GB1314745A - Electroless plating bath for depositing a nickel alloy layer - Google Patents

Electroless plating bath for depositing a nickel alloy layer

Info

Publication number
GB1314745A
GB1314745A GB3865971A GB3865971A GB1314745A GB 1314745 A GB1314745 A GB 1314745A GB 3865971 A GB3865971 A GB 3865971A GB 3865971 A GB3865971 A GB 3865971A GB 1314745 A GB1314745 A GB 1314745A
Authority
GB
United Kingdom
Prior art keywords
electroless plating
depositing
alloy layer
plating bath
moles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3865971A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1314745A publication Critical patent/GB1314745A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1314745 Electroless plating INTERNATIONAL BUSINESS MACHINES CORP 18 Aug 1971 [27 Nov 1970] 38659/71 Heading C7F A Ni-Sn or Ni-Mo alloy is electrolessly deposited on a Cu, Ni or Fe substrate activated with Pd, the bath containing 0À1 moles of Ni catrons, tin salt e.g. SnCl 4 providing 0À1 to 0À4 moles of Sn (OH) 6 anions or molybdenum salt providing 0À1 to 0À5 moles of MoO 4 . The salt may also contain glycine, hypophosphite, tartrate or citrate ions. The pH is about 13À5 and the temperature may be 20 to 40‹C.
GB3865971A 1970-11-27 1971-08-18 Electroless plating bath for depositing a nickel alloy layer Expired GB1314745A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9344470A 1970-11-27 1970-11-27

Publications (1)

Publication Number Publication Date
GB1314745A true GB1314745A (en) 1973-04-26

Family

ID=22238993

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3865971A Expired GB1314745A (en) 1970-11-27 1971-08-18 Electroless plating bath for depositing a nickel alloy layer

Country Status (5)

Country Link
US (1) US3674516A (en)
CA (1) CA967705A (en)
DE (1) DE2148744A1 (en)
FR (1) FR2115164B1 (en)
GB (1) GB1314745A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US5190796A (en) * 1991-06-27 1993-03-02 General Electric Company Method of applying metal coatings on diamond and articles made therefrom
EP1627098A1 (en) 2003-05-09 2006-02-22 Basf Aktiengesellschaft Compositions for the currentless deposition of ternary materials for use in the semiconductor industry
JP5975996B2 (en) * 2010-09-03 2016-08-23 オーエムジー エレクトロニク ケミカルズ，エルエルシー Electroless nickel alloy plating bath and method for depositing the same
CN102011107B (en) * 2010-12-24 2012-07-11 杭州东方表面技术有限公司 Chemical nickel-phosphorus alloy plating solution capable of obtaining high-solderability plating layer

Also Published As

Publication number Publication date
US3674516A (en) 1972-07-04
FR2115164A1 (en) 1972-07-07
CA967705A (en) 1975-05-20
DE2148744A1 (en) 1972-06-08
FR2115164B1 (en) 1976-02-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee