN105440966B (zh) | 2015-12-17 | 2015-12-17 | 一种电子元器件用上胶带及其生产工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105440966A CN105440966A (zh) | 2016-03-30 |
CN105440966B true CN105440966B (zh) | 2018-03-06 |
Family
ID=55551624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510947105.2A Active CN105440966B (zh) | 2015-12-17 | 2015-12-17 | 一种电子元器件用上胶带及其生产工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105440966B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114874706B (zh) * | 2022-05-25 | 2023-10-20 | 珠海冠宇电池股份有限公司 | 一种胶纸、锂离子电池和锂离子电池的贴胶方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103153810A (zh) * | 2010-09-30 | 2013-06-12 | 住友电木株式会社 | 电子部件包装用盖带 |
CN104191700A (zh) * | 2014-09-02 | 2014-12-10 | 浙江洁美电子科技股份有限公司 | 一种用于mlcc流延的离型膜 |
CN104210195A (zh) * | 2014-09-02 | 2014-12-17 | 浙江洁美电子科技股份有限公司 | 一种高密着性防静电离型膜 |
-
2015
- 2015-12-17 CN CN201510947105.2A patent/CN105440966B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103153810A (zh) * | 2010-09-30 | 2013-06-12 | 住友电木株式会社 | 电子部件包装用盖带 |
CN104191700A (zh) * | 2014-09-02 | 2014-12-10 | 浙江洁美电子科技股份有限公司 | 一种用于mlcc流延的离型膜 |
CN104210195A (zh) * | 2014-09-02 | 2014-12-17 | 浙江洁美电子科技股份有限公司 | 一种高密着性防静电离型膜 |
Also Published As
Publication number | Publication date |
---|---|
CN105440966A (zh) | 2016-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011517327A5 (zh) | ||
JP2016505678A (ja) | ゲッター材料を含む接着テープ | |
TWI681034B (zh) | 具有可活化吸氣劑材料之黏著劑、其用途及應用方法,及保護有機電子裝置之方法 | |
CN101740351A (zh) | 切割模片接合膜以及半导体器件的生产方法 | |
JP2015504453A5 (zh) | ||
CN110462856A (zh) | 热电转换元件层及其制造方法 | |
CN108842520A (zh) | 一种耐高温高导热槽绝缘复合材料及其制备方法 | |
CN103666369A (zh) | 一种耐热性优异的热熔胶粘剂及热熔胶带 | |
CN105440966B (zh) | 一种电子元器件用上胶带及其生产工艺 | |
CN112961639B (zh) | 一种医用透析纸无菌包装袋用水性热熔胶及其制备工艺 | |
CN105073930B (zh) | 从平面结构体移除渗透物的方法及相应胶带 | |
CN106318311A (zh) | 粘合剂 | |
CN105751640A (zh) | 一种用于新能源汽车锂电池组的pet薄膜 | |
CN104130704A (zh) | 一种低剥离力的溶剂型纸张隔离剂及其制备方法 | |
CN101759909B (zh) | 免涂可直接复合膜添加剂 | |
CN102277095A (zh) | 具有防紫外线功能的预涂膜 | |
CN206127197U (zh) | 新型热覆合不干胶复合材料和不干胶标签 | |
WO2012026682A3 (ko) | 무점착 송장 라벨과 이의 제조방법 | |
CN203960112U (zh) | 一种耐紫外热熔型压敏胶带 | |
CN211968730U (zh) | 一种数码印刷软包装用复合型热贴膜 | |
CN106183227B (zh) | 长效抗菌型泡罩包装材料 | |
JP2012121151A (ja) | 積層体及び包装材料 | |
CN106221593A (zh) | 一种抗菌胶带及其制备方法 | |
CN202401010U (zh) | 防焊胶带 | |
CN109435392A (zh) | 高阻隔聚烯烃复合膜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |