HK1169861A1 - 曝光裝置、曝光方法以及器件製造方法 - Google Patents

曝光裝置、曝光方法以及器件製造方法

Info

Publication number
HK1169861A1
HK1169861A1 HK12110446.5A HK12110446A HK1169861A1 HK 1169861 A1 HK1169861 A1 HK 1169861A1 HK 12110446 A HK12110446 A HK 12110446A HK 1169861 A1 HK1169861 A1 HK 1169861A1
Authority
HK
Hong Kong
Prior art keywords
exposure
device manufacturing
exposure apparatus
exposure method
manufacturing
Prior art date
Application number
HK12110446.5A
Other languages
English (en)
Inventor
柴崎祐
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1169861A1 publication Critical patent/HK1169861A1/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975Assembly, maintenance, transport or storage of apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Multimedia (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Transform (AREA)
HK12110446.5A 2007-12-28 2012-10-19 曝光裝置、曝光方法以及器件製造方法 HK1169861A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007340460 2007-12-28
JP2007340641 2007-12-28
JP2008110766 2008-04-21
JP2008303735 2008-11-28

Publications (1)

Publication Number Publication Date
HK1169861A1 true HK1169861A1 (zh) 2013-02-08

Family

ID=40823980

Family Applications (4)

Application Number Title Priority Date Filing Date
HK10104653.8A HK1137093A1 (en) 2007-12-28 2010-05-13 Exposure apparatus, exposure method and device manufacturing method
HK12110446.5A HK1169861A1 (zh) 2007-12-28 2012-10-19 曝光裝置、曝光方法以及器件製造方法
HK12110452.6A HK1169716A1 (zh) 2007-12-28 2012-10-19 曝光裝置、移動體驅動系統、圖案形成裝置、以及曝光方法
HK14112391.4A HK1199108A1 (zh) 2007-12-28 2014-12-09 曝光裝置、曝光方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK10104653.8A HK1137093A1 (en) 2007-12-28 2010-05-13 Exposure apparatus, exposure method and device manufacturing method

Family Applications After (2)

Application Number Title Priority Date Filing Date
HK12110452.6A HK1169716A1 (zh) 2007-12-28 2012-10-19 曝光裝置、移動體驅動系統、圖案形成裝置、以及曝光方法
HK14112391.4A HK1199108A1 (zh) 2007-12-28 2014-12-09 曝光裝置、曝光方法

Country Status (7)

Country Link
US (5) US9229333B2 (zh)
JP (12) JP5088588B2 (zh)
KR (3) KR101477833B1 (zh)
CN (4) CN101681809B (zh)
HK (4) HK1137093A1 (zh)
TW (7) TWI602033B (zh)
WO (1) WO2009084244A1 (zh)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101711323B1 (ko) 2006-08-31 2017-02-28 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
CN104460241B (zh) * 2006-08-31 2017-04-05 株式会社尼康 移动体驱动***及方法、图案形成装置及方法、曝光装置及方法、组件制造方法
EP2071612B1 (en) 2006-08-31 2017-10-04 Nikon Corporation Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TWI434326B (zh) 2006-09-01 2014-04-11 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method
KR101529851B1 (ko) 2006-09-01 2015-06-17 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
WO2009084244A1 (ja) 2007-12-28 2009-07-09 Nikon Corporation 露光装置、移動体駆動システム、パターン形成装置、及び露光方法、並びにデバイス製造方法
US8514395B2 (en) * 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8493547B2 (en) * 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP2011168028A (ja) * 2010-02-22 2011-09-01 Ricoh Co Ltd 画像形成装置
CN102608861A (zh) * 2011-01-19 2012-07-25 上海华虹Nec电子有限公司 一种改善硅片周边光刻胶形貌的方法
CN102591205B (zh) * 2012-02-29 2013-07-31 清华大学 化学机械抛光传输机器人的递归优化控制***
CN102540896B (zh) * 2012-02-29 2013-07-17 清华大学 化学机械抛光传输机器人的非线性模糊结合递归控制***
NL2011253A (en) 2012-08-23 2014-02-25 Asml Netherlands Bv Lithographic apparatus, device manufacturing method and displacement measurement system.
US9958424B2 (en) * 2012-10-01 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method of identifying airborne molecular contamination source
CN104798178B (zh) 2012-10-02 2018-07-20 株式会社尼康 移动体装置、曝光装置以及器件制造方法
US9772564B2 (en) * 2012-11-12 2017-09-26 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
KR102080875B1 (ko) * 2013-01-23 2020-04-16 삼성디스플레이 주식회사 스테이지 이송 장치 및 이를 이용한 스테이지 위치 측정 방법
CN104111596A (zh) * 2013-04-16 2014-10-22 上海微电子装备有限公司 用于光刻设备的全局调平的装置和方法
JP2014216631A (ja) * 2013-04-30 2014-11-17 キヤノン株式会社 描画装置、及び物品の製造方法
JP6193611B2 (ja) * 2013-04-30 2017-09-06 キヤノン株式会社 描画装置、及び物品の製造方法
KR102574558B1 (ko) 2015-02-23 2023-09-04 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 관리 방법, 중첩 계측 방법 및 디바이스 제조 방법
EP3680717A1 (en) 2015-02-23 2020-07-15 Nikon Corporation Substrate processing system and substrate processing method, and device manufacturing method
KR102552792B1 (ko) 2015-02-23 2023-07-06 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법
CN105045042B (zh) * 2015-04-23 2017-06-16 清华大学 一种硅片台曝光区域六自由度位移测量方法
KR20180059814A (ko) * 2015-09-30 2018-06-05 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
KR20180059810A (ko) * 2015-09-30 2018-06-05 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 플랫 패널 디스플레이 제조 방법
CN205427436U (zh) * 2016-03-23 2016-08-03 北京京东方光电科技有限公司 显示器件的对位检测设备及曝光工艺***
NL2019071A (en) * 2016-07-07 2018-01-11 Asml Netherlands Bv An Inspection Substrate and an Inspection Method
TWI604290B (zh) * 2016-10-31 2017-11-01 智泰科技股份有限公司 具有空間位置誤差補償的數值控制工具機
JP6909021B2 (ja) * 2017-03-07 2021-07-28 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP6945316B2 (ja) * 2017-03-24 2021-10-06 キヤノン株式会社 検出装置、パターン形成装置、取得方法、検出方法、および物品製造方法
CN106950801A (zh) * 2017-04-16 2017-07-14 合肥芯碁微电子装备有限公司 一种无掩膜激光直写光刻设备的快速边缘曝光方法
US10522557B2 (en) 2017-10-30 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Surface topography by forming spacer-like components
CN109957504B (zh) * 2017-12-14 2022-08-02 长春长光华大智造测序设备有限公司 便于初始对准的高通量基因测序仪硅片及初始对准方法
KR20190092906A (ko) 2018-01-31 2019-08-08 김믿음 칼날 배수구망
US10591815B2 (en) * 2018-06-28 2020-03-17 Applied Materials, Inc. Shifting of patterns to reduce line waviness
CN112585539A (zh) * 2018-08-23 2021-03-30 Asml荷兰有限公司 用于校准物体装载过程的平台设备和方法
JP7278138B2 (ja) * 2019-04-18 2023-05-19 キヤノン株式会社 基板処理装置、物品製造方法、基板処理方法、基板処理システム、管理装置、およびプログラム
US11764111B2 (en) * 2019-10-24 2023-09-19 Texas Instruments Incorporated Reducing cross-wafer variability for minimum width resistors
JP2023000112A (ja) * 2021-06-17 2023-01-04 キオクシア株式会社 計測装置および計測プログラム
CN113506746B (zh) * 2021-06-28 2024-03-19 华虹半导体(无锡)有限公司 解决超级结工艺打标区域高台阶差的方法
WO2024003608A1 (en) * 2022-06-26 2024-01-04 Nova Ltd Moving apparatus along multiple axes

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144429A (ja) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> 位置合わせ方法、及び位置合せ装置
US4780617A (en) * 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPH0545886A (ja) * 1991-08-12 1993-02-26 Nikon Corp 角形基板の露光装置
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JPH07270122A (ja) * 1994-03-30 1995-10-20 Canon Inc 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法
JPH07335529A (ja) * 1994-06-09 1995-12-22 Nikon Corp 投影露光装置
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
US5677758A (en) * 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
JP3237522B2 (ja) * 1996-02-05 2001-12-10 ウシオ電機株式会社 ウエハ周辺露光方法および装置
JP4029180B2 (ja) * 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
ATE404906T1 (de) * 1996-11-28 2008-08-15 Nikon Corp Ausrichtvorrichtung und belichtungsverfahren
DE69717975T2 (de) * 1996-12-24 2003-05-28 Asml Netherlands Bv In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät
US6262796B1 (en) * 1997-03-10 2001-07-17 Asm Lithography B.V. Positioning device having two object holders
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
EP1063742A4 (en) 1998-03-11 2005-04-20 Nikon Corp ULTRAVIOLET LASER DEVICE AND EXPOSURE APPARATUS COMPRISING SUCH A ULTRAVIOLET LASER DEVICE
JP2000068192A (ja) 1998-08-18 2000-03-03 Nikon Corp 露光装置、露光方法及び位置検出方法
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
TWI223734B (en) * 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
SG107560A1 (en) * 2000-02-25 2004-12-29 Nikon Corp Exposure apparatus and exposure method capable of controlling illumination distribution
US20020041377A1 (en) * 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
US7561270B2 (en) * 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
WO2002019401A1 (fr) * 2000-08-29 2002-03-07 Nikon Corporation Procede et dispositif d'exposition
US6611316B2 (en) * 2001-02-27 2003-08-26 Asml Holding N.V. Method and system for dual reticle image exposure
JP2002280283A (ja) 2001-03-16 2002-09-27 Canon Inc 基板処理装置
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JP2003037153A (ja) * 2001-07-25 2003-02-07 Nikon Corp 保持装置、ステージ装置、および露光装置ならびに半導体デバイス
WO2004012245A1 (ja) * 2002-07-31 2004-02-05 Nikon Corporation 位置計測方法、位置制御方法、露光方法及び露光装置、並びにデバイス製造方法
KR20050035890A (ko) 2002-08-23 2005-04-19 가부시키가이샤 니콘 투영 광학계, 포토리소그래피 방법, 노광 장치 및 그 이용방법
EP2495613B1 (en) 2002-11-12 2013-07-31 ASML Netherlands B.V. Lithographic apparatus
SG2010050110A (en) * 2002-11-12 2014-06-27 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
AU2003302831A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Exposure method, exposure apparatus and method for manufacturing device
AU2003276569A1 (en) 2002-12-13 2004-07-09 Koninklijke Philips Electronics N.V. Liquid removal in a method and device for irradiating spots on a layer
ES2268450T3 (es) 2002-12-19 2007-03-16 Koninklijke Philips Electronics N.V. Metodo y dispositivo para irradiar puntos en una capa.
SG2012087615A (en) 2003-02-26 2015-08-28 Nippon Kogaku Kk Exposure apparatus, exposure method, and method for producing device
KR101521407B1 (ko) 2003-05-06 2015-05-18 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
KR101289979B1 (ko) * 2003-06-19 2013-07-26 가부시키가이샤 니콘 노광 장치 및 디바이스 제조방법
JP4492239B2 (ja) * 2003-07-28 2010-06-30 株式会社ニコン 露光装置及びデバイス製造方法、並びに露光装置の制御方法
WO2005029559A1 (ja) 2003-09-19 2005-03-31 Nikon Corporation 露光装置及びデバイス製造方法
WO2005059617A2 (en) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Projection objective having a high aperture and a planar end surface
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7102729B2 (en) * 2004-02-03 2006-09-05 Asml Netherlands B.V. Lithographic apparatus, measurement system, and device manufacturing method
JP2005317916A (ja) * 2004-03-30 2005-11-10 Canon Inc 露光装置及びデバイス製造方法
WO2005124834A1 (ja) 2004-06-22 2005-12-29 Nikon Corporation ベストフォーカス検出方法及び露光方法、並びに露光装置
KR100550352B1 (ko) * 2004-07-02 2006-02-08 삼성전자주식회사 반도체 기판의 노광방법 및 이를 이용하는 노광 장치
JP4747545B2 (ja) * 2004-09-30 2011-08-17 株式会社ニコン ステージ装置及び露光装置並びにデバイス製造方法
TW201837984A (zh) * 2004-11-18 2018-10-16 日商尼康股份有限公司 曝光裝置、曝光方法、及元件製造方法
KR100585170B1 (ko) * 2004-12-27 2006-06-02 삼성전자주식회사 트윈 기판 스테이지를 구비한 스캐너 장치, 이를 포함하는반도체 사진 설비 및 상기 설비를 이용한 반도체 소자의제조방법
US20060139595A1 (en) * 2004-12-27 2006-06-29 Asml Netherlands B.V. Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness
JP2006278820A (ja) 2005-03-30 2006-10-12 Nikon Corp 露光方法及び装置
JP4677267B2 (ja) * 2005-04-04 2011-04-27 キヤノン株式会社 平面ステージ装置及び露光装置
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161659B2 (en) * 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
WO2006118258A1 (ja) 2005-04-28 2006-11-09 Nikon Corporation 露光方法及び露光装置、並びにデバイス製造方法
JP4410216B2 (ja) * 2005-05-24 2010-02-03 エーエスエムエル ネザーランズ ビー.ブイ. 2ステージ・リソグラフィ装置及びデバイス製造方法
EP1947683A4 (en) 2005-11-09 2010-08-25 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
WO2007077925A1 (ja) * 2005-12-28 2007-07-12 Nikon Corporation パターン形成方法及びパターン形成装置、並びにデバイス製造方法
TWI538012B (zh) * 2006-01-19 2016-06-11 尼康股份有限公司 移動體驅動方法及移動體驅動系統、圖案形成方法及圖案形成裝置、曝光方法及曝光裝置、以及元件製造方法
EP2003679B1 (en) * 2006-02-21 2016-11-16 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
JP5115859B2 (ja) * 2006-02-21 2013-01-09 株式会社ニコン パターン形成装置、露光装置及び露光方法、並びにデバイス製造方法
EP3279739A1 (en) * 2006-02-21 2018-02-07 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US7310132B2 (en) * 2006-03-17 2007-12-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI454859B (zh) * 2006-03-30 2014-10-01 尼康股份有限公司 移動體裝置、曝光裝置與曝光方法以及元件製造方法
CN100504614C (zh) * 2006-04-14 2009-06-24 上海微电子装备有限公司 步进扫描光刻机双台交换定位***
US7483120B2 (en) * 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
TWI425318B (zh) * 2006-06-09 2014-02-01 尼康股份有限公司 移動體裝置、曝光裝置和曝光方法以及元件製造方法
EP2071612B1 (en) * 2006-08-31 2017-10-04 Nikon Corporation Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
CN104460241B (zh) * 2006-08-31 2017-04-05 株式会社尼康 移动体驱动***及方法、图案形成装置及方法、曝光装置及方法、组件制造方法
KR101711323B1 (ko) * 2006-08-31 2017-02-28 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
KR101529851B1 (ko) * 2006-09-01 2015-06-17 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
TWI434326B (zh) * 2006-09-01 2014-04-11 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method
CN100468212C (zh) * 2006-09-22 2009-03-11 上海微电子装备有限公司 双台定位交换***
JP2007274881A (ja) * 2006-12-01 2007-10-18 Nikon Corp 移動体装置、微動体及び露光装置
US7903866B2 (en) * 2007-03-29 2011-03-08 Asml Netherlands B.V. Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object
WO2009084244A1 (ja) 2007-12-28 2009-07-09 Nikon Corporation 露光装置、移動体駆動システム、パターン形成装置、及び露光方法、並びにデバイス製造方法

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