FR3112902B1 - Dispositif optoélectronique flexible et son procédé de fabrication - Google Patents

Dispositif optoélectronique flexible et son procédé de fabrication Download PDF

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Publication number
FR3112902B1
FR3112902B1 FR2007682A FR2007682A FR3112902B1 FR 3112902 B1 FR3112902 B1 FR 3112902B1 FR 2007682 A FR2007682 A FR 2007682A FR 2007682 A FR2007682 A FR 2007682A FR 3112902 B1 FR3112902 B1 FR 3112902B1
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FR
France
Prior art keywords
optoelectronic device
face
making same
flexible
flexible optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2007682A
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English (en)
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FR3112902A1 (fr
Inventor
Ivan-Christophe Robin
Frédéric Mayer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aledia
Original Assignee
Aledia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aledia filed Critical Aledia
Priority to FR2007682A priority Critical patent/FR3112902B1/fr
Priority to PCT/EP2021/069931 priority patent/WO2022017972A1/fr
Priority to EP21745793.6A priority patent/EP4186096A1/fr
Priority to US18/016,853 priority patent/US20230299233A1/en
Priority to TW110126572A priority patent/TW202226526A/zh
Publication of FR3112902A1 publication Critical patent/FR3112902A1/fr
Application granted granted Critical
Publication of FR3112902B1 publication Critical patent/FR3112902B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004—Devices characterised by their operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/42—Transparent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

Dispositif optoélectronique flexible et son procédé de fabrication La présente description concerne un dispositif optoélectronique (10) comprenant un circuit optoélectronique (100) comprenant des diodes électroluminescentes (104), des transistors en couches minces (110), et un empilement (126) de couches isolantes électriquement, ledit empilement (126) étant situé entre les diodes électroluminescentes (104) et les transistors (110, 504), ledit empilement (126) comprenant en outre des éléments conducteurs (128, 132), entre et à travers lesdites couches isolantes, lesdits éléments conducteurs (128, 132) connectant au moins certains des transistors aux diodes électroluminescentes (104) Le dispositif comprend en outre un support (50) ayant une face, le support étant flexible et/ou la face étant courbe et non plane, le circuit optoélectronique étant connecté à la face du côté des transistors en couches minces. Figure pour l'abrégé : Fig. 1
FR2007682A 2020-07-22 2020-07-22 Dispositif optoélectronique flexible et son procédé de fabrication Active FR3112902B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR2007682A FR3112902B1 (fr) 2020-07-22 2020-07-22 Dispositif optoélectronique flexible et son procédé de fabrication
PCT/EP2021/069931 WO2022017972A1 (fr) 2020-07-22 2021-07-16 Dispositif optoelectronique flexible et son procede de fabrication
EP21745793.6A EP4186096A1 (fr) 2020-07-22 2021-07-16 Dispositif optoelectronique flexible et son procede de fabrication
US18/016,853 US20230299233A1 (en) 2020-07-22 2021-07-16 Flexible optoelectronic device and process for manufacturing same
TW110126572A TW202226526A (zh) 2020-07-22 2021-07-20 可撓性光電裝置及其製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2007682A FR3112902B1 (fr) 2020-07-22 2020-07-22 Dispositif optoélectronique flexible et son procédé de fabrication
FR2007682 2020-07-22

Publications (2)

Publication Number Publication Date
FR3112902A1 FR3112902A1 (fr) 2022-01-28
FR3112902B1 true FR3112902B1 (fr) 2022-12-16

Family

ID=73013624

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2007682A Active FR3112902B1 (fr) 2020-07-22 2020-07-22 Dispositif optoélectronique flexible et son procédé de fabrication

Country Status (5)

Country Link
US (1) US20230299233A1 (fr)
EP (1) EP4186096A1 (fr)
FR (1) FR3112902B1 (fr)
TW (1) TW202226526A (fr)
WO (1) WO2022017972A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3142831A1 (fr) * 2022-12-02 2024-06-07 Aledia Dispositif optoélectronique et son procédé de fabrication

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3091027B1 (fr) * 2018-12-21 2022-11-18 Aledia Dispositif optoélectronique

Also Published As

Publication number Publication date
FR3112902A1 (fr) 2022-01-28
EP4186096A1 (fr) 2023-05-31
US20230299233A1 (en) 2023-09-21
WO2022017972A1 (fr) 2022-01-27
TW202226526A (zh) 2022-07-01

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