GB1126327A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1126327A GB1126327A GB1815566A GB1815566A GB1126327A GB 1126327 A GB1126327 A GB 1126327A GB 1815566 A GB1815566 A GB 1815566A GB 1815566 A GB1815566 A GB 1815566A GB 1126327 A GB1126327 A GB 1126327A
- Authority
- GB
- United Kingdom
- Prior art keywords
- april
- oxides
- reducing agent
- atoms per
- rare earths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1,126,327. Electroless copper deposition. PHOTOCIRCUITS CORP. April 26, 1966 [April 27, 1965], No.18155/66. Heading C7F. In a process for the electroless deposition of Cu on metallic or non-metallic substrates an aqueous solution of a Cu salt contains a complexing agent, a reducing agent, a pH adjuster and at least 0À1 microgram atoms per litre of a compound containing an element selected from the group consisting of Mo, Nb, W, Re, V, As, Sb, Bi, Ac, La, the rare earths or mixtures of these. Examples of the stabilizing compounds added are MoO 3 , ammonium molybdate, oxides of W, V, Re and As, the tungstates, vanadates, arsenates and rhenates of Groups 1A and 11A and ammonium, the oxides, sulphates, nitrates, halides and acetates of Sb, Bi, La, Ac and the rare earths and the preferred concentration is 0À1-1,000 microgram atoms per litre. The pH of the solution is maintained at 10-14 by the addition of alkali metal hydroxide and the reducing agent is formaldehyde. Less than 5gms/litre of surfactants such as organic phosphate esters and oxyethylated salts may be added. Non-metallic substrates which are to be coated are first sensitized with an acid solution of SnCl 2 and PdCl 2 .
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45133565A | 1965-04-27 | 1965-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1126327A true GB1126327A (en) | 1968-09-05 |
Family
ID=23791808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1815566A Expired GB1126327A (en) | 1965-04-27 | 1966-04-26 | Electroless copper plating |
Country Status (6)
Country | Link |
---|---|
AT (1) | AT270331B (en) |
CH (1) | CH476856A (en) |
DE (1) | DE1521444B1 (en) |
DK (1) | DK131998C (en) |
GB (1) | GB1126327A (en) |
SE (1) | SE339372B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2747562A1 (en) * | 1977-10-20 | 1979-05-03 | Schering Ag | PROCESS AND PLANT FOR THE RECOVERY OF METALS AND OTHER RECYCLING SUBSTANCES IN WASTE WATER FROM CHEMICAL SURFACE TREATMENT PLANTS |
EP0132594A1 (en) * | 1983-07-25 | 1985-02-13 | Hitachi, Ltd. | Electroless copper plating solution |
-
1966
- 1966-04-25 AT AT388566A patent/AT270331B/en active
- 1966-04-25 CH CH597466A patent/CH476856A/en not_active IP Right Cessation
- 1966-04-25 DE DE19661521444 patent/DE1521444B1/en active Pending
- 1966-04-26 GB GB1815566A patent/GB1126327A/en not_active Expired
- 1966-04-26 DK DK211466A patent/DK131998C/en active
- 1966-04-27 SE SE572466A patent/SE339372B/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2747562A1 (en) * | 1977-10-20 | 1979-05-03 | Schering Ag | PROCESS AND PLANT FOR THE RECOVERY OF METALS AND OTHER RECYCLING SUBSTANCES IN WASTE WATER FROM CHEMICAL SURFACE TREATMENT PLANTS |
EP0132594A1 (en) * | 1983-07-25 | 1985-02-13 | Hitachi, Ltd. | Electroless copper plating solution |
Also Published As
Publication number | Publication date |
---|---|
DK131998C (en) | 1976-05-03 |
AT270331B (en) | 1969-04-25 |
SE339372B (en) | 1971-10-04 |
CH476856A (en) | 1969-08-15 |
DK131998B (en) | 1975-10-06 |
DE1521444B1 (en) | 1969-11-06 |
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