GB1403219A - Process for depositing copper layers on shaped articles of a polyimide - Google Patents
Process for depositing copper layers on shaped articles of a polyimideInfo
- Publication number
- GB1403219A GB1403219A GB5607872A GB5607872A GB1403219A GB 1403219 A GB1403219 A GB 1403219A GB 5607872 A GB5607872 A GB 5607872A GB 5607872 A GB5607872 A GB 5607872A GB 1403219 A GB1403219 A GB 1403219A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acid
- polyimide
- per cent
- dec
- shaped articles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
1403219 Electroless plating of polyimides HOECHST AG 5 Dec 1972 [8 Dec 1971] 56078/72 Heading C7F A polyimide resin is electroless plated with copper by contacting it with a noble metal salt e.g. Pt, Pd, Au or Ag and a halogenated alkanoic acid, e.g. trichloro or trifluoroacetic acids or 2, 2, 3-trichloroptopionic acid, and applying a reducing agent e.g. stannous chloride or hydrazine hydrate, which does not contain a halogenated alkanoic acid, either before or after the noble metal salt. The solvent for the alkanoic acid may be water, acetone or butanone. The polyimide may be first contacted with a 1 to 5 per cent chromic acid, 30 to 60 per cent phosphoric acid, and 30 to 50 per cent sulphuric acid solution. The solutions may contain a wetting agent.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2160821A DE2160821C3 (en) | 1971-12-08 | 1971-12-08 | Process for the deposition of copper layers on molded articles made of polyimides |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1403219A true GB1403219A (en) | 1975-08-28 |
Family
ID=5827354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5607872A Expired GB1403219A (en) | 1971-12-08 | 1972-12-05 | Process for depositing copper layers on shaped articles of a polyimide |
Country Status (10)
Country | Link |
---|---|
US (1) | US3881049A (en) |
JP (1) | JPS4866168A (en) |
AT (1) | AT322320B (en) |
BE (1) | BE792310A (en) |
CA (1) | CA990593A (en) |
DE (1) | DE2160821C3 (en) |
FR (1) | FR2162526B1 (en) |
GB (1) | GB1403219A (en) |
IT (1) | IT973915B (en) |
NL (1) | NL7216124A (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL176479C (en) * | 1971-12-08 | 1985-04-16 | Hoechst Ag | METHOD FOR COATING PLASTIC ARTICLES WITH COPPER |
GB2040969B (en) * | 1978-12-19 | 1983-04-13 | Crown City Plating Co | Conditioning of polyamides for electroless plating |
DE3328765A1 (en) * | 1983-08-05 | 1985-02-14 | Schering AG, 1000 Berlin und 4709 Bergkamen | SOLUTION FOR PRE-TREATING POLYIMIDE |
US4720401A (en) * | 1985-01-11 | 1988-01-19 | International Business Machines Corporation | Enhanced adhesion between metals and polymers |
DE3743780A1 (en) * | 1987-12-23 | 1989-07-06 | Bayer Ag | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES |
US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
EP0341504A3 (en) * | 1988-05-09 | 1991-01-16 | General Electric Company | Plastic chip carrier package and method of preparation |
US5242713A (en) * | 1988-12-23 | 1993-09-07 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
US5178956A (en) * | 1989-10-03 | 1993-01-12 | Shipley Company Inc. | Pretreatment process for electroless plating of polyimides |
WO1991017286A1 (en) * | 1990-05-04 | 1991-11-14 | Battelle Memorial Institute | Process for depositing thin film layers onto surfaces modified with organic functional groups and products formed thereby |
US5187241A (en) * | 1990-05-15 | 1993-02-16 | International Business Machines Corporation | Isoimide modifications of a polyimide and reaction thereof with nucleophiles |
US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
US5151304A (en) * | 1991-01-22 | 1992-09-29 | International Business Machines Corporation | Structure and method for enhancing adhesion to a polyimide surface |
US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
US5290597A (en) * | 1992-04-27 | 1994-03-01 | General Electric Company | Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon |
JP4086946B2 (en) * | 1998-01-05 | 2008-05-14 | 日東電工株式会社 | Thermally conductive pressure-sensitive adhesive sheets and methods for fixing electronic components and heat dissipation members using the same |
JP4917841B2 (en) * | 2006-06-09 | 2012-04-18 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Electroless plating method on resin surface |
US7981508B1 (en) | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
TWI595024B (en) * | 2016-06-23 | 2017-08-11 | 臻鼎科技股份有限公司 | Polyamic acid, copper clad laminate and circuit board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
US3544432A (en) * | 1968-03-19 | 1970-12-01 | Chisso Corp | Electroplating plastic articles |
US3684572A (en) * | 1970-07-13 | 1972-08-15 | Du Pont | Electroless nickel plating process for nonconductors |
US3704156A (en) * | 1970-07-13 | 1972-11-28 | Du Pont | Catalyst solution for electroless plating on nonconductors |
DE2101049A1 (en) * | 1971-01-11 | 1972-08-03 | Siemens Ag | Process for preferably double-sided coating of plastic foils with .Metall |
US3736170A (en) * | 1971-06-28 | 1973-05-29 | Ibm | Process for improved adhesion of electroless copper to a polyimide surface |
US3791848A (en) * | 1972-05-19 | 1974-02-12 | Western Electric Co | A method of improving the adherence of a metal deposit to a polyimide surface |
-
0
- BE BE792310D patent/BE792310A/en unknown
-
1971
- 1971-12-08 DE DE2160821A patent/DE2160821C3/en not_active Expired
-
1972
- 1972-11-28 NL NL7216124A patent/NL7216124A/xx unknown
- 1972-12-05 GB GB5607872A patent/GB1403219A/en not_active Expired
- 1972-12-05 US US31227272 patent/US3881049A/en not_active Expired - Lifetime
- 1972-12-05 AT AT1033772A patent/AT322320B/en not_active IP Right Cessation
- 1972-12-06 IT IT5450572A patent/IT973915B/en active
- 1972-12-06 CA CA158,211A patent/CA990593A/en not_active Expired
- 1972-12-06 JP JP12237972A patent/JPS4866168A/ja active Pending
- 1972-12-07 FR FR7243524A patent/FR2162526B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CA990593A (en) | 1976-06-08 |
BE792310A (en) | 1973-06-05 |
DE2160821A1 (en) | 1973-06-20 |
US3881049A (en) | 1975-04-29 |
FR2162526A1 (en) | 1973-07-20 |
DE2160821C3 (en) | 1979-02-08 |
NL7216124A (en) | 1973-06-13 |
DE2160821B2 (en) | 1978-06-08 |
IT973915B (en) | 1974-06-10 |
JPS4866168A (en) | 1973-09-11 |
FR2162526B1 (en) | 1976-08-20 |
AT322320B (en) | 1975-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1403219A (en) | Process for depositing copper layers on shaped articles of a polyimide | |
GB1343211A (en) | Treatmetn of resin substrates for the reception of metal deposits | |
US3553085A (en) | Method of preparing surfaces of plastic for electro-deposition | |
GB1307927A (en) | Electroless plating | |
US4035227A (en) | Method for treating plastic substrates prior to plating | |
US4244739A (en) | Catalytic solution for the electroless deposition of metals | |
GB955781A (en) | Electroless plating process | |
GB1348793A (en) | Method of electroless deposition of metals with improved sensitizer | |
GB1461036A (en) | Process and liquid for the catalytic sensitization of non- metallic surfaces for subsequent electroless metallization | |
GB1206741A (en) | Process for electroplating polyoxymethylene resins | |
GB918220A (en) | Method of chemically plating a dielectric article | |
JPS58500765A (en) | A method for chemically stripping a plating layer containing palladium and at least one of copper and nickel, and a bath used in the method | |
KR900018410A (en) | Electroless Plating Method | |
GB1198193A (en) | Prevention of Skip Plating in an Electroless Nickel Bath | |
GB1164459A (en) | A Process for the Metallisation of Non-Conductors | |
GB892451A (en) | Improvements in and relating to the manufacture of printed circuits | |
ES371593A1 (en) | Method of preventing rack plating in continuous plating cycle for nonconductive articles | |
GB1214420A (en) | Surface-pretreatment of non-metallic articles for chemical nickel-plating | |
GB1400600A (en) | Process for the manufacture of articles comprising copper coatings on shaped plastics supports | |
US3959564A (en) | Method for the preliminary treatment of plastic surfaces for electroplating | |
GB604644A (en) | Improvements in or relating to the metallising of non-metallic bodies | |
JPH02111883A (en) | Electroless metal plating method | |
GB1518301A (en) | Deposition of copper | |
GB1390451A (en) | Manufacture of metallized shaped bodies of macromolecular material | |
GB1343212A (en) | Treatmetn of resin substrates for the reception of metal doposits |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |