GB892451A - Improvements in and relating to the manufacture of printed circuits - Google Patents

Improvements in and relating to the manufacture of printed circuits

Info

Publication number
GB892451A
GB892451A GB3763857A GB3763857A GB892451A GB 892451 A GB892451 A GB 892451A GB 3763857 A GB3763857 A GB 3763857A GB 3763857 A GB3763857 A GB 3763857A GB 892451 A GB892451 A GB 892451A
Authority
GB
United Kingdom
Prior art keywords
metal
solution
resist
litre
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3763857A
Inventor
Wolf Isaac Flack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RADIO AND ALLIED IND Ltd
Original Assignee
RADIO AND ALLIED IND Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RADIO AND ALLIED IND Ltd filed Critical RADIO AND ALLIED IND Ltd
Priority to GB3763857A priority Critical patent/GB892451A/en
Publication of GB892451A publication Critical patent/GB892451A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

A printed circuit is formed by applying a resist to a metallic layer on an insulating support, leaving exposed the required conductor pattern, electro-plating a conductive metal on to the pattern, removing the resist and subsequently removing unplated parts of the metallic layer. An insulated panel, in which any required holes have been previously pierced, has both faces of the panel and the walls of the holes coated with an adhesive lacquer, such as an elastomeric resin. A sensitising solution containing 2% stannous chloride is then applied, followed by a coating of metal. This latter coating may be applied by spraying on a solution of a salt, such as, silver nitrate solution containing ammonium hydroxide, and a reducing solution containing formaldehyde and sugar. The temperature of the solutions may be conveniently controlled by passing them through U-tubes immersed in water, the temperature of which is thermostatically controlled. After cleaning and drying, a resist is applied to both surfaces to leave exposed the required conductor pattern. The exposed part of the metallic layer is plated with a metal of good conductivity, preferably using a pyro-phosphate of the metal. In one method the panel is immersed first for 15 minutes in a solution comprising:- ..gm/litre .copper.25 .pyro-phosphate.175 .citrate.10 .nitrate.10 .ammonia.2 and secondly for 30 minutes in a solution comprising 240 gm/litre copper and 250 gm/litre sulphuric acid. The deposited copper layer is overplated with a layer of tin in a suitable plating solution comprising, for example:- ..gm/litre .stannous tin.55 .lead.25 .fluoboric acid.40 .mollasses.20 .glue.5 After plating the resist is removed by a suitable solvent and the panel cleaned in a water spray, leaving exposed the first metal layer. This is then removed in a solution containing chromic acid and sulphuric acid, suitable proportions being 20% chromic trioxide and 10% sulphuric acid. p Reference has been directed by the Comptroller to Specification 824,089.
GB3763857A 1957-12-03 1957-12-03 Improvements in and relating to the manufacture of printed circuits Expired GB892451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3763857A GB892451A (en) 1957-12-03 1957-12-03 Improvements in and relating to the manufacture of printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3763857A GB892451A (en) 1957-12-03 1957-12-03 Improvements in and relating to the manufacture of printed circuits

Publications (1)

Publication Number Publication Date
GB892451A true GB892451A (en) 1962-03-28

Family

ID=10397895

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3763857A Expired GB892451A (en) 1957-12-03 1957-12-03 Improvements in and relating to the manufacture of printed circuits

Country Status (1)

Country Link
GB (1) GB892451A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1258941B (en) * 1963-01-21 1968-01-18 Ibm Process for making multilayer thin film circuit boards
US3514538A (en) * 1968-11-01 1970-05-26 Intern Electronics Research Co Thermal dissipating metal core printed circuit board
DE1665314B1 (en) * 1966-02-22 1971-03-04 Kollmorgen Tech Corp BASIC MATERIAL FOR THE PRODUCTION OF PRINTED CIRCUITS
USRE29784E (en) 1968-11-01 1978-09-26 International Electronics Research Corp. Thermal dissipating metal core printed circuit board
FR2447131A1 (en) * 1978-09-07 1980-08-14 Int Standard Electric Corp METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARDS
GB2126608A (en) * 1982-09-02 1984-03-28 Occidental Chem Co Electroless copper plating rate controller
CN103225092A (en) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 Plated copper for plastics

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1258941B (en) * 1963-01-21 1968-01-18 Ibm Process for making multilayer thin film circuit boards
DE1665314B1 (en) * 1966-02-22 1971-03-04 Kollmorgen Tech Corp BASIC MATERIAL FOR THE PRODUCTION OF PRINTED CIRCUITS
US3514538A (en) * 1968-11-01 1970-05-26 Intern Electronics Research Co Thermal dissipating metal core printed circuit board
USRE29784E (en) 1968-11-01 1978-09-26 International Electronics Research Corp. Thermal dissipating metal core printed circuit board
FR2447131A1 (en) * 1978-09-07 1980-08-14 Int Standard Electric Corp METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARDS
GB2126608A (en) * 1982-09-02 1984-03-28 Occidental Chem Co Electroless copper plating rate controller
CN103225092A (en) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 Plated copper for plastics

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