HK1076829A1 - Filler reinforced polyether imide resin composition and molded article thereof - Google Patents
Filler reinforced polyether imide resin composition and molded article thereofInfo
- Publication number
- HK1076829A1 HK1076829A1 HK05108856A HK05108856A HK1076829A1 HK 1076829 A1 HK1076829 A1 HK 1076829A1 HK 05108856 A HK05108856 A HK 05108856A HK 05108856 A HK05108856 A HK 05108856A HK 1076829 A1 HK1076829 A1 HK 1076829A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- weight
- polyether imide
- imide resin
- filler
- fibrous
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002109570A JP3947030B2 (ja) | 2002-04-11 | 2002-04-11 | 充填材強化ポリエーテルイミド系樹脂組成物およびその成形品 |
PCT/US2003/011141 WO2003087226A1 (en) | 2002-04-11 | 2003-04-11 | Filler reinforced polyether imide resin composition and molded article thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1076829A1 true HK1076829A1 (en) | 2006-01-27 |
Family
ID=29243206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05108856A HK1076829A1 (en) | 2002-04-11 | 2005-10-06 | Filler reinforced polyether imide resin composition and molded article thereof |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1497374B1 (de) |
JP (1) | JP3947030B2 (de) |
KR (1) | KR100997824B1 (de) |
CN (1) | CN1314761C (de) |
AT (1) | ATE404634T1 (de) |
AU (1) | AU2003230872A1 (de) |
DE (1) | DE60322873D1 (de) |
HK (1) | HK1076829A1 (de) |
WO (1) | WO2003087226A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050038145A1 (en) * | 2003-08-11 | 2005-02-17 | General Electric Company | Flame retardant fiber reinforced composition with improved flow |
WO2006075721A1 (ja) * | 2005-01-12 | 2006-07-20 | Sumitomo Chemical Company, Limited | オキソカーボン類を含有する組成物及びその用途 |
KR100796006B1 (ko) * | 2006-08-10 | 2008-01-21 | 송홍준 | 유리섬유 촙을 이용한 전기기기 보호재 및 그 제조 방법 |
US8829100B2 (en) | 2006-12-19 | 2014-09-09 | Sabic Innovative Plastics Ip B.V. | Reinforced amorphous polymer composition |
WO2008091253A1 (en) * | 2007-01-25 | 2008-07-31 | Sabic Innovative Plastics Ip B.V. | High heat electrical connectors |
KR101348534B1 (ko) * | 2010-11-26 | 2014-01-07 | 주식회사 삼양사 | 유리섬유 강화 폴리카보네이트 수지 조성물 |
EP2468809A1 (de) * | 2010-12-23 | 2012-06-27 | LANXESS Deutschland GmbH | Zusammensetzungen |
US9328241B2 (en) * | 2012-09-12 | 2016-05-03 | Sabic Global Technologies B.V. | Thermoplastic polyimide as flow promoter and flame retardant synergist for filled polyamide compositions |
EP2938677A4 (de) * | 2012-12-31 | 2016-08-03 | Sabic Global Technologies Bv | Hochfliessfähige verstärkte polyimidzusammensetzungen mit sehr niedriger restkontamination für festplattenlaufwerkgehäuse |
IN2015DN02777A (de) * | 2012-12-31 | 2015-09-04 | Sabic Innovative Plastics Ip | |
CN103304976A (zh) * | 2013-06-24 | 2013-09-18 | 苏州新区佳合塑胶有限公司 | 电子产品用增强增韧塑料及其制备方法 |
CN105940044B (zh) * | 2014-01-31 | 2019-07-12 | 沙特基础工业全球技术有限公司 | 纤维复合材料 |
CN103980707B (zh) * | 2014-05-21 | 2016-06-08 | 中国工程物理研究院化工材料研究所 | 韧化聚醚酰亚胺复合材料及其制备方法 |
US10329421B2 (en) * | 2014-06-11 | 2019-06-25 | Sabic Global Technologies B.V. | Polycarbonate compositions, method of manufacture thereof, and articles therefrom |
KR101935087B1 (ko) | 2014-12-31 | 2019-01-03 | 롯데첨단소재(주) | 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품 |
WO2016108539A1 (ko) * | 2014-12-31 | 2016-07-07 | 삼성에스디아이 주식회사 | 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품 |
JP6500572B2 (ja) | 2015-04-14 | 2019-04-17 | オムロン株式会社 | 回路構造体 |
CN105176082A (zh) * | 2015-09-16 | 2015-12-23 | 东莞深圳清华大学研究院创新中心 | 一种复合3d打印材料及其制备方法 |
JP2017155172A (ja) * | 2016-03-03 | 2017-09-07 | 国立大学法人信州大学 | 炭素繊維強化プラスチック及びその製造方法並びに炭素繊維 |
CN105924920A (zh) * | 2016-04-22 | 2016-09-07 | 宁波高新区夏远科技有限公司 | 一种散热防菌插线板及其制备方法 |
CN107057352A (zh) * | 2017-05-16 | 2017-08-18 | 扬中市中兴塑料配件厂 | 一种聚醚酰亚胺复合材质导向套的制备方法 |
CN107033593A (zh) * | 2017-05-16 | 2017-08-11 | 扬中市中兴塑料配件厂 | 一种聚醚酰亚胺复合材质的导向套 |
CN107739505A (zh) * | 2017-11-10 | 2018-02-27 | 南京立汉化学有限公司 | 一种耐热玻璃纤维增强尼龙612及其制备方法 |
CN108641164A (zh) * | 2018-05-11 | 2018-10-12 | 江苏奥神新材料股份有限公司 | 一种超细旦聚酰亚胺短切纤维改性聚烯烃及其制备方法 |
CN112126227B (zh) * | 2019-06-25 | 2023-03-14 | 财团法人纺织产业综合研究所 | 塑料组成物以及纤维 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1232993A (en) * | 1982-09-29 | 1988-02-16 | Markus Matzner | Blends of poly(etherimides) and polyamides |
DE3931649A1 (de) * | 1989-09-22 | 1991-04-04 | Basf Ag | Thermoplastische formmassen aus faserverstaerkten hochtemperaturbestaendigen thermoplasten |
JP4460672B2 (ja) * | 1998-04-24 | 2010-05-12 | 三井化学株式会社 | Icトレー |
-
2002
- 2002-04-11 JP JP2002109570A patent/JP3947030B2/ja not_active Expired - Lifetime
-
2003
- 2003-04-11 AU AU2003230872A patent/AU2003230872A1/en not_active Abandoned
- 2003-04-11 CN CNB038132818A patent/CN1314761C/zh not_active Expired - Fee Related
- 2003-04-11 EP EP03723978A patent/EP1497374B1/de not_active Expired - Lifetime
- 2003-04-11 DE DE60322873T patent/DE60322873D1/de not_active Expired - Lifetime
- 2003-04-11 WO PCT/US2003/011141 patent/WO2003087226A1/en active Application Filing
- 2003-04-11 AT AT03723978T patent/ATE404634T1/de not_active IP Right Cessation
- 2003-04-11 KR KR1020047016220A patent/KR100997824B1/ko active IP Right Grant
-
2005
- 2005-10-06 HK HK05108856A patent/HK1076829A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1659234A (zh) | 2005-08-24 |
DE60322873D1 (de) | 2008-09-25 |
WO2003087226A1 (en) | 2003-10-23 |
KR100997824B1 (ko) | 2010-12-01 |
ATE404634T1 (de) | 2008-08-15 |
AU2003230872A1 (en) | 2003-10-27 |
JP2003301105A (ja) | 2003-10-21 |
EP1497374B1 (de) | 2008-08-13 |
KR20040111502A (ko) | 2004-12-31 |
EP1497374A1 (de) | 2005-01-19 |
JP3947030B2 (ja) | 2007-07-18 |
CN1314761C (zh) | 2007-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20110411 |