HK1214369A1 - 曝光方法及曝光裝置、以及元件製造方法 - Google Patents
曝光方法及曝光裝置、以及元件製造方法Info
- Publication number
- HK1214369A1 HK1214369A1 HK16101982.0A HK16101982A HK1214369A1 HK 1214369 A1 HK1214369 A1 HK 1214369A1 HK 16101982 A HK16101982 A HK 16101982A HK 1214369 A1 HK1214369 A1 HK 1214369A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- device manufacturing
- exposure apparatus
- exposure method
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
- G06F7/06—Arrangements for sorting, selecting, merging, or comparing data on individual record carriers
- G06F7/20—Comparing separate sets of record carriers arranged in the same sequence to determine whether at least some of the data in one set is identical with that in the other set or sets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23670409P | 2009-08-25 | 2009-08-25 | |
US12/860,097 US8514395B2 (en) | 2009-08-25 | 2010-08-20 | Exposure method, exposure apparatus, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1214369A1 true HK1214369A1 (zh) | 2016-07-22 |
Family
ID=43625432
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12112035.8A HK1171267A1 (zh) | 2009-08-25 | 2012-11-23 | 曝光方法、曝光裝置、以及元件製造方法 |
HK16114078A HK1225812A1 (zh) | 2009-08-25 | 2015-02-09 | 曝光方法、曝光設備以及裝置製造方法 |
HK15101393.4A HK1200924A1 (zh) | 2009-08-25 | 2015-02-09 | 曝光方法、曝光設備以及裝置製造方法 |
HK16101982.0A HK1214369A1 (zh) | 2009-08-25 | 2016-02-23 | 曝光方法及曝光裝置、以及元件製造方法 |
HK16101985.7A HK1214371A1 (zh) | 2009-08-25 | 2016-02-23 | 曝光方法及曝光裝置、以及元件製造方法 |
HK16101983.9A HK1214370A1 (zh) | 2009-08-25 | 2016-02-23 | 曝光方法及曝光裝置、以及元件製造方法 |
HK16103597.3A HK1215733A1 (zh) | 2009-08-25 | 2016-03-30 | 曝光方法、曝光裝置以及器件製造方法 |
HK16103601.7A HK1215734A1 (zh) | 2009-08-25 | 2016-03-30 | 曝光方法及曝光裝置、以及元件製造方法 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12112035.8A HK1171267A1 (zh) | 2009-08-25 | 2012-11-23 | 曝光方法、曝光裝置、以及元件製造方法 |
HK16114078A HK1225812A1 (zh) | 2009-08-25 | 2015-02-09 | 曝光方法、曝光設備以及裝置製造方法 |
HK15101393.4A HK1200924A1 (zh) | 2009-08-25 | 2015-02-09 | 曝光方法、曝光設備以及裝置製造方法 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16101985.7A HK1214371A1 (zh) | 2009-08-25 | 2016-02-23 | 曝光方法及曝光裝置、以及元件製造方法 |
HK16101983.9A HK1214370A1 (zh) | 2009-08-25 | 2016-02-23 | 曝光方法及曝光裝置、以及元件製造方法 |
HK16103597.3A HK1215733A1 (zh) | 2009-08-25 | 2016-03-30 | 曝光方法、曝光裝置以及器件製造方法 |
HK16103601.7A HK1215734A1 (zh) | 2009-08-25 | 2016-03-30 | 曝光方法及曝光裝置、以及元件製造方法 |
Country Status (8)
Country | Link |
---|---|
US (10) | US8514395B2 (zh) |
EP (7) | EP2818928B8 (zh) |
JP (8) | JP5637496B2 (zh) |
KR (7) | KR101539191B1 (zh) |
CN (4) | CN105182694B (zh) |
HK (8) | HK1171267A1 (zh) |
TW (8) | TWI594084B (zh) |
WO (1) | WO2011024984A1 (zh) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8514395B2 (en) | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8493547B2 (en) * | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
JP5832345B2 (ja) * | 2012-03-22 | 2015-12-16 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
DE102012218039A1 (de) * | 2012-10-02 | 2014-04-03 | Schaeffler Technologies Gmbh & Co. Kg | Planarantrieb sowie Verfahren zu dessen Kalibrierung |
KR102203305B1 (ko) * | 2012-10-02 | 2021-01-14 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
CN103198035B (zh) * | 2013-02-28 | 2016-07-20 | 北京优纳科技有限公司 | 对位方法及对位*** |
JP6229311B2 (ja) * | 2013-05-28 | 2017-11-15 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
US10276418B2 (en) * | 2013-12-31 | 2019-04-30 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Silicon wafer pre-alignment device and method therefor |
CN104865798B (zh) * | 2014-02-21 | 2017-07-11 | 无锡华润上华科技有限公司 | 光刻工艺中的曝光场的尺寸选择方法 |
CN105185703B (zh) * | 2014-06-18 | 2019-09-17 | 上海华力微电子有限公司 | 一种晶圆边缘找平的方法 |
JP6661270B2 (ja) | 2015-01-16 | 2020-03-11 | キヤノン株式会社 | 露光装置、露光システム、および物品の製造方法 |
US20180015614A1 (en) * | 2015-02-04 | 2018-01-18 | Kawasaki Jukogyo Kabushiki Kaisha | Robot shakes automatically adjusting device and method of automatically adjusting shakes of robot |
CN107250915B (zh) | 2015-02-23 | 2020-03-13 | 株式会社尼康 | 测量装置、光刻***及曝光装置、以及管理方法、重迭测量方法及组件制造方法 |
EP3264030B1 (en) * | 2015-02-23 | 2020-07-22 | Nikon Corporation | Measurement device, lithography system and exposure device, and device manufacturing method |
WO2016136691A1 (ja) | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 基板処理システム及び基板処理方法、並びにデバイス製造方法 |
WO2016159295A1 (ja) * | 2015-03-31 | 2016-10-06 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
US10268121B2 (en) * | 2015-09-30 | 2019-04-23 | Nikon Corporation | Exposure apparatus and exposure method, and flat panel display manufacturing method |
DE102015219810A1 (de) * | 2015-10-13 | 2017-04-13 | Dr. Johannes Heidenhain Gmbh | X-Y-Tisch mit einer Positionsmesseinrichtung |
CN105425550A (zh) * | 2016-01-14 | 2016-03-23 | 哈尔滨工业大学 | 基于交错磁钢排布的动线圈气磁结合气浮双工件台矢量圆弧换台方法及装置 |
US9865477B2 (en) * | 2016-02-24 | 2018-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Backside polisher with dry frontside design and method using the same |
CN205427436U (zh) * | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺*** |
JP6718279B2 (ja) * | 2016-03-31 | 2020-07-08 | 株式会社オーク製作所 | 露光装置、ステージ較正システム、およびステージ較正方法 |
JP7081490B2 (ja) | 2016-09-27 | 2022-06-07 | 株式会社ニコン | レイアウト情報提供方法、レイアウト情報、決定方法、プログラム、並びに情報記録媒体 |
JP6752450B2 (ja) * | 2016-09-30 | 2020-09-09 | 株式会社ニコン | 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法 |
CN107883887B (zh) | 2016-09-30 | 2019-11-26 | 上海微电子装备(集团)股份有限公司 | 一种光学测量装置和方法 |
US10670977B2 (en) * | 2016-09-30 | 2020-06-02 | Nikon Corporation | Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method |
CN107883884B (zh) * | 2016-09-30 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | 一种光学测量装置和方法 |
KR102318643B1 (ko) * | 2016-09-30 | 2021-10-27 | 가부시키가이샤 니콘 | 이동체 장치, 이동 방법, 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 그리고 디바이스 제조 방법 |
CN106773525B (zh) * | 2017-03-01 | 2020-06-16 | 合肥京东方光电科技有限公司 | 掩模板、对位方法、显示面板、显示装置及其对盒方法 |
US10585360B2 (en) * | 2017-08-25 | 2020-03-10 | Applied Materials, Inc. | Exposure system alignment and calibration method |
JP6493481B2 (ja) * | 2017-10-18 | 2019-04-03 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
CN109116593B (zh) * | 2018-08-02 | 2021-07-20 | 深圳市华星光电半导体显示技术有限公司 | 母板曝光方法 |
NL2023546A (en) * | 2018-08-23 | 2020-02-27 | Asml Netherlands Bv | Stage apparatus and method for calibrating an object loading process |
KR20200122665A (ko) | 2019-04-18 | 2020-10-28 | 삼성전자주식회사 | 진공 챔버용 계측 장치, 및 그 계측 장치를 포함한 계측 시스템 |
CN114056937B (zh) * | 2021-12-13 | 2023-06-23 | 芯峰光电技术(深圳)有限公司 | 一种电子芯片多工位自动吸取加工生产线 |
TWI814668B (zh) * | 2021-12-31 | 2023-09-01 | 南韓商細美事有限公司 | 用於處理基板之設備及用於處理基板之方法 |
CN115574722B (zh) * | 2022-11-04 | 2024-03-29 | 中国计量科学研究院 | 一种自溯源干涉式位移传感器 |
Family Cites Families (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3330964A (en) * | 1963-09-09 | 1967-07-11 | Itck Corp | Photoelectric coordinate measuring system |
US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
JP2829642B2 (ja) * | 1989-09-29 | 1998-11-25 | キヤノン株式会社 | 露光装置 |
JP3149472B2 (ja) * | 1991-08-30 | 2001-03-26 | 株式会社ニコン | 走査露光装置および物体の移動測定装置 |
US5196745A (en) | 1991-08-16 | 1993-03-23 | Massachusetts Institute Of Technology | Magnetic positioning device |
KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
JP3412704B2 (ja) * | 1993-02-26 | 2003-06-03 | 株式会社ニコン | 投影露光方法及び装置、並びに露光装置 |
JP2963603B2 (ja) | 1993-05-31 | 1999-10-18 | 東京エレクトロン株式会社 | プローブ装置のアライメント方法 |
JPH07270122A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
DE69738910D1 (de) | 1996-11-28 | 2008-09-25 | Nikon Corp | Ausrichtvorrichtung und belichtungsverfahren |
WO1998028665A1 (en) | 1996-12-24 | 1998-07-02 | Koninklijke Philips Electronics N.V. | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
US6208407B1 (en) | 1997-12-22 | 2001-03-27 | Asm Lithography B.V. | Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement |
CN100578876C (zh) | 1998-03-11 | 2010-01-06 | 株式会社尼康 | 紫外激光装置以及使用该紫外激光装置的曝光装置和曝光方法 |
AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
WO2001035168A1 (en) | 1999-11-10 | 2001-05-17 | Massachusetts Institute Of Technology | Interference lithography utilizing phase-locked scanning beams |
SG124257A1 (en) | 2000-02-25 | 2006-08-30 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
DE10011130A1 (de) | 2000-03-10 | 2001-09-13 | Mannesmann Vdo Ag | Entlüftungseinrichtung für einen Kraftstoffbehälter |
US7561270B2 (en) | 2000-08-24 | 2009-07-14 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
TW527526B (en) | 2000-08-24 | 2003-04-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
EP1182509B1 (en) * | 2000-08-24 | 2009-04-08 | ASML Netherlands B.V. | Lithographic apparatus, calibration method thereof and device manufacturing method |
US7289212B2 (en) | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
US6480271B1 (en) * | 2001-01-08 | 2002-11-12 | The Boeing Company | Traversing laser locating system |
US6611316B2 (en) | 2001-02-27 | 2003-08-26 | Asml Holding N.V. | Method and system for dual reticle image exposure |
TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
KR20130010039A (ko) | 2002-12-10 | 2013-01-24 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
US7025498B2 (en) | 2003-05-30 | 2006-04-11 | Asml Holding N.V. | System and method of measuring thermal expansion |
TWI295408B (en) | 2003-10-22 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method, and measurement system |
US7589822B2 (en) | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
US7102729B2 (en) | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
US7256871B2 (en) | 2004-07-27 | 2007-08-14 | Asml Netherlands B.V. | Lithographic apparatus and method for calibrating the same |
EP1804278A4 (en) * | 2004-09-14 | 2011-03-02 | Nikon Corp | CORRECTION METHOD AND EXPOSURE DEVICE |
EP1794650A4 (en) | 2004-09-30 | 2008-09-10 | Nikon Corp | OPTICAL PROJECTION DEVICE AND EXPOSURE DEVICE |
US20090213357A1 (en) * | 2004-10-08 | 2009-08-27 | Dai Arai | Exposure apparatus and device manufacturing method |
US20060139595A1 (en) | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness |
US7515281B2 (en) * | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7161659B2 (en) | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7405811B2 (en) | 2005-04-20 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
US7349069B2 (en) | 2005-04-20 | 2008-03-25 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
WO2006112554A1 (en) * | 2005-04-21 | 2006-10-26 | Fujifilm Corporation | Method of and system for drawing |
US8693006B2 (en) * | 2005-06-28 | 2014-04-08 | Nikon Corporation | Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method |
US7348574B2 (en) * | 2005-09-02 | 2008-03-25 | Asml Netherlands, B.V. | Position measurement system and lithographic apparatus |
KR100869306B1 (ko) * | 2005-09-13 | 2008-11-18 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조 방법 |
US7362446B2 (en) | 2005-09-15 | 2008-04-22 | Asml Netherlands B.V. | Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit |
US7978339B2 (en) | 2005-10-04 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus temperature compensation |
EP2963498B8 (en) * | 2006-01-19 | 2017-07-26 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
CN101385122B (zh) | 2006-02-21 | 2010-12-08 | 株式会社尼康 | 图案形成装置、标记检测装置、曝光装置、图案形成方法、曝光方法及组件制造方法 |
US7602489B2 (en) | 2006-02-22 | 2009-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7253875B1 (en) | 2006-03-03 | 2007-08-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7636165B2 (en) | 2006-03-21 | 2009-12-22 | Asml Netherlands B.V. | Displacement measurement systems lithographic apparatus and device manufacturing method |
US7483120B2 (en) | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
US20070281149A1 (en) * | 2006-06-06 | 2007-12-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20080094592A1 (en) * | 2006-08-31 | 2008-04-24 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
JP5486189B2 (ja) * | 2006-09-01 | 2014-05-07 | 株式会社ニコン | 移動体駆動方法及び移動体駆動システム、パターン形成方法及び装置、露光方法及び装置、並びにデバイス製造方法 |
KR101323530B1 (ko) * | 2006-09-01 | 2013-10-29 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법 |
KR101360507B1 (ko) * | 2006-09-29 | 2014-02-07 | 가부시키가이샤 니콘 | 이동체 시스템, 패턴 형성 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
US7619207B2 (en) | 2006-11-08 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7561280B2 (en) | 2007-03-15 | 2009-07-14 | Agilent Technologies, Inc. | Displacement measurement sensor head and system having measurement sub-beams comprising zeroth order and first order diffraction components |
US7903866B2 (en) | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
US7710540B2 (en) | 2007-04-05 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7804579B2 (en) * | 2007-06-21 | 2010-09-28 | Asml Netherlands B.V. | Control system, lithographic projection apparatus, method of controlling a support structure, and a computer program product |
US8194232B2 (en) * | 2007-07-24 | 2012-06-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method |
US8243257B2 (en) * | 2007-07-24 | 2012-08-14 | Nikon Corporation | Position measurement system, exposure apparatus, position measuring method, exposure method and device manufacturing method, and tool and measuring method |
US8264669B2 (en) * | 2007-07-24 | 2012-09-11 | Nikon Corporation | Movable body drive method, pattern formation method, exposure method, and device manufacturing method for maintaining position coordinate before and after switching encoder head |
US9304412B2 (en) * | 2007-08-24 | 2016-04-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method |
US8237919B2 (en) * | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
DE102007046927A1 (de) | 2007-09-28 | 2009-04-02 | Carl Zeiss Smt Ag | Kalibrierung einer Positionsmesseinrichtung einer optischen Einrichtung |
US8665455B2 (en) * | 2007-11-08 | 2014-03-04 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
NL1036180A1 (nl) * | 2007-11-20 | 2009-05-25 | Asml Netherlands Bv | Stage system, lithographic apparatus including such stage system, and correction method. |
US8269945B2 (en) | 2007-12-28 | 2012-09-18 | Nikon Corporation | Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method |
US8237916B2 (en) | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
TWI547769B (zh) * | 2007-12-28 | 2016-09-01 | 尼康股份有限公司 | An exposure apparatus, a moving body driving system, a pattern forming apparatus, and an exposure method, and an element manufacturing method |
NL1036742A1 (nl) * | 2008-04-18 | 2009-10-20 | Asml Netherlands Bv | Stage system calibration method, stage system and lithographic apparatus comprising such stage system. |
US8279401B2 (en) * | 2008-04-25 | 2012-10-02 | Asml Netherlands B.V. | Position control system, a lithographic apparatus and a method for controlling a position of a movable object |
EP2131245A3 (en) * | 2008-06-02 | 2012-08-01 | ASML Netherlands BV | Lithographic apparatus and its focus determination method |
US8514395B2 (en) * | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8493547B2 (en) * | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
JP5926153B2 (ja) * | 2012-08-31 | 2016-05-25 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | クレードル、テーブル、および医用装置 |
JP6207390B2 (ja) * | 2013-12-27 | 2017-10-04 | 日本化薬株式会社 | 赤外線遮蔽シート及びその用途 |
JP6211821B2 (ja) * | 2013-06-18 | 2017-10-11 | 東芝産業機器システム株式会社 | 固定子鉄心の製造方法 |
-
2010
- 2010-08-20 US US12/860,097 patent/US8514395B2/en active Active
- 2010-08-24 CN CN201510542373.6A patent/CN105182694B/zh active Active
- 2010-08-24 JP JP2010187052A patent/JP5637496B2/ja active Active
- 2010-08-24 KR KR1020147018900A patent/KR101539191B1/ko active IP Right Grant
- 2010-08-24 EP EP14179101.2A patent/EP2818928B8/en active Active
- 2010-08-24 KR KR1020147018901A patent/KR101539192B1/ko active IP Right Grant
- 2010-08-24 EP EP16166162.4A patent/EP3098655B1/en active Active
- 2010-08-24 WO PCT/JP2010/064662 patent/WO2011024984A1/en active Application Filing
- 2010-08-24 EP EP15173361.5A patent/EP2957956B1/en active Active
- 2010-08-24 KR KR1020127005302A patent/KR101533143B1/ko active IP Right Grant
- 2010-08-24 CN CN201080037584.XA patent/CN102625924B/zh active Active
- 2010-08-24 EP EP10752443.1A patent/EP2470961B1/en active Active
- 2010-08-24 EP EP15173365.6A patent/EP2957957B1/en active Active
- 2010-08-24 KR KR1020157029936A patent/KR101680541B1/ko active IP Right Grant
- 2010-08-24 KR KR1020157001128A patent/KR101596206B1/ko active Application Filing
- 2010-08-24 EP EP17169460.7A patent/EP3244263B1/en active Active
- 2010-08-24 CN CN201510541459.7A patent/CN105182693B/zh active Active
- 2010-08-24 KR KR1020187007269A patent/KR101969267B1/ko active IP Right Grant
- 2010-08-24 EP EP17169465.6A patent/EP3244264B1/en active Active
- 2010-08-24 KR KR1020167032581A patent/KR101840582B1/ko active Application Filing
- 2010-08-24 CN CN201510542536.0A patent/CN105182695B/zh active Active
- 2010-08-25 TW TW105125603A patent/TWI594084B/zh active
- 2010-08-25 TW TW103129832A patent/TWI554845B/zh active
- 2010-08-25 TW TW106120904A patent/TWI636340B/zh active
- 2010-08-25 TW TW103129829A patent/TWI554844B/zh active
- 2010-08-25 TW TW108102144A patent/TWI684075B/zh active
- 2010-08-25 TW TW106113430A patent/TWI652550B/zh active
- 2010-08-25 TW TW099128363A patent/TWI529495B/zh active
- 2010-08-25 TW TW104144191A patent/TWI585549B/zh active
-
2012
- 2012-11-23 HK HK12112035.8A patent/HK1171267A1/zh not_active IP Right Cessation
-
2013
- 2013-07-17 US US13/944,397 patent/US8842278B2/en active Active
-
2014
- 2014-03-10 JP JP2014045912A patent/JP5812370B2/ja active Active
- 2014-06-19 JP JP2014125963A patent/JP5846255B2/ja active Active
- 2014-08-19 US US14/462,668 patent/US9477155B2/en active Active
-
2015
- 2015-01-08 JP JP2015002653A patent/JP6035692B2/ja active Active
- 2015-02-09 HK HK16114078A patent/HK1225812A1/zh not_active IP Right Cessation
- 2015-02-09 HK HK15101393.4A patent/HK1200924A1/zh not_active IP Right Cessation
- 2015-06-25 JP JP2015127274A patent/JP6035695B2/ja active Active
-
2016
- 2016-01-13 JP JP2016004179A patent/JP6107981B2/ja active Active
- 2016-02-23 HK HK16101982.0A patent/HK1214369A1/zh not_active IP Right Cessation
- 2016-02-23 HK HK16101985.7A patent/HK1214371A1/zh not_active IP Right Cessation
- 2016-02-23 HK HK16101983.9A patent/HK1214370A1/zh not_active IP Right Cessation
- 2016-03-30 HK HK16103597.3A patent/HK1215733A1/zh not_active IP Right Cessation
- 2016-03-30 HK HK16103601.7A patent/HK1215734A1/zh not_active IP Right Cessation
- 2016-09-19 US US15/269,030 patent/US9971246B2/en active Active
- 2016-09-19 US US15/269,160 patent/US10073345B2/en active Active
- 2016-11-08 JP JP2016218331A patent/JP6292546B2/ja active Active
-
2017
- 2017-05-30 US US15/608,130 patent/US10151979B2/en active Active
-
2018
- 2018-02-16 JP JP2018025540A patent/JP6548150B2/ja active Active
- 2018-08-07 US US16/056,875 patent/US10527943B2/en active Active
- 2018-08-08 US US16/058,255 patent/US10527944B2/en active Active
- 2018-10-30 US US16/174,652 patent/US10545407B2/en active Active
-
2019
- 2019-12-04 US US16/702,650 patent/US11067894B2/en active Active
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1215734A1 (zh) | 曝光方法及曝光裝置、以及元件製造方法 | |
HK1206436A1 (zh) | 曝光裝置、曝光方法、以及組件製造方法 | |
HK1222716A1 (zh) | 曝光裝置、曝光方法、及元件製造方法 | |
HK1181124A1 (zh) | 曝光設備、曝光方法以及器件製造方法 | |
HK1224023A1 (zh) | 曝光設備及器件製造方法 | |
HK1155821A1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
HK1150888A1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
HK1166140A1 (zh) | 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法 | |
HK1169861A1 (zh) | 曝光裝置、曝光方法以及器件製造方法 | |
HK1136878A1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
IL220933A (en) | Lithographic system and method for device production | |
IL225971A0 (en) | Metrological method and system and method for producing a standard | |
HK1137077A1 (en) | Exposure apparatus, exposure method and device manufacturing method | |
IL207506A0 (en) | Metrology method and apparatus, lithographic apparatus, and device manufacturing method | |
HK1169862A1 (zh) | 圖案形成設備、圖案形成方法及裝置製造方法 | |
GB0813241D0 (en) | Manufacturing apparatus and method | |
HK1169492A1 (zh) | 曝光設備、曝光方法及器件製造方法 | |
EP2400706A4 (en) | METHOD FOR CREATING SEQUENCES AND ASSOCIATED APPARATUS | |
EP2613340A4 (en) | DEVICE MANUFACTURING APPARATUS, AND ASSOCIATED METHOD | |
HK1169179A1 (zh) | 傳送方法、傳送裝置、曝光方法和曝光裝置 | |
IL210832A0 (en) | Lithographic apparatus and device manufacturing method | |
EP2592654A4 (en) | IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE | |
IL220021A0 (en) | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method | |
HK1179750A1 (zh) | 曝光裝置、物體的更換方法、曝光方法、以及元件製造方法 | |
HK1182184A1 (zh) | 曝光方法及裝置、以及元件製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20230823 |