GB1134615A - Gold electroplating bath - Google Patents

Gold electroplating bath

Info

Publication number
GB1134615A
GB1134615A GB5358/67A GB535867A GB1134615A GB 1134615 A GB1134615 A GB 1134615A GB 5358/67 A GB5358/67 A GB 5358/67A GB 535867 A GB535867 A GB 535867A GB 1134615 A GB1134615 A GB 1134615A
Authority
GB
United Kingdom
Prior art keywords
metal
gold
added
amount
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5358/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technic Inc
Original Assignee
Technic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technic Inc filed Critical Technic Inc
Publication of GB1134615A publication Critical patent/GB1134615A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Abstract

1,134,615. Electro-plating with gold or gold alloy. TECHNIC Inc. Feb.3, 1967 [Feb.10, 1966], No. 5358/67. Heading C7B. Gold or gold alloy is electro-deposited from an aqueous alkaline bath comprising (i) between 1 and 30 g/l of gold in the form of potassium and/or sodium gold sulphite; (ii) between 40 and 150 g/l of sodium and/or potassium sulphite; (iii) between 5 and 150 g/l of a soluble phosphate, sulphate, carbonate, acetate citrate or tartrate of an alkali metal or alkaline earth metal as a buffering and conducting salt; (iv) at least one additive selected (a) as a metal brightener from Cd, Ni, Co, Sn, In, Cu, Mn or V in an amount between 5 and 500 mg/l added as a soluble salt of said metal or as a soluble complex of said metal; (b) as a semi-metal brightener from As, Sb, Se or Te in an amount between 1 and 400 mg/l added as a soluble salt or a soluble complex of said semi-metal (c) as an alloying element from Cd, Pb, Zn, Fe, Ni, Co, Sn, In, Co, Mn or Sb, the element being present in an amount between 0À5 and 5 g/l when added in the form of a salt and in an amount between 0À5 and 10 g/l when added in the form of a complex; and (v) sufficient of an acid or alkali to adjust the pH to a value above 8. The conducting salt (iii) may be a polyphosphate such as a tetra (ortho) phosphate or a hexametaphosphate, an ethylenediamine di-or tetra-acetate or a bicarbonate: while the additive elements (iv) may be used empolying the salts of acid radicals sulphate, nitrate, chloride, bromide, borate, fluoborate sulphamate, acetate, oxalate, formate or another weak organic acid, or as alkali metal, ammonium, quaternary ammonium or other organic base salts including the additive element in the anion e.g. titanates, molybdates tungstates, vanadates, arsenites, antimonites, selenates tellurates; or as chelates of nitrilo-, imino-, and amino-polycarboxylic acids, acetylacetone, or hydroxy carboxylic acids such as citric, lactic, or tartaric acids. The use of potassium antimonyl tartrate is specified. The baths may be used at temperatures up to 180‹ F. with a pH of 12 or above but preferably 9 to 11 with C.D. of 1 to 50 amps/sq.ft. and preferably moderate bath agitation.
GB5358/67A 1966-02-10 1967-02-03 Gold electroplating bath Expired GB1134615A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52638566A 1966-02-10 1966-02-10

Publications (1)

Publication Number Publication Date
GB1134615A true GB1134615A (en) 1968-11-27

Family

ID=24097129

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5358/67A Expired GB1134615A (en) 1966-02-10 1967-02-03 Gold electroplating bath

Country Status (4)

Country Link
US (1) US3475292A (en)
BE (1) BE741892A (en)
DE (1) DE1621180C3 (en)
GB (1) GB1134615A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2060106A1 (en) * 1969-08-19 1971-06-11 Sel Rex Corp Bath for electroplating gold
JPS4972140A (en) * 1972-11-13 1974-07-12
GB2142344A (en) * 1983-06-27 1985-01-16 American Chem & Refining Co Gold plating baths containing tartrate and carbonate salts
WO2009037180A1 (en) * 2007-09-21 2009-03-26 G. Aliprandini Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids
CN104233384A (en) * 2014-09-17 2014-12-24 朱忠良 Cyanide-free gold electroplating solution and electroplating process using same
US9567684B2 (en) 2009-10-15 2017-02-14 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
CN110699713A (en) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 Cyanide-free gold alloy electroforming solution and using method thereof
CN111647919A (en) * 2019-03-04 2020-09-11 弗劳恩霍夫应用研究促进协会 Aqueous preparation for producing gold and silver layers

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3910774A (en) * 1970-08-13 1975-10-07 Gen Dynamics Corp Solid film lubricant and method for lubricating cycling low-high temperature friction surfaces
ZA734253B (en) * 1972-07-10 1975-02-26 Degussa Electrolytic bath
US3981782A (en) * 1972-07-28 1976-09-21 Johnson Matthey & Co., Limited Electroplating of gold and gold compounds therefor
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
CH555894A (en) * 1972-08-10 1974-11-15 Oxy Metal Industries Corp USE OF ORGANOPHOSPHORUS DERIVATIVES IN SULPHIC BATHS FOR THE ELECTRODEPOSITION OF GOLD AND GOLD ALLOYS.
US3833487A (en) * 1972-12-22 1974-09-03 Bell Telephone Labor Inc Electrolytic soft gold plating
US3990954A (en) * 1973-12-17 1976-11-09 Oxy Metal Industries Corporation Sulfite gold plating bath and process
US4076598A (en) * 1976-11-17 1978-02-28 Amp Incorporated Method, electrolyte and additive for electroplating a cobalt brightened gold alloy
US4199416A (en) * 1977-05-03 1980-04-22 Johnson, Matthey & Co., Limited Composition for the electroplating of gold
US4366035A (en) * 1979-04-24 1982-12-28 Engelhard Corporation Electrodeposition of gold alloys
US4212708A (en) * 1979-06-05 1980-07-15 Belikin Alexandr V Gold-plating electrolyte
DE3013030C2 (en) * 1980-04-03 1984-02-09 Degussa Ag, 6000 Frankfurt Galvanic bath and process for the deposition of high-gloss white gold coatings
US4435253A (en) 1983-01-28 1984-03-06 Omi International Corporation Gold sulphite electroplating solutions and methods
DE3309397A1 (en) * 1983-03-16 1984-09-20 Degussa Ag, 6000 Frankfurt ELECTROLYTIC BATH FOR DEPOSITING LOW-CARAE, GLOSSY GOLD-SILVER ALLOY COATINGS
DE3341233A1 (en) * 1983-11-15 1985-05-30 Robert Bosch Gmbh, 7000 Stuttgart Acidic electroplating bath for depositing fine soft-gold patterns and process for depositing such patterns
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
EP0525890A1 (en) * 1991-07-31 1993-02-03 Calgon Corporation Method for solubilizing tellurium using organic acids
US5575900A (en) * 1995-07-03 1996-11-19 Antelman Technologies Ltd. Gold plating solutions
GB2323853B (en) * 1997-03-25 2002-04-24 Enthone Omi Electroplating processes compositions and deposits
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
JP4699105B2 (en) * 2005-06-24 2011-06-08 アサヒプリテック株式会社 Gold recovery method and apparatus
US8066865B2 (en) * 2008-05-19 2011-11-29 Solopower, Inc. Electroplating methods and chemistries for deposition of group IIIA-group via thin films
CH714243B1 (en) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Electroforming process and part or layer obtained by this method.
US8425753B2 (en) * 2008-05-19 2013-04-23 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
DE102008033174B3 (en) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanide-free electrolyte composition for the electrodeposition of a copper layer and method for the deposition of a copper-containing layer
ITMI20081610A1 (en) * 2008-09-09 2010-03-10 Giuseppe Antognazzi BATHROOM FOR ELECTRIC ELECTROPOSITION.
ITFI20130057A1 (en) * 2013-03-18 2014-09-19 Bluclad S R L SOLUTION FOR THE ELECTRODEPTITION OF A GOLDEN LEAGUE AND THE LEAGUE THEREOF DERIVING.
CN103755738B (en) * 2014-01-13 2016-06-01 孙松华 A kind of complexing agent and its production and use
KR20240033116A (en) * 2021-09-16 2024-03-12 피 앤 에스, 갈바솔스 High speed pure gold electroforming/electroplating bath
CN114934302A (en) * 2022-04-27 2022-08-23 深圳市联合蓝海黄金材料科技股份有限公司 Cyanide-free electrogilding liquid and application thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US923864A (en) * 1908-02-03 1909-06-08 Alfred Levy Process for the electric dissociation of metals by the wet method.
DE801312C (en) * 1949-05-05 1950-11-23 Pforzheimer Elektrizitäts - Gesellschaft m. b. H., Pforzheim Process for the electrolytic deposition of gold and gold alloys
NL197948A (en) * 1954-06-26
US3020217A (en) * 1956-10-19 1962-02-06 Sel Rex Precious Metals Inc Mirror bright gold alloy electroplating
BE570261A (en) * 1957-08-13
US3057789A (en) * 1959-02-26 1962-10-09 Paul T Smith Gold plating bath and process
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2060106A1 (en) * 1969-08-19 1971-06-11 Sel Rex Corp Bath for electroplating gold
JPS4972140A (en) * 1972-11-13 1974-07-12
JPS5324898B2 (en) * 1972-11-13 1978-07-24
GB2142344A (en) * 1983-06-27 1985-01-16 American Chem & Refining Co Gold plating baths containing tartrate and carbonate salts
US10233555B2 (en) 2007-09-21 2019-03-19 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
CN101815814B (en) * 2007-09-21 2012-05-16 G·阿利普兰迪尼 Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids
US9683303B2 (en) 2007-09-21 2017-06-20 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
WO2009037180A1 (en) * 2007-09-21 2009-03-26 G. Aliprandini Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids
US10619260B2 (en) 2007-09-21 2020-04-14 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US9567684B2 (en) 2009-10-15 2017-02-14 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
CN104233384A (en) * 2014-09-17 2014-12-24 朱忠良 Cyanide-free gold electroplating solution and electroplating process using same
CN111647919A (en) * 2019-03-04 2020-09-11 弗劳恩霍夫应用研究促进协会 Aqueous preparation for producing gold and silver layers
CN110699713A (en) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 Cyanide-free gold alloy electroforming solution and using method thereof

Also Published As

Publication number Publication date
DE1621180A1 (en) 1971-05-19
DE1621180C3 (en) 1978-08-24
DE1621180B2 (en) 1976-09-02
BE741892A (en) 1970-05-04
US3475292A (en) 1969-10-28

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