HK1099125A1 - Exposure apparatus and device producing method - Google Patents

Exposure apparatus and device producing method

Info

Publication number
HK1099125A1
HK1099125A1 HK07105213.3A HK07105213A HK1099125A1 HK 1099125 A1 HK1099125 A1 HK 1099125A1 HK 07105213 A HK07105213 A HK 07105213A HK 1099125 A1 HK1099125 A1 HK 1099125A1
Authority
HK
Hong Kong
Prior art keywords
exposure apparatus
producing method
device producing
exposure
producing
Prior art date
Application number
HK07105213.3A
Other languages
English (en)
Inventor
Hiroyuki Nagasaka
Hirotaka Kohno
Yasufumi Nishii
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1099125A1 publication Critical patent/HK1099125A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK07105213.3A 2004-04-19 2007-05-17 Exposure apparatus and device producing method HK1099125A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004123253 2004-04-19
PCT/JP2005/007261 WO2005104195A1 (ja) 2004-04-19 2005-04-14 露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
HK1099125A1 true HK1099125A1 (en) 2007-08-03

Family

ID=35197258

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07105213.3A HK1099125A1 (en) 2004-04-19 2007-05-17 Exposure apparatus and device producing method

Country Status (6)

Country Link
US (2) US8488099B2 (xx)
EP (2) EP2490248A3 (xx)
JP (5) JP4677986B2 (xx)
KR (3) KR101162938B1 (xx)
HK (1) HK1099125A1 (xx)
WO (1) WO2005104195A1 (xx)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3226073A3 (en) 2003-04-09 2017-10-11 Nikon Corporation Exposure method and apparatus, and method for fabricating device
JP4288426B2 (ja) 2003-09-03 2009-07-01 株式会社ニコン 液浸リソグラフィのための流体の供給装置及び方法
TW201834020A (zh) 2003-10-28 2018-09-16 日商尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
TW201809801A (zh) 2003-11-20 2018-03-16 日商尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
TWI437618B (zh) 2004-02-06 2014-05-11 尼康股份有限公司 偏光變換元件、光學照明裝置、曝光裝置以及曝光方法
EP3203321A1 (en) 2004-06-10 2017-08-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
TWI508136B (zh) 2004-09-17 2015-11-11 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
WO2006059636A1 (ja) * 2004-12-02 2006-06-08 Nikon Corporation 露光装置及びデバイス製造方法
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
KR20160135859A (ko) 2005-01-31 2016-11-28 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1881521B1 (en) 2005-05-12 2014-07-23 Nikon Corporation Projection optical system, exposure apparatus and exposure method
KR20080068013A (ko) * 2005-11-14 2008-07-22 가부시키가이샤 니콘 액체 회수 부재, 노광 장치, 노광 방법, 및 디바이스 제조방법
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
WO2007129753A1 (ja) * 2006-05-10 2007-11-15 Nikon Corporation 露光装置及びデバイス製造方法
US11136667B2 (en) * 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US8681308B2 (en) * 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179329A1 (en) 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
EP2179330A1 (en) 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
NL1036715A1 (nl) 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
JP2009267235A (ja) * 2008-04-28 2009-11-12 Canon Inc 露光装置
KR101695034B1 (ko) 2008-05-28 2017-01-10 가부시키가이샤 니콘 공간 광 변조기의 검사 장치, 조명 광학계, 노광 장치, 검사 방법, 조명 광학계의 조정 방법, 조명 방법, 노광 방법, 및 디바이스 제조 방법
JP4922359B2 (ja) 2008-07-25 2012-04-25 エーエスエムエル ネザーランズ ビー．ブイ． 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
US8477284B2 (en) * 2008-10-22 2013-07-02 Nikon Corporation Apparatus and method to control vacuum at porous material using multiple porous materials
US8634055B2 (en) * 2008-10-22 2014-01-21 Nikon Corporation Apparatus and method to control vacuum at porous material using multiple porous materials
US8896806B2 (en) * 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
EP2521163A1 (en) * 2009-12-28 2012-11-07 Nikon Corporation Liquid immersion member, method for manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
US9352073B2 (en) 2013-01-22 2016-05-31 Niko Corporation Functional film
US9057955B2 (en) 2013-01-22 2015-06-16 Nikon Corporation Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
WO2014132923A1 (ja) 2013-02-28 2014-09-04 株式会社ニコン 摺動膜、摺動膜が形成された部材、及びその製造方法
NL2014982A (en) * 2014-07-24 2016-06-27 Asml Netherlands Bv A Fluid Handling Structure, an Immersion Lithographic Apparatus, and a Device Manufacturing Method.

Family Cites Families (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1242527A (en) * 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US4231768A (en) * 1978-09-29 1980-11-04 Pall Corporation Air purification system and process
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57117238A (en) 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JPH03209479A (ja) * 1989-09-06 1991-09-12 Sanee Giken Kk 露光方法
JP2897355B2 (ja) 1990-07-05 1999-05-31 株式会社ニコン アライメント方法，露光装置，並びに位置検出方法及び装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるｌｓｉ製造縮小投影露光装置の光学系
JP3246615B2 (ja) 1992-07-27 2002-01-15 株式会社ニコン 照明光学装置、露光装置、及び露光方法
JPH06188169A (ja) 1992-08-24 1994-07-08 Canon Inc 結像方法及び該方法を用いる露光装置及び該方法を用いるデバイス製造方法
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
JP3555230B2 (ja) 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JP3387075B2 (ja) 1994-12-12 2003-03-17 株式会社ニコン 走査露光方法、露光装置、及び走査型露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH09108551A (ja) 1995-08-11 1997-04-28 Mitsubishi Rayon Co Ltd 浄水器
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
DE69738910D1 (de) 1996-11-28 2008-09-25 Nikon Corp Ausrichtvorrichtung und belichtungsverfahren
WO1998028665A1 (en) 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JP3747566B2 (ja) 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JPH1116816A (ja) 1997-06-25 1999-01-22 Nikon Corp 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
JPH11176727A (ja) 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
JP4264676B2 (ja) 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
JP3291488B2 (ja) * 1999-05-27 2002-06-10 三洋電機株式会社 流体の被除去物除去方法
WO2001006548A1 (fr) 1999-07-16 2001-01-25 Nikon Corporation Procede et systeme d'exposition
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
JP2002014005A (ja) 2000-04-25 2002-01-18 Nikon Corp 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US7362508B2 (en) 2002-08-23 2008-04-22 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
EP2495613B1 (en) 2002-11-12 2013-07-31 ASML Netherlands B.V. Lithographic apparatus
CN101424881B (zh) 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI232357B (en) * 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1571698A4 (en) 2002-12-10 2006-06-21 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
KR20130010039A (ko) * 2002-12-10 2013-01-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP4184346B2 (ja) 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 層上のスポットを照射するための方法及び装置における液体除去
USRE48515E1 (en) 2002-12-19 2021-04-13 Asml Netherlands B.V. Method and device for irradiating spots on a layer
DE60307322T2 (de) 2002-12-19 2007-10-18 Koninklijke Philips Electronics N.V. Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
JP2004228497A (ja) 2003-01-27 2004-08-12 Nikon Corp 露光装置及び電子デバイスの製造方法
EP3301511A1 (en) 2003-02-26 2018-04-04 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
ATE426914T1 (de) * 2003-04-07 2009-04-15 Nikon Corp Belichtungsgerat und verfahren zur herstellung einer vorrichtung
KR101409565B1 (ko) 2003-04-10 2014-06-19 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
SG10201604762UA (en) 2003-04-10 2016-08-30 Nikon Corp Environmental system including vacuum scavange for an immersion lithography apparatus
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2282233A1 (en) 2003-05-13 2011-02-09 ASML Netherlands BV Lithographic apparatus
JP4279611B2 (ja) * 2003-06-17 2009-06-17 株式会社日立コミュニケーションテクノロジー ビット同期回路および光伝送システム局側装置
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
DE60308161T2 (de) * 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
AU2004259762A1 (en) * 2003-07-24 2005-02-03 Tecomet, Inc. Assembled non-random foams
JP2006528835A (ja) * 2003-07-24 2006-12-21 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィ投影露光装置および浸漬液体を浸漬空間へ導入する方法
JP2005064210A (ja) * 2003-08-12 2005-03-10 Nikon Corp 露光方法、該露光方法を利用した電子デバイスの製造方法及び露光装置
US7632410B2 (en) * 2003-08-21 2009-12-15 Christopher Heiss Universal water purification system
JP4288426B2 (ja) * 2003-09-03 2009-07-01 株式会社ニコン 液浸リソグラフィのための流体の供給装置及び方法
JP4378136B2 (ja) * 2003-09-04 2009-12-02 キヤノン株式会社 露光装置及びデバイス製造方法
US7369217B2 (en) * 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
EP1524558A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005123305A (ja) 2003-10-15 2005-05-12 Canon Inc 液浸型露光装置
US7528929B2 (en) 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005175176A (ja) * 2003-12-11 2005-06-30 Nikon Corp 露光方法及びデバイス製造方法
JP4308638B2 (ja) 2003-12-17 2009-08-05 パナソニック株式会社 パターン形成方法
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
CN1954408B (zh) * 2004-06-04 2012-07-04 尼康股份有限公司 曝光装置、曝光方法及元件制造方法
US7701550B2 (en) * 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG124359A1 (en) 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2007142366A (ja) 2005-10-18 2007-06-07 Canon Inc 露光装置及びデバイス製造方法
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007335662A (ja) 2006-06-15 2007-12-27 Canon Inc 露光装置
JP2008034801A (ja) 2006-06-30 2008-02-14 Canon Inc 露光装置およびデバイス製造方法
US20080043211A1 (en) * 2006-08-21 2008-02-21 Nikon Corporation Apparatus and methods for recovering fluid in immersion lithography
US8068209B2 (en) 2007-03-23 2011-11-29 Nikon Corporation Nozzle to help reduce the escape of immersion liquid from an immersion lithography tool

Also Published As

Publication number Publication date
KR20120087194A (ko) 2012-08-06
EP1753016B1 (en) 2012-06-20
JP5310828B2 (ja) 2013-10-09
EP2490248A2 (en) 2012-08-22
JP2012044223A (ja) 2012-03-01
JP2010283405A (ja) 2010-12-16
US20080018866A1 (en) 2008-01-24
JP5741875B2 (ja) 2015-07-01
JP4677986B2 (ja) 2011-04-27
WO2005104195A1 (ja) 2005-11-03
JP2012134552A (ja) 2012-07-12
EP1753016A4 (en) 2009-08-26
KR101258033B1 (ko) 2013-04-24
EP1753016A1 (en) 2007-02-14
JPWO2005104195A1 (ja) 2008-03-13
EP2490248A3 (en) 2018-01-03
US8488099B2 (en) 2013-07-16
US9599907B2 (en) 2017-03-21
JP2014078761A (ja) 2014-05-01
KR101162938B1 (ko) 2012-07-05
KR20120003012A (ko) 2012-01-09
KR101330370B1 (ko) 2013-11-15
JP5516625B2 (ja) 2014-06-11
JP5310683B2 (ja) 2013-10-09
KR20070008641A (ko) 2007-01-17
US20130271739A1 (en) 2013-10-17

Similar Documents

Publication Publication Date Title
HK1249935A1 (zh) 用於製造器件的曝光設備和方法
HK1248027A1 (zh) 曝光裝置和器件製造方法
HK1099125A1 (en) Exposure apparatus and device producing method
EP1811546A4 (en) EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD
HK1215755A1 (zh) 曝光裝置及元件製造方法
HK1224085A1 (zh) 曝光設備和用於生產裝置的方法
HK1200922A1 (en) Exposure apparatus and device producing method
IL231730A (en) Exposure facility and method of manufacturing the facility
HK1208088A1 (en) Exposure method and method for producing device
IL179826A0 (en) Exposure apparatus, exposure method, and device producing method
HK1091596A1 (zh) 曝光裝置、曝光方法以及設備製造方法
EP1713114A4 (en) EXPOSURE DEVICE AND METHOD FOR PRODUCING A COMPONENT
HK1204091A1 (en) Exposure apparatus and device fabricating method
HK1182459A1 (zh) 曝光裝置、及元件製造方法
HK1225810B (zh) 曝光裝置、曝光方法以及元件製造方法
HK1164462A1 (en) Exposure apparatus, exposure method, and device producing method
SG114712A1 (en) Lithographic apparatus and device manufacturing method
SG120255A1 (en) Lithographic apparatus and device manufacturing method
SG117565A1 (en) Lithographic apparatus and device manufacturing method
SG115818A1 (en) Lithographic apparatus and device manufacturing method
SG117591A1 (en) Lithographic apparatus and device manufacturing method
SG115816A1 (en) Lithographic apparatus and device manufacturing method
SG118329A1 (en) Lithographic apparatus and device manufacturing method
SG118391A1 (en) Lithographic apparatus and device manufacturing method
HK1100791A1 (en) Exposure apparatus and exposure method, and device producing method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200414