HK1078616A1 - Method and device for coating a substrate - Google Patents
Method and device for coating a substrateInfo
- Publication number
- HK1078616A1 HK1078616A1 HK05110333A HK05110333A HK1078616A1 HK 1078616 A1 HK1078616 A1 HK 1078616A1 HK 05110333 A HK05110333 A HK 05110333A HK 05110333 A HK05110333 A HK 05110333A HK 1078616 A1 HK1078616 A1 HK 1078616A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- substrate
- vaporized
- coating
- space
- electromagnetic field
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1020059A NL1020059C2 (nl) | 2002-02-21 | 2002-02-21 | Werkwijze en inrichting voor het bekleden van een substraat. |
PCT/NL2003/000139 WO2003071000A1 (en) | 2002-02-21 | 2003-02-21 | Method and device for coating a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1078616A1 true HK1078616A1 (en) | 2006-03-17 |
Family
ID=27752086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05110333A HK1078616A1 (en) | 2002-02-21 | 2005-11-18 | Method and device for coating a substrate |
Country Status (15)
Country | Link |
---|---|
US (1) | US7323229B2 (ru) |
EP (1) | EP1483425B1 (ru) |
JP (1) | JP4522709B2 (ru) |
KR (1) | KR100956491B1 (ru) |
CN (1) | CN100545299C (ru) |
AT (1) | ATE399889T1 (ru) |
AU (1) | AU2003221458A1 (ru) |
BR (1) | BR0307800B1 (ru) |
CA (1) | CA2476855C (ru) |
DE (1) | DE60321893D1 (ru) |
ES (1) | ES2309305T3 (ru) |
HK (1) | HK1078616A1 (ru) |
NL (1) | NL1020059C2 (ru) |
RU (1) | RU2316611C2 (ru) |
WO (1) | WO2003071000A1 (ru) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004080640A1 (en) * | 2003-03-14 | 2004-09-23 | Hille & Müller GMBH | Aluminium layered brazing product and method of its manufacture |
ZA200701534B (en) | 2004-08-23 | 2008-10-29 | Corus Technology Bv | Apparatus and method for levitation of an amount of conductive material |
AU2005276729B2 (en) * | 2004-08-23 | 2010-08-26 | Tata Steel Nederland Technology B.V. | Apparatus and method for levitation of an amount of conductive material |
UA87916C2 (ru) * | 2005-05-31 | 2009-08-25 | Корус Текнолоджи Бв | Устройств и способ для нанесения покрытия |
US7524385B2 (en) * | 2006-10-03 | 2009-04-28 | Elemetric, Llc | Controlled phase transition of metals |
KR100961371B1 (ko) * | 2007-12-28 | 2010-06-07 | 주식회사 포스코 | 실러 접착성 및 내식성이 우수한 아연계 합금도금강판과 그제조방법 |
KR101639813B1 (ko) * | 2009-10-08 | 2016-07-15 | 주식회사 포스코 | 연속 코팅 장치 |
WO2012081738A1 (en) * | 2010-12-13 | 2012-06-21 | Posco | Continuous coating apparatus |
KR101207719B1 (ko) * | 2010-12-27 | 2012-12-03 | 주식회사 포스코 | 건식 코팅 장치 |
RU2522666C2 (ru) * | 2012-06-27 | 2014-07-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Юго-Западный государственный университет" (ЮЗГУ) | Устройство для левитации некоторого количества материала |
KR101355817B1 (ko) * | 2012-07-09 | 2014-02-05 | 한국표준과학연구원 | 전자기 부양 금속 박막 증착 장치 |
RU2693852C2 (ru) * | 2017-11-07 | 2019-07-05 | Федеральное государственное бюджетное образовательное учреждение высшего образования " Юго-Западный государственный университет" (ЮЗГУ) | Устройство для левитации некоторого количества материала |
KR102098455B1 (ko) * | 2017-12-26 | 2020-04-07 | 주식회사 포스코 | 연속 증착 장치 및 연속 증착 방법 |
CN109518133A (zh) * | 2018-10-23 | 2019-03-26 | 集美大学 | 一种电磁加热的pvd设备及其生产工艺 |
CN112760608A (zh) * | 2020-12-14 | 2021-05-07 | 兰州空间技术物理研究所 | 碳纤维复合材料表面薄膜沉积过程防止层间放气的方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2664852A (en) * | 1950-04-27 | 1954-01-05 | Nat Res Corp | Vapor coating apparatus |
US2957064A (en) * | 1958-09-30 | 1960-10-18 | Westinghouse Electric Corp | Stabilizing of levitation melting |
GB1206586A (en) * | 1966-09-07 | 1970-09-23 | Mini Of Technology | Vacuum deposition process of forming alloys |
BE713308A (ru) * | 1968-04-05 | 1968-10-07 | ||
DE2934011A1 (de) * | 1979-08-22 | 1981-03-26 | André Etienne de Dr. Lausanne Rudnay | Vorrichtung zum aufdampfen von elektrisch leitenden stoffen (metallen) im hochvakuum |
JPS621863A (ja) * | 1985-06-28 | 1987-01-07 | Ishikawajima Harima Heavy Ind Co Ltd | 金属蒸発装置 |
JP3563083B2 (ja) * | 1992-09-11 | 2004-09-08 | 真空冶金株式会社 | 超微粒子のガスデポジション方法及び装置 |
JPH07252639A (ja) * | 1994-03-15 | 1995-10-03 | Kao Corp | 金属薄膜体の製造方法 |
US5534314A (en) * | 1994-08-31 | 1996-07-09 | University Of Virginia Patent Foundation | Directed vapor deposition of electron beam evaporant |
JPH08104981A (ja) * | 1994-10-05 | 1996-04-23 | Sumitomo Electric Ind Ltd | Pvd装置 |
JP2783193B2 (ja) | 1995-06-26 | 1998-08-06 | 大同特殊鋼株式会社 | レビテーション溶解法及びレビテーション溶解・鋳造装置 |
US5736073A (en) * | 1996-07-08 | 1998-04-07 | University Of Virginia Patent Foundation | Production of nanometer particles by directed vapor deposition of electron beam evaporant |
DE19811816A1 (de) * | 1997-03-24 | 1998-10-01 | Fuji Electric Co Ltd | Verfahren zur Herstellung eines Elektrodenmaterials für Vakuum-Leistungsschalter |
US6294822B1 (en) * | 1997-08-27 | 2001-09-25 | Josuke Nakata | Spheric semiconductor device, method for manufacturing the same, and spheric semiconductor device material |
JPH1171605A (ja) * | 1997-08-29 | 1999-03-16 | Ishikawajima Harima Heavy Ind Co Ltd | 微粒子製造方法及び装置 |
EP1321545A1 (en) * | 2001-12-20 | 2003-06-25 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Method for producing particles with diamond structure |
-
2002
- 2002-02-21 NL NL1020059A patent/NL1020059C2/nl not_active IP Right Cessation
-
2003
- 2003-02-21 DE DE60321893T patent/DE60321893D1/de not_active Expired - Lifetime
- 2003-02-21 JP JP2003569889A patent/JP4522709B2/ja not_active Expired - Fee Related
- 2003-02-21 CA CA 2476855 patent/CA2476855C/en not_active Expired - Fee Related
- 2003-02-21 CN CNB038043181A patent/CN100545299C/zh not_active Expired - Fee Related
- 2003-02-21 KR KR1020047012566A patent/KR100956491B1/ko active IP Right Grant
- 2003-02-21 EP EP03710534A patent/EP1483425B1/en not_active Expired - Lifetime
- 2003-02-21 BR BR0307800A patent/BR0307800B1/pt not_active IP Right Cessation
- 2003-02-21 RU RU2004128083A patent/RU2316611C2/ru not_active IP Right Cessation
- 2003-02-21 AU AU2003221458A patent/AU2003221458A1/en not_active Abandoned
- 2003-02-21 WO PCT/NL2003/000139 patent/WO2003071000A1/en active Application Filing
- 2003-02-21 ES ES03710534T patent/ES2309305T3/es not_active Expired - Lifetime
- 2003-02-21 AT AT03710534T patent/ATE399889T1/de active
-
2004
- 2004-08-23 US US10/923,505 patent/US7323229B2/en not_active Expired - Fee Related
-
2005
- 2005-11-18 HK HK05110333A patent/HK1078616A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2476855A1 (en) | 2003-08-28 |
JP2005523381A (ja) | 2005-08-04 |
JP4522709B2 (ja) | 2010-08-11 |
RU2004128083A (ru) | 2005-06-10 |
EP1483425A1 (en) | 2004-12-08 |
CN100545299C (zh) | 2009-09-30 |
ATE399889T1 (de) | 2008-07-15 |
CA2476855C (en) | 2009-12-22 |
US20050064110A1 (en) | 2005-03-24 |
NL1020059C2 (nl) | 2003-08-25 |
RU2316611C2 (ru) | 2008-02-10 |
BR0307800A (pt) | 2004-12-14 |
CN1636077A (zh) | 2005-07-06 |
KR20040085192A (ko) | 2004-10-07 |
AU2003221458A1 (en) | 2003-09-09 |
US7323229B2 (en) | 2008-01-29 |
EP1483425B1 (en) | 2008-07-02 |
DE60321893D1 (de) | 2008-08-14 |
BR0307800B1 (pt) | 2012-09-04 |
ES2309305T3 (es) | 2008-12-16 |
WO2003071000A1 (en) | 2003-08-28 |
KR100956491B1 (ko) | 2010-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20140221 |