HK1037093A1 - Method for producing etched circuits - Google Patents
Method for producing etched circuitsInfo
- Publication number
- HK1037093A1 HK1037093A1 HK01107986A HK01107986A HK1037093A1 HK 1037093 A1 HK1037093 A1 HK 1037093A1 HK 01107986 A HK01107986 A HK 01107986A HK 01107986 A HK01107986 A HK 01107986A HK 1037093 A1 HK1037093 A1 HK 1037093A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- resist
- photo
- crosslinked
- copper
- light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH191298 | 1998-09-18 | ||
PCT/EP1999/006618 WO2000018199A1 (de) | 1998-09-18 | 1999-09-09 | Verfahren zur herstellung von geätzten schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1037093A1 true HK1037093A1 (en) | 2002-01-25 |
Family
ID=4221507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01107986A HK1037093A1 (en) | 1998-09-18 | 2001-11-13 | Method for producing etched circuits |
Country Status (13)
Country | Link |
---|---|
US (1) | US6653055B1 (ko) |
EP (1) | EP1116421B1 (ko) |
JP (1) | JP2002525880A (ko) |
KR (1) | KR100749444B1 (ko) |
CN (1) | CN1223247C (ko) |
AT (1) | ATE242590T1 (ko) |
AU (1) | AU5861599A (ko) |
CA (1) | CA2342232C (ko) |
DE (1) | DE59905871D1 (ko) |
ES (1) | ES2200552T3 (ko) |
HK (1) | HK1037093A1 (ko) |
TW (1) | TW444526B (ko) |
WO (1) | WO2000018199A1 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100708042B1 (ko) * | 2001-07-28 | 2007-04-16 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지용 섭스트레이트의 제조 방법 |
JP4624217B2 (ja) * | 2005-09-02 | 2011-02-02 | 日本メクトロン株式会社 | 回路基板の製造方法 |
US20080221590A1 (en) * | 2007-03-05 | 2008-09-11 | Intuitive Surgical, Inc. | Apparatus for positioning and holding in place a manually manipulated medical device during the performance of a robotically assisted medical procedure |
TW200941322A (en) * | 2008-03-28 | 2009-10-01 | Tpk Touch Solutions Inc | Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit |
TWI459436B (zh) * | 2008-10-27 | 2014-11-01 | Tpk Touch Solutions Inc | The Method of Making Double - sided Graphic Structure of Touch Circuit |
KR101041130B1 (ko) * | 2008-10-31 | 2011-06-13 | 주식회사 심텍 | 니켈 도금을 이용한 인쇄회로기판 제조방법 |
CN101932206B (zh) * | 2009-06-25 | 2012-06-13 | 富葵精密组件(深圳)有限公司 | 多层电路板的制作方法 |
US8840077B2 (en) | 2011-08-24 | 2014-09-23 | Coopersurgical, Inc. | Table-mounted surgical instrument stabilizers |
CN103917053A (zh) * | 2014-04-22 | 2014-07-09 | 上海尚容电子科技有限公司 | 镍作为碱性蚀刻抗蚀层材料的应用 |
CN107003257B (zh) * | 2014-12-08 | 2020-07-03 | 三井金属矿业株式会社 | 印刷板线路板的制造方法 |
CN105899003B (zh) | 2015-11-06 | 2019-11-26 | 武汉光谷创元电子有限公司 | 单层电路板、多层电路板以及它们的制造方法 |
JP7039497B2 (ja) | 2016-07-14 | 2022-03-22 | インテュイティブ サージカル オペレーションズ, インコーポレイテッド | 手術用器具を制御するためのシステム及び方法 |
CN108243571A (zh) * | 2016-12-23 | 2018-07-03 | 东莞新科技术研究开发有限公司 | 柔性电路板的制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB830187A (en) * | 1957-08-20 | 1960-03-09 | Gen Electric Co Ltd | Improvements in or relating to the manufacture of printed circuit panels |
FR1445569A (fr) * | 1965-05-18 | 1966-07-15 | Thomson Houston Comp Francaise | Perfectionnements aux réalisations de câblages imprimés et de leurs interconnexions |
JPS61247090A (ja) * | 1985-04-24 | 1986-11-04 | 日本ペイント株式会社 | 半田スル−ホ−ルを有する回路板の製造方法 |
US4732649A (en) * | 1986-06-18 | 1988-03-22 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
DE3732249A1 (de) | 1987-09-24 | 1989-04-13 | Siemens Ag | Verfahren zur herstellung von dreidimensionalen leiterplatten |
JPH03194992A (ja) * | 1989-12-23 | 1991-08-26 | Ibiden Co Ltd | プリント基板の製造方法 |
-
1999
- 1999-09-09 WO PCT/EP1999/006618 patent/WO2000018199A1/de active IP Right Grant
- 1999-09-09 AU AU58615/99A patent/AU5861599A/en not_active Abandoned
- 1999-09-09 EP EP99946145A patent/EP1116421B1/de not_active Expired - Lifetime
- 1999-09-09 KR KR1020017001679A patent/KR100749444B1/ko not_active IP Right Cessation
- 1999-09-09 JP JP2000571724A patent/JP2002525880A/ja active Pending
- 1999-09-09 CN CNB998110922A patent/CN1223247C/zh not_active Expired - Fee Related
- 1999-09-09 AT AT99946145T patent/ATE242590T1/de not_active IP Right Cessation
- 1999-09-09 CA CA002342232A patent/CA2342232C/en not_active Expired - Fee Related
- 1999-09-09 US US09/787,220 patent/US6653055B1/en not_active Expired - Fee Related
- 1999-09-09 DE DE59905871T patent/DE59905871D1/de not_active Expired - Fee Related
- 1999-09-09 ES ES99946145T patent/ES2200552T3/es not_active Expired - Lifetime
- 1999-09-16 TW TW088115981A patent/TW444526B/zh not_active IP Right Cessation
-
2001
- 2001-11-13 HK HK01107986A patent/HK1037093A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW444526B (en) | 2001-07-01 |
CA2342232C (en) | 2008-12-23 |
AU5861599A (en) | 2000-04-10 |
CA2342232A1 (en) | 2000-03-30 |
JP2002525880A (ja) | 2002-08-13 |
US6653055B1 (en) | 2003-11-25 |
CN1223247C (zh) | 2005-10-12 |
KR100749444B1 (ko) | 2007-08-17 |
KR20010072343A (ko) | 2001-07-31 |
WO2000018199A1 (de) | 2000-03-30 |
CN1319323A (zh) | 2001-10-24 |
EP1116421A1 (de) | 2001-07-18 |
DE59905871D1 (de) | 2003-07-10 |
EP1116421B1 (de) | 2003-06-04 |
ATE242590T1 (de) | 2003-06-15 |
ES2200552T3 (es) | 2004-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090909 |