JPS4866168A - - Google Patents

Info

Publication number
JPS4866168A
JPS4866168A JP12237972A JP12237972A JPS4866168A JP S4866168 A JPS4866168 A JP S4866168A JP 12237972 A JP12237972 A JP 12237972A JP 12237972 A JP12237972 A JP 12237972A JP S4866168 A JPS4866168 A JP S4866168A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12237972A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4866168A publication Critical patent/JPS4866168A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
JP12237972A 1971-12-08 1972-12-06 Pending JPS4866168A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160821A DE2160821C3 (en) 1971-12-08 1971-12-08 Process for the deposition of copper layers on molded articles made of polyimides

Publications (1)

Publication Number Publication Date
JPS4866168A true JPS4866168A (en) 1973-09-11

Family

ID=5827354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12237972A Pending JPS4866168A (en) 1971-12-08 1972-12-06

Country Status (10)

Country Link
US (1) US3881049A (en)
JP (1) JPS4866168A (en)
AT (1) AT322320B (en)
BE (1) BE792310A (en)
CA (1) CA990593A (en)
DE (1) DE2160821C3 (en)
FR (1) FR2162526B1 (en)
GB (1) GB1403219A (en)
IT (1) IT973915B (en)
NL (1) NL7216124A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6075581A (en) * 1983-08-05 1985-04-27 シエ−リング・アクチエンゲゼルシヤフト Aqueous solution for pretreating polyimide and polyimide high bondage metallizing process

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL176479C (en) * 1971-12-08 1985-04-16 Hoechst Ag METHOD FOR COATING PLASTIC ARTICLES WITH COPPER
GB2040969B (en) * 1978-12-19 1983-04-13 Crown City Plating Co Conditioning of polyamides for electroless plating
US4720401A (en) * 1985-01-11 1988-01-19 International Business Machines Corporation Enhanced adhesion between metals and polymers
DE3743780A1 (en) * 1987-12-23 1989-07-06 Bayer Ag METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
EP0341504A3 (en) * 1988-05-09 1991-01-16 General Electric Company Plastic chip carrier package and method of preparation
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5178956A (en) * 1989-10-03 1993-01-12 Shipley Company Inc. Pretreatment process for electroless plating of polyimides
AU7904891A (en) * 1990-05-04 1991-11-27 Battelle Memorial Institute Process for depositing thin film layers onto surfaces modified with organic functional groups and products formed thereby
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5151304A (en) * 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
JP4086946B2 (en) * 1998-01-05 2008-05-14 日東電工株式会社 Thermally conductive pressure-sensitive adhesive sheets and methods for fixing electronic components and heat dissipation members using the same
JP4917841B2 (en) * 2006-06-09 2012-04-18 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Electroless plating method on resin surface
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
TWI595024B (en) * 2016-06-23 2017-08-11 臻鼎科技股份有限公司 Polyamic acid, copper clad laminate and circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3544432A (en) * 1968-03-19 1970-12-01 Chisso Corp Electroplating plastic articles
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
US3684572A (en) * 1970-07-13 1972-08-15 Du Pont Electroless nickel plating process for nonconductors
DE2101049A1 (en) * 1971-01-11 1972-08-03 Siemens Ag Process for preferably double-sided coating of plastic foils with .Metall
US3736170A (en) * 1971-06-28 1973-05-29 Ibm Process for improved adhesion of electroless copper to a polyimide surface
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6075581A (en) * 1983-08-05 1985-04-27 シエ−リング・アクチエンゲゼルシヤフト Aqueous solution for pretreating polyimide and polyimide high bondage metallizing process

Also Published As

Publication number Publication date
DE2160821A1 (en) 1973-06-20
DE2160821B2 (en) 1978-06-08
FR2162526B1 (en) 1976-08-20
NL7216124A (en) 1973-06-13
CA990593A (en) 1976-06-08
FR2162526A1 (en) 1973-07-20
GB1403219A (en) 1975-08-28
IT973915B (en) 1974-06-10
AT322320B (en) 1975-05-12
US3881049A (en) 1975-04-29
DE2160821C3 (en) 1979-02-08
BE792310A (en) 1973-06-05

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