FR2840503A3 - Circuit board has a rear surface large area earthing pad connected by through hole contacts - Google Patents
Circuit board has a rear surface large area earthing pad connected by through hole contacts Download PDFInfo
- Publication number
- FR2840503A3 FR2840503A3 FR0211315A FR0211315A FR2840503A3 FR 2840503 A3 FR2840503 A3 FR 2840503A3 FR 0211315 A FR0211315 A FR 0211315A FR 0211315 A FR0211315 A FR 0211315A FR 2840503 A3 FR2840503 A3 FR 2840503A3
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- large area
- mass
- ground line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Pens And Brushes (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
or, argent, alurninium et magnesium.gold, silver, alurninium and magnesium.
ll
PLAQUETTE A CIRCUIT IMPRIMEPRINTED CIRCUIT BOARD
L'invention concerne une carte de circuits imprimes qui est dotee sur une de ses faces, la face avant, de modules electriques et/ou electroniques, au moins une ligne de masse electrique etant prevue sur la face avant de la The invention relates to a printed circuit board which is provided on one of its faces, the front face, with electrical and / or electronic modules, at least one electrical ground line being provided on the front face of the
s carte de circuits imprimes.s printed circuit board.
Le but de ['invention est de proposer une carte de circuits imprimes ameliorees du point de vue thermique par rapport a la carte de circuits The object of the invention is to provide a printed circuit board improved from the thermal point of view compared to the circuit board.
imprimes deja connue.prints already known.
Ce but est atteint pour une carte de circuits imprimes de la technique o susmentionnee selon ['invention par le fait qu'il est prevu sur la face arriere de la carte de circuits imprimes au moins une ligne de masse supplementaire qui est reliee electriquement a l'au moins une ligne de masse de la face avant, et cette au moins une ligne de masse supplementaire est associee dans This object is achieved for a printed circuit board of the above-mentioned technique according to the invention by the fact that it is provided on the rear face of the printed circuit board at least one additional ground line which is electrically connected to the '' at least one ground line from the front panel, and this at least one additional ground line is associated in
l'espace a au moins un module sur la face avant. the space has at least one module on the front face.
s Un avantage important de la carte de circuits imprimes selon ['invention reside dans le fait que le degagement de chaleur dissipee est reduit lorsque ia carte de circuits imprimes est en fonctionnement parce qu'il est prevu sur la face arriere de la carte de circuits imprimes une ligne de masse supplementaire qui reduit la resistance electrique ou la resistance totale de la o ligne de masse sur la face avant. Un autre avantage important de la carte de circuits imprimes selon ['invention reside dans le fait que la chaleur dissipee inevitable est conduite par la ligne de masse supplementaire de fa,con tres simple sur la face arriere de la carte de circuits imprimes; car la ligne de masse supplementaire n'est pas seulement active electriquement mais s egalement thermiquement. En raison de cette activite thermique de la ligne de masse supplementaire, la carte de circuits imprimes selon ['invention peut fonctionner avec un courant plus eleve par rapport a une carte de circuits imprimes classiques et peut atteindre des puissances de fonctionnement plus elevees. Pour realiser un degagement particulierement efficace de la chaleur dissipee ou un rayonnement de la chaleur dissipee, il est avantageux selon un perfectionnement de la carte de circuits imprimes de ['invention que la ligne de masse supplementaire forme sur la face arriere de la carte de circuits imprimes au moins une pastille de masse de grande surface dont la surface s An important advantage of the printed circuit board according to the invention resides in the fact that the dissipation of dissipated heat is reduced when the printed circuit board is in operation because it is provided on the rear face of the circuit board. print an additional earth line which reduces the electrical resistance or the total resistance of the earth line o on the front panel. Another important advantage of the printed circuit board according to the invention resides in the fact that the inevitable dissipated heat is conducted by the additional earth line in a very simple manner on the rear face of the printed circuit board; because the additional ground line is not only electrically active but also thermally active. Due to this thermal activity of the additional ground line, the printed circuit board according to the invention can operate with a higher current compared to a conventional printed circuit board and can reach higher operating powers. To achieve a particularly effective release of the dissipated heat or a radiation of the dissipated heat, it is advantageous according to an improvement of the printed circuit board of the invention that the additional ground line forms on the rear face of the circuit board print at least one mass patch of large area whose surface
est aussi importante que la surface de base du module associe. is as important as the base surface of the associated module.
Dans le cas de modules qui ont un besoin en courant particulierement grand, il est en outre avantageux de monter sur la pastille de masse de grande surface, dans le cas de plusieurs pastilles de masse sur au moins l'un In the case of modules which have a particularly large current requirement, it is also advantageous to mount on the mass patch of large area, in the case of several mass patches on at least one
o des pastilles de masse de grande surface, au moins un dissipateur thermique. o large-area mass pellets, at least one heat sink.
Pour que la carte de circuits imprimes occupe particulierement moins de place, il est avantageux de former au moins un dissipateur thermique au moyen d'un cadre de montage metallique au moyen duquel la carte de circuits imprimes peut etre fixee dans ou sur un boAtier; car dans cette configuration s de ['invention, le cadre de montage de toute fa,con necessaire dans tous les cas pour fixer la carte de circuits imprimes est utilise comme dissipateur thermique. Le cadre de montage a egalement une double fonction, c'est-a-dire So that the printed circuit board occupies particularly less space, it is advantageous to form at least one heat sink by means of a metal mounting frame by means of which the printed circuit board can be fixed in or on a housing; because in this configuration s of the invention, the mounting frame anyway, con necessary in all cases to fix the printed circuit board is used as a heat sink. The mounting frame also has a dual function, i.e.
qu'il sert a fixer la carte de circuits imprimes et de dissipateur thermique. it is used to attach the printed circuit board and heat sink.
En vue d'expliquer ['invention: la figure 1 represente la face avant d'un exemple de realisation pour une carte de circuits imprimes selon ['invention, la figure 2 represente la face arriere de l'exemple de realisation selon la figure 1, la figure 3 represente la carte de circuits imprimes selon les figures 1 et 2 comportant un cadre de montage comportant des attaches filetees, la figure 4 represente la carte de circuits imprimes selon les figures 1 et 2 comportant un cadre de montage avec des support de soudure, la figure 5 represente la carte de circuits imprimes selon les figures 1 et 2 avec un cadre de montage enveloppant comportant des pastes de brasage In order to explain the invention: FIG. 1 represents the front face of an exemplary embodiment for a printed circuit board according to the invention, FIG. 2 represents the rear face of the exemplary embodiment according to FIG. 1 , Figure 3 shows the printed circuit board according to Figures 1 and 2 comprising a mounting frame having threaded fasteners, Figure 4 shows the printed circuit board according to Figures 1 and 2 comprising a mounting frame with support soldering, FIG. 5 represents the printed circuit board according to FIGS. 1 and 2 with an enveloping mounting frame comprising brazing steps
o verticales.o vertical.
Ia figure 6 represente la carte de circuits imprimes selon les figures 1 et 2 avec un cadre de montage enveloppant comportant des attaches filetees horizontales. La figure 1 represente la face avant 5 d'une carte de circuits imprimes s 10. Des modules electriques ou electroniques 15, 10 et 22 vent montes sur la face avant 5 de la carte de circuits imprimes 10. Parmi les modules 15, 10 et 22, un premier groups de modules, forme par les modules 20 et 22, a un besoin en courant plus grand qu'un deuxieme groupe de modules qui portent dans la figure 1 la reference 15. Sur la face avant 5 de la carte de circuits imprimes 10 se trouve en outre une ligne de masse 25 qui relic les modules electroniques 15, 20 et 22. La figure 2 represents la face arriere 30 de la carte de circuits imprimes selon la figure 1. On volt sur la face arriere 30 une pastille de masse de grande surface 40 qui serf de ligne de masse supplementaire. Cette pastille de masse de grande surface 40 est reliee electriquement au moyen de deux lo contacts traversant 41 a la ligne de masse 25 sur la face avant 5 de la carte FIG. 6 represents the printed circuit board according to FIGS. 1 and 2 with an enveloping mounting frame comprising horizontal threaded fasteners. FIG. 1 represents the front face 5 of a printed circuit board s 10. Electrical or electronic modules 15, 10 and 22 are mounted on the front face 5 of the printed circuit board 10. Among the modules 15, 10 and 22, a first group of modules, formed by modules 20 and 22, has a greater current requirement than a second group of modules which bear in reference 1 the figure 15. On the front face 5 of the circuit board there is also a ground line 25 which connects the electronic modules 15, 20 and 22. FIG. 2 represents the rear face 30 of the printed circuit board according to FIG. 1. A patch is seen on the rear face 30 mass of large area 40 which serves as an additional mass line. This large area ground pad 40 is electrically connected by means of two lo contacts 41 passing through the ground line 25 on the front face 5 of the card.
de circuits imprimes 10.of printed circuits 10.
Comme il ressort en outre de la figure 2, il est prevu cinq autres contacts traversants qui vent caracterises par la reference 42. Ces cinq autres contacts traversants 42 permettent de realiser une liaison electric us i5 directement entre les connecteurs de masse du module 22, non represented en detail dens les figures 1 et 2 pour des raisons de clarte, et la pastille de masse de grande surface 40 et garantit done une liaison faiblement ohmique As further emerges from FIG. 2, five other through contacts are provided which are characterized by the reference 42. These five other through contacts 42 allow an electric us i5 connection to be made directly between the ground connectors of the module 22, not represented in detail in FIGS. 1 and 2 for reasons of clarity, and the mass patch of large area 40 and therefore guarantees a weakly ohmic connection.
du module 22 a la masse.from module 22 to ground.
Les contacts traversants 41 et 42 doivent alors etre dimensionnes de falcon a garantir un flux de courant ou un flux thermique suffisant de la ligne The through contacts 41 and 42 must then be dimensioned falcon to guarantee a current flow or a sufficient thermal flow from the line
de masse 25 a la pastille de masse 40. from mass 25 to the pellet of mass 40.
La pastille de masse 40 se trouve ens l'espace considere en face du module 22; en d'autres termes: la pastille de masse 40 se trouve a la meme place que le module, mais la face arriere de la carte de circuits imprimes et non sur la face avant. Pour traduire cola dens les figures 1 et 2, la figure 1 est une representation en << vue de dessus >> de la face arriere de la carte de circuits imprimes 10, done considere depuis la face avant de la carte de circuits imprimes; la ligne de masse 25 qui se trouve sur la face avant de la carte de circuits imprimes est par consequent represente en pointilles dens la so figure 2. La representation en pointilles de la ligne de masse 25 bans la figure The mass patch 40 is located in the space considered opposite the module 22; in other words: the ground pad 40 is in the same place as the module, but the rear face of the printed circuit board and not on the front face. To translate cola dens Figures 1 and 2, Figure 1 is a representation in "top view" of the rear face of the printed circuit board 10, therefore seen from the front of the printed circuit board; the ground line 25 which is on the front face of the printed circuit board is therefore represented in dotted lines in the nb figure 2. The dotted representation of the ground line 25 in the figure
2 sert alors a presenter clairement la position de la pastille de masse 40. 2 then serves to clearly present the position of the ground pad 40.
La pastille de masse 40 est a peu pres ou au moins aussi grande que The mass pellet 40 is about or at least as large as
la surface de base du module associe 22. the base surface of the module combines 22.
Le role de la pastille de masse de grande surface 40 est de conduits ou de rayonner la chaleur dissipee generee par le module electronique. En outre, la pastille de masse de grande surface serf de ligne de masse supplementaire qui est agencee du point de vue electrique parallelement a la ligne de masse de la face avant de la carte de circuits imprimes 10. Cet agencement electrique en parallels permet de reduire la resistance electrique totale de la The role of the mass patch of large area 40 is conduits or radiate the dissipated heat generated by the electronic module. In addition, the mass patch of large area serves as an additional mass line which is arranged from the electrical point of view parallel to the ground line of the front face of the printed circuit board 10. This electrical arrangement in parallel makes it possible to reduce the total electrical resistance of the
ligne de masse 25.ground line 25.
Les figures 3 et 4 representent les cadres de montage 50 et 60 qui vent montes dans la zone de la pastille de masse de grande surface 40 sur la carte de circuits imprimes 10. Les cadres de montage 50 ou 60 servent d'une part a fixer la carte de circuits imprimes dans ou sur un bottler non represents dans les figures 3 et 4 et d'autre part en meme temps a conduire la chaleur To dissipee qui est generee par le module electronique 22 et qui est conduits par Figures 3 and 4 show the mounting frames 50 and 60 which are mounted in the area of the mass patch of large area 40 on the printed circuit board 10. The mounting frames 50 or 60 serve firstly to fix the circuit board printed in or on a bottler not shown in Figures 3 and 4 and on the other hand at the same time to conduct the dissipated heat To which is generated by the electronic module 22 and which is conducted by
la pastille de masse de grande surface 40 vers le cadre de montage 50 ou 60. the mass patch of large area 40 towards the mounting frame 50 or 60.
Le cadre de montage 50 ou 60 servent done de dissipateur thermique. The mounting frame 50 or 60 therefore serves as a heat sink.
Les figures 5 et 6 representent des cadres de montage enveloppant 70 et 80 qui enveloppent la carte de circuits imprimes 10, c'est-a-dire qui vent en liaison aussi bien avec la face avant 5 qu'avec la face arriere 30 de la carte de circuits imprimbs 10. Ainsi, on est toujours stir que les cadres de montage 70 et 80 vent agences dans la zone de la face arriere 30 de la carte de circuits imprimes 10 dans laquelle se trouve la pastille de masse de grande surface ; car on est sur de cette fagon que la chaleur dissipee conduits par la JO pastille de masse de grande surface 40 du module electronique 22 au cadre de montage enveloppant et est done propagee par exemple vers un bottler FIGS. 5 and 6 represent mounting frames enveloping 70 and 80 which surround the printed circuit board 10, that is to say which wind in connection both with the front face 5 and with the rear face 30 of the printed circuit board 10. Thus, it is always ensured that the mounting frames 70 and 80 are arranged in the area of the rear face 30 of the printed circuit board 10 in which the mass patch of large area is located; because we are sure in this way that the dissipated heat conduits by the JO mass pellet of large surface 40 of the electronic module 22 to the enveloping mounting frame and is therefore propagated for example towards a bottler
non represents dans les figures.not shown in the figures.
Naturellement, les modes de realization des cadres de montage 50, 60, et 80 ne representent que des examples de realization de cadres de montage; I'homme du metier adapters la configuration des cadres de montage aux besoins correspondents. II faut tenir compte dans cette adaptation seulement du fait que le cadre de montage est en liaison thermique avec l'au moins une pastille de masse de grande surface, dans Naturally, the embodiments of the mounting frames 50, 60, and 80 represent only examples of making mounting frames; Those skilled in the art adapt the configuration of the mounting frames to the corresponding needs. It is necessary to take into account in this adaptation only of the fact that the mounting frame is in thermal connection with the at least one pellet of mass of large surface, in
l'exemple de realization decrit ci-dessus c'est la pastille de masse 40. the embodiment example described above is the mass patch 40.
s Revend ications 1. Carte de circuits imprimes (10) qui est dotee sur une de ses faces, la face avant (5), de modules electriques et/ou electroniques (15, 20, 22), au moins une ligne de masse electrique (25) etant prevue sur la face avant (5) de s la carte de circuits imprimes (10) , caracterisee en ce que: - sur la face arriere (30) de la carte de circuits imprimes (10) il est prevu au moins une ligne de masse supplementaire (40) qui est reliee electriquement a l'au moins une ligne de masse (25) de la face avant, et o - cette au moins une ligne de masse supplementaire (40) est associee s Claims ications 1. Printed circuit board (10) which is provided on one of its faces, the front face (5), with electrical and / or electronic modules (15, 20, 22), at least one electrical ground line (25) being provided on the front face (5) of the printed circuit board (10), characterized in that: - on the rear face (30) of the printed circuit board (10) it is provided at least an additional ground line (40) which is electrically connected to at least one ground line (25) on the front face, and where this at least one additional ground line (40) is associated
dans l'espace a au moins un module (22) sur la face avant. in space has at least one module (22) on the front face.
2. Carte de circuits imprimes selon la revendication 1, caracterisee en ce que la ligne de masse supplementaire (10) forme sur la face arriere (30) de la carte de circuits imprimes (10) au moins une pastille de masse de grande s surface (40) dont la surface est aussi grande que la surface de base du 2. A printed circuit board according to claim 1, characterized in that the additional ground line (10) forms on the rear face (30) of the printed circuit board (10) at least one mass patch of large surface area. (40) whose surface is as large as the base surface of the
module associe (22).associated module (22).
3. Carte de circuits imprimes selon la revendication 2, caracterisee en ce que au moins un dissipateur thermique (50, 60, 70, 80) est monte sur la pastille de masse de grande surface (40), dans le cas de plusieurs pastilles de 3. A printed circuit board according to claim 2, characterized in that at least one heat sink (50, 60, 70, 80) is mounted on the mass patch of large area (40), in the case of several pellets of
o masse sur au moins l'un des pastilles de masse de grande surface. o mass on at least one of the mass patches of large area.
4. Carte de circuits imprimes selon la revendication 3, caracterisee en ce que au moins un dissipateur thermique est forme au moyen d'un cadre de montage metallique (50, 60, 70, 80) au moyen duquel la carte de circuits 4. A printed circuit board according to claim 3, characterized in that at least one heat sink is formed by means of a metal mounting frame (50, 60, 70, 80) by means of which the circuit board
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20208478U DE20208478U1 (en) | 2002-05-29 | 2002-05-29 | Printed circuit board with mass pad on the back |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2840503A3 true FR2840503A3 (en) | 2003-12-05 |
| FR2840503B3 FR2840503B3 (en) | 2004-04-30 |
Family
ID=7971699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0211315A Expired - Fee Related FR2840503B3 (en) | 2002-05-29 | 2002-09-12 | PRINTED CIRCUIT BOARD |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN2572720Y (en) |
| DE (1) | DE20208478U1 (en) |
| ES (1) | ES1053051Y (en) |
| FR (1) | FR2840503B3 (en) |
| IT (1) | ITMI20030013U1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20314526U1 (en) * | 2003-09-12 | 2003-11-20 | Siemens Ag | PCB for a radio module |
| CN102509957B (en) * | 2011-10-18 | 2014-02-19 | 华为终端有限公司 | Universal serial bus (USB) male plug |
-
2002
- 2002-05-29 DE DE20208478U patent/DE20208478U1/en not_active Expired - Lifetime
- 2002-08-21 CN CN02247544U patent/CN2572720Y/en not_active Expired - Fee Related
- 2002-09-12 FR FR0211315A patent/FR2840503B3/en not_active Expired - Fee Related
- 2002-10-25 ES ES200202577U patent/ES1053051Y/en not_active Expired - Fee Related
-
2003
- 2003-01-16 IT ITMI20030013 patent/ITMI20030013U1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN2572720Y (en) | 2003-09-10 |
| ES1053051U (en) | 2003-03-01 |
| FR2840503B3 (en) | 2004-04-30 |
| ES1053051Y (en) | 2003-06-16 |
| DE20208478U1 (en) | 2002-08-29 |
| ITMI20030013U1 (en) | 2003-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20070531 |