FR3091027B1 - Dispositif optoélectronique - Google Patents
Dispositif optoélectronique Download PDFInfo
- Publication number
- FR3091027B1 FR3091027B1 FR1873944A FR1873944A FR3091027B1 FR 3091027 B1 FR3091027 B1 FR 3091027B1 FR 1873944 A FR1873944 A FR 1873944A FR 1873944 A FR1873944 A FR 1873944A FR 3091027 B1 FR3091027 B1 FR 3091027B1
- Authority
- FR
- France
- Prior art keywords
- optoelectronic device
- stack
- light emitting
- emitting diodes
- transistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005693 optoelectronics Effects 0.000 title abstract 3
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Dispositif optoélectronique La présente description concerne un dispositif optoélectronique (100) comprenant un circuit intégré comprenant des diodes électroluminescentes (104), des transistors en couches minces (110), et un empilement (126) de couches isolantes électriquement, ledit empilement (126) étant situé entre les diodes électroluminescentes (104) et les transistors (110, 504), ledit empilement (126) comprenant en outre des éléments conducteurs (128, 132), entre et à travers lesdites couches isolantes, lesdits éléments conducteurs (128, 132) connectant au moins certains des transistors aux diodes électroluminescentes (104). Figure pour l'abrégé : Fig. 1
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1873944A FR3091027B1 (fr) | 2018-12-21 | 2018-12-21 | Dispositif optoélectronique |
TW108146378A TW202038427A (zh) | 2018-12-21 | 2019-12-18 | 光電裝置 |
CN201980090655.3A CN113383416A (zh) | 2018-12-21 | 2019-12-19 | 光电器件 |
US17/414,874 US11984549B2 (en) | 2018-12-21 | 2019-12-19 | Optoelectronic device |
EP19848783.7A EP3900038A1 (fr) | 2018-12-21 | 2019-12-19 | Dispositif optoelectronique |
KR1020217022446A KR20210104825A (ko) | 2018-12-21 | 2019-12-19 | 광전자 장치 |
PCT/FR2019/053176 WO2020128341A1 (fr) | 2018-12-21 | 2019-12-19 | Dispositif optoelectronique |
JP2021536250A JP2022515786A (ja) | 2018-12-21 | 2019-12-19 | 光電子デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1873944A FR3091027B1 (fr) | 2018-12-21 | 2018-12-21 | Dispositif optoélectronique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3091027A1 FR3091027A1 (fr) | 2020-06-26 |
FR3091027B1 true FR3091027B1 (fr) | 2022-11-18 |
Family
ID=66542439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1873944A Active FR3091027B1 (fr) | 2018-12-21 | 2018-12-21 | Dispositif optoélectronique |
Country Status (8)
Country | Link |
---|---|
US (1) | US11984549B2 (fr) |
EP (1) | EP3900038A1 (fr) |
JP (1) | JP2022515786A (fr) |
KR (1) | KR20210104825A (fr) |
CN (1) | CN113383416A (fr) |
FR (1) | FR3091027B1 (fr) |
TW (1) | TW202038427A (fr) |
WO (1) | WO2020128341A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3082025B1 (fr) * | 2018-06-04 | 2021-07-16 | Isorg | Dispositif combinant capteur d'images et un écran d'affichage organiques aptes a la détection d'empreintes digitales |
FR3112902B1 (fr) * | 2020-07-22 | 2022-12-16 | Aledia | Dispositif optoélectronique flexible et son procédé de fabrication |
FR3116381B1 (fr) | 2020-11-19 | 2022-12-16 | Commissariat Energie Atomique | Procédé de fabrication d'un dispositif à LED |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8816383B2 (en) * | 2012-07-06 | 2014-08-26 | Invensas Corporation | High performance light emitting diode with vias |
US8987765B2 (en) * | 2013-06-17 | 2015-03-24 | LuxVue Technology Corporation | Reflective bank structure and method for integrating a light emitting device |
FR3031238B1 (fr) * | 2014-12-30 | 2016-12-30 | Aledia | Dispositif optoelectronique a diodes electroluminescentes |
US9793252B2 (en) * | 2015-03-30 | 2017-10-17 | Emagin Corporation | Method of integrating inorganic light emitting diode with oxide thin film transistor for display applications |
US10741719B2 (en) * | 2016-03-12 | 2020-08-11 | Faquir Chand Jain | Quantum dot channel (QDC) quantum dot gate transistors, memories and other devices |
US10037981B2 (en) * | 2016-05-18 | 2018-07-31 | Globalfoundries Inc. | Integrated display system with multi-color light emitting diodes (LEDs) |
US10026883B2 (en) * | 2016-12-20 | 2018-07-17 | Globalfoundries Inc. | Wafer bond interconnect structures |
KR102571610B1 (ko) * | 2017-02-13 | 2023-08-30 | 삼성디스플레이 주식회사 | 반도체 장치 및 이의 제조방법 |
TWI626738B (zh) | 2017-04-06 | 2018-06-11 | 宏碁股份有限公司 | 顯示裝置及其製造方法 |
-
2018
- 2018-12-21 FR FR1873944A patent/FR3091027B1/fr active Active
-
2019
- 2019-12-18 TW TW108146378A patent/TW202038427A/zh unknown
- 2019-12-19 JP JP2021536250A patent/JP2022515786A/ja active Pending
- 2019-12-19 KR KR1020217022446A patent/KR20210104825A/ko not_active Application Discontinuation
- 2019-12-19 WO PCT/FR2019/053176 patent/WO2020128341A1/fr unknown
- 2019-12-19 US US17/414,874 patent/US11984549B2/en active Active
- 2019-12-19 EP EP19848783.7A patent/EP3900038A1/fr active Pending
- 2019-12-19 CN CN201980090655.3A patent/CN113383416A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20220059743A1 (en) | 2022-02-24 |
KR20210104825A (ko) | 2021-08-25 |
FR3091027A1 (fr) | 2020-06-26 |
TW202038427A (zh) | 2020-10-16 |
JP2022515786A (ja) | 2022-02-22 |
US11984549B2 (en) | 2024-05-14 |
EP3900038A1 (fr) | 2021-10-27 |
CN113383416A (zh) | 2021-09-10 |
WO2020128341A1 (fr) | 2020-06-25 |
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