JP4308638B2 - パターン形成方法 - Google Patents
パターン形成方法 Download PDFInfo
- Publication number
- JP4308638B2 JP4308638B2 JP2003419444A JP2003419444A JP4308638B2 JP 4308638 B2 JP4308638 B2 JP 4308638B2 JP 2003419444 A JP2003419444 A JP 2003419444A JP 2003419444 A JP2003419444 A JP 2003419444A JP 4308638 B2 JP4308638 B2 JP 4308638B2
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- JP
- Japan
- Prior art keywords
- exposure
- pattern
- resist film
- solution
- immersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
トリフルオロスルフォニウムトリフラート(酸発生剤)………………………0.06g
プロピレングリコールモノメチルエーテルアセテート(溶媒)……………………20g
次に、図7(a)に示すように、基板1の上に前記の化学増幅型レジスト材料を塗布して、0.35μmの厚さを持つレジスト膜2を形成する。
M. Switkes and M. Rothschild, "Immersion lithography at 157 nm", J. Vac. Sci. Technol., B19, P.2353 (2001)
本発明の第1の実施形態について図面を参照しながら説明する。
トリフルオロスルフォニウムトリフラート(酸発生剤)………………………0.06g
プロピレングリコールモノメチルエーテルアセテート(溶媒)……………………20g
次に、図2(a)に示すように、基板20の上に前記の化学増幅型レジスト材料を塗布して、0.35μmの厚さを持つレジスト膜22を形成する。
以下、本発明の第2の実施形態について図面を参照しながら説明する。
トリフルオロスルフォニウムトリフラート(酸発生剤)………………………0.06g
プロピレングリコールモノメチルエーテルアセテート(溶媒)……………………20g
次に、図4(a)に示すように、基板20の上に前記の化学増幅型レジスト材料を塗布して、0.35μmの厚さを持つレジスト膜22を形成する。
以下、本発明の第3の実施形態について図面を参照しながら説明する。
トリフルオロスルフォニウムトリフラート(酸発生剤)………………………0.06g
プロピレングリコールモノメチルエーテルアセテート(溶媒)……………………20g
次に、図6(a)に示すように、基板20の上に前記の化学増幅型レジスト材料を塗布して、0.35μmの厚さを持つレジスト膜22を形成する。
20 ウェハ
21A 液浸溶液
21B 液浸溶液
21C 液浸溶液
22 レジスト膜
22a レジストパターン
23 マスク
30 照明光学系
31 投影レンズ
32 ステージ
33 露光光
40 溶液貯留部(溶液供給部)
40a 流入口
40b 排出口
41 液浸溶液タンク(溶液循環手段)
42 循環パイプ
43 溶液貯留部(溶液供給部)
44 攪拌機(溶液攪拌手段)
45 溶液貯留部(溶液供給部)
45a 流入口
45b 排出口
Claims (5)
- 基板の上にレジスト膜を形成する工程と、
ディップ型の貯留部において前記レジスト膜の上に液体を配した状態で、前記レジスト膜に対して前記液体を介して露光光を選択的に照射してパターン露光を行なう工程と、
パターン露光が行なわれた前記レジスト膜に対して現像を行なってレジストパターンを形成する工程とを備え、
前記パターン露光を行なう工程は、前記貯留部に貯留された前記液体を露光中に攪拌する工程を含み、
前記パターン露光を行なう工程において、露光中に前記液体を流動させることを特徴とするパターン形成方法。 - 前記パターン露光を行なう工程は、前記液体を露光中に排出する工程を含むことを特徴とする請求項1に記載のパターン形成方法。
- 前記パターン露光を行なう工程は、新たな液体を前記レジスト膜の上に露光中に供給する工程を含むことを特徴とする請求項2に記載のパターン形成方法。
- 前記液体は水又はパーフルオロポリエーテルであることを特徴とする請求項1に記載のパターン形成方法。
- 前記露光光は、KrFエキシマレーザ光、ArFエキシマレーザ光、F2レーザ光、Kr2レーザ光、ArKrレーザ光又はAr2レーザ光であることを特徴とする請求項1に記載のパターン形成方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003419444A JP4308638B2 (ja) | 2003-12-17 | 2003-12-17 | パターン形成方法 |
US11/010,422 US7700268B2 (en) | 2003-12-17 | 2004-12-14 | Exposure system and pattern formation method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003419444A JP4308638B2 (ja) | 2003-12-17 | 2003-12-17 | パターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005183523A JP2005183523A (ja) | 2005-07-07 |
JP4308638B2 true JP4308638B2 (ja) | 2009-08-05 |
Family
ID=34675213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003419444A Expired - Fee Related JP4308638B2 (ja) | 2003-12-17 | 2003-12-17 | パターン形成方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7700268B2 (ja) |
JP (1) | JP4308638B2 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101980086B (zh) * | 2003-04-11 | 2014-01-01 | 株式会社尼康 | 浸没曝光设备以及浸没曝光方法 |
KR101528016B1 (ko) | 2003-06-13 | 2015-06-12 | 가부시키가이샤 니콘 | 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법 |
TWI540612B (zh) | 2003-06-19 | 2016-07-01 | 尼康股份有限公司 | An exposure apparatus, an exposure method, and an element manufacturing method |
KR101793800B1 (ko) | 2003-12-03 | 2017-11-03 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법, 그리고 광학 부품 |
WO2005057635A1 (ja) * | 2003-12-15 | 2005-06-23 | Nikon Corporation | 投影露光装置及びステージ装置、並びに露光方法 |
ATE491221T1 (de) * | 2003-12-15 | 2010-12-15 | Nikon Corp | Bühnensystem, belichtungsvorrichtung und belichtungsverfahren |
US20070081133A1 (en) * | 2004-12-14 | 2007-04-12 | Niikon Corporation | Projection exposure apparatus and stage unit, and exposure method |
US7589822B2 (en) | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
US20070166639A1 (en) * | 2004-02-20 | 2007-07-19 | Takayuki Araki | Laminated resist used for immersion lithography |
KR101258033B1 (ko) * | 2004-04-19 | 2013-04-24 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
JP2007103841A (ja) * | 2005-10-07 | 2007-04-19 | Toshiba Corp | 半導体装置の製造方法 |
KR100802228B1 (ko) | 2006-01-03 | 2008-02-11 | 주식회사 하이닉스반도체 | 이멀젼 리소그래피 장치 |
CN100590173C (zh) * | 2006-03-24 | 2010-02-17 | 北京有色金属研究总院 | 一种荧光粉及其制造方法和所制成的电光源 |
EP1918778B1 (en) * | 2006-10-30 | 2016-08-03 | Rohm and Haas Electronic Materials LLC | Compositions and processes for immersion lithography |
NL1036186A1 (nl) * | 2007-12-03 | 2009-06-04 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
EP2128703A1 (en) | 2008-05-28 | 2009-12-02 | ASML Netherlands BV | Lithographic Apparatus and a Method of Operating the Apparatus |
EP2189844A3 (en) * | 2008-11-19 | 2010-07-28 | Rohm and Haas Electronic Materials LLC | Compositions comprising sulfonamide material and processes for photolithography |
CN110095943A (zh) * | 2018-01-31 | 2019-08-06 | 上海微电子装备(集团)股份有限公司 | 工件台装置和浸没光刻设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2753930B2 (ja) | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
JPH08316125A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JP3747566B2 (ja) | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
WO1999049504A1 (fr) | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
US6788477B2 (en) * | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE60335595D1 (de) * | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
JP4837556B2 (ja) | 2003-04-11 | 2011-12-14 | 株式会社ニコン | 液浸リソグラフィにおける光学素子の洗浄方法 |
US6867844B2 (en) * | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US7090963B2 (en) * | 2003-06-25 | 2006-08-15 | International Business Machines Corporation | Process for forming features of 50 nm or less half-pitch with chemically amplified resist imaging |
US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
JP2005123305A (ja) | 2003-10-15 | 2005-05-12 | Canon Inc | 液浸型露光装置 |
EP1524558A1 (en) | 2003-10-15 | 2005-04-20 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7894040B2 (en) * | 2004-10-05 | 2011-02-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2003
- 2003-12-17 JP JP2003419444A patent/JP4308638B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-14 US US11/010,422 patent/US7700268B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005183523A (ja) | 2005-07-07 |
US20050136361A1 (en) | 2005-06-23 |
US7700268B2 (en) | 2010-04-20 |
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