GB1262060A - Method of electrolessly plating a substrate - Google Patents

Method of electrolessly plating a substrate

Info

Publication number
GB1262060A
GB1262060A GB3937271A GB3937271A GB1262060A GB 1262060 A GB1262060 A GB 1262060A GB 3937271 A GB3937271 A GB 3937271A GB 3937271 A GB3937271 A GB 3937271A GB 1262060 A GB1262060 A GB 1262060A
Authority
GB
United Kingdom
Prior art keywords
substrate
feb
nah
temperature
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3937271A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1262060A publication Critical patent/GB1262060A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1,262,060. Electroless deposition of Ni. RCA CORPORATION. Feb. 5, 1969 [Feb. 20, 1968], No. 39372/71. Divided out of 1, 260, 390. Heading C7F. Ni is electrolessly deposited from an alkaline aqueous solution of a Ni salt, sodium pynophosphate Na 4 P 2 O 7 À10H 2 O and sodium hypophosphite NaH 2 PO 2 ÀH 2 O having a molar concentration ratio Ni<SP>++</SP> /(H 2 PO 2 )<SP>-</SP> >0À26 and a temperature such that a constant rate of deposition is obtained independent of the Ni<SP>++</SP> concentration so long as the specified ratio is maintained. The bath temperature is about 25‹C. and the initial pH is 10À5. The specific plating bath contains 25g/l NaH 2 PO 2 À10H 2 O, 50g/l Na 4 P 2 O 7 À 10H 2 O, NH 4 OH to give a pH of 10À5 and variable amounts of NiSO 4 À6H 2 O as shown in the graph. A sensitized Al 2 O 3 substrate may be coated.
GB3937271A 1968-02-20 1969-02-05 Method of electrolessly plating a substrate Expired GB1262060A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70682268A 1968-02-20 1968-02-20

Publications (1)

Publication Number Publication Date
GB1262060A true GB1262060A (en) 1972-02-02

Family

ID=24839197

Family Applications (2)

Application Number Title Priority Date Filing Date
GB3937271A Expired GB1262060A (en) 1968-02-20 1969-02-05 Method of electrolessly plating a substrate
GB609869A Expired GB1260390A (en) 1968-02-20 1969-02-05 Method of electrolessly nickel plating a substrate

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB609869A Expired GB1260390A (en) 1968-02-20 1969-02-05 Method of electrolessly nickel plating a substrate

Country Status (5)

Country Link
JP (1) JPS5124453B1 (en)
DE (1) DE1908595A1 (en)
FR (1) FR2002249A1 (en)
GB (2) GB1262060A (en)
NL (1) NL6902593A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321061U (en) * 1976-07-30 1978-02-22
JPS589436U (en) * 1981-07-09 1983-01-21 ミサワホ−ム株式会社 Window handrail installation structure
CN103352213B (en) * 2013-06-18 2016-08-10 宝鸡多元合金科技有限公司 Environment-friendly type height anti-H 2 S and high abrasion Ni-P-W-Mo quaternary alloy plating solution and compound method thereof
CN112503494B (en) * 2020-10-30 2023-05-23 裕鑫丰(广东)照明科技有限公司 Radiating fin for LED radiator and preparation method thereof

Also Published As

Publication number Publication date
DE1908595A1 (en) 1970-04-23
GB1260390A (en) 1972-01-19
FR2002249A1 (en) 1969-10-17
NL6902593A (en) 1969-08-22
JPS5124453B1 (en) 1976-07-24

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