DE20314526U1 - PCB for a radio module - Google Patents

PCB for a radio module

Info

Publication number
DE20314526U1
DE20314526U1 DE20314526U DE20314526U DE20314526U1 DE 20314526 U1 DE20314526 U1 DE 20314526U1 DE 20314526 U DE20314526 U DE 20314526U DE 20314526 U DE20314526 U DE 20314526U DE 20314526 U1 DE20314526 U1 DE 20314526U1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
area
recess
base area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20314526U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE20314526U priority Critical patent/DE20314526U1/en
Publication of DE20314526U1 publication Critical patent/DE20314526U1/en
Priority to PCT/DE2004/001910 priority patent/WO2005027596A2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (6)

1. Leiterplatte (10) für ein Funkmodul mit einer vierecki­ gen, insbesondere quadratischen Grundfläche, die mindes­ tens die folgenden Elemente aufweist:
  • - eine erste (40) und eine zweite Ausnehmung (50) zur me­ chanischen Befestigung der Leiterplatte (10) an einer Leiterplattenhaltevorrichtung,
  • - eine Steckeinrichtung (20) zur elektrischen Kontaktie­ rung einer Antenne,
  • - eine elektrische Steckvorrichtung (30), wobei
die erste Ausnehmung (40) in einem ersten Eckbereich der Grundfläche und die Steckeinrichtung (20) in einem zwei­ ten Eckbereich der Grundfläche angeordnet sind, wobei sich der erste und der zweite Eckbereich auf einer Diago­ nalen gegenüberliegen und
die zweite Ausnehmung (50) an einem ersten Rand der Grundfläche und die elektrische Steckvorrichtung (30) an einem zweiten Rand der Grundfläche angeordnet sind, wobei der erste und der zweite Rand und die Diagonale ein Drei­ eck bilden.1. Printed circuit board ( 10 ) for a radio module with a quadrangular, in particular square, base area which has at least the following elements:
  • a first ( 40 ) and a second recess ( 50 ) for mechanically fastening the circuit board ( 10 ) to a circuit board holding device,
  • - A plug device ( 20 ) for electrical contacting an antenna tion,
  • - An electrical connector ( 30 ), wherein
the first recess ( 40 ) are arranged in a first corner area of the base area and the plug-in device ( 20 ) are arranged in a second corner area of the base area, the first and second corner areas lying opposite one another on a diagonal and
the second recess ( 50 ) is arranged on a first edge of the base area and the electrical plug device ( 30 ) is arranged on a second edge of the base area, the first and the second edge and the diagonal forming a triangle. 2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, dass die zweite Ausnehmung kreissegmentförmig ist.2. Printed circuit board according to claim 1, characterized, that the second recess is a segment of a circle. 3. Leiterplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die zweite Ausnehmung benachbart zu dem zweiten Eck­ bereich angeordnet ist.3. Printed circuit board according to one of the preceding claims, characterized, that the second recess is adjacent to the second corner area is arranged. 4. Leiterplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die elektrische Steckverbindung benachbart zu dem ersten Eckbereich angeordnet ist.4. Printed circuit board according to one of the preceding claims, characterized,  that the electrical connector is adjacent to the first corner area is arranged. 5. Leiterplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Grundfläche der Leiterplatte derartig mit Bau­ elementen bestückt ist, dass die Bauelemente leiterplat­ tenabseitig eine plane Fläche, insbesondere eine zur Grundfläche parallele Fläche bilden.5. Printed circuit board according to one of the preceding claims, characterized, that the footprint of the circuit board is such with construction elements is that the components are printed circuit board a flat surface, especially one for Base area form parallel area. 6. Leiterplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leiteplatte Teil eines Mobilfunkmoduls mit einer Mobilfunkeinrichtung ist oder ein solches Mobilfunkmodul bildet.6. Printed circuit board according to one of the preceding claims, characterized, that the circuit board is part of a mobile radio module with a Cellular device is or such a cellphone module forms.
DE20314526U 2003-09-12 2003-09-12 PCB for a radio module Expired - Lifetime DE20314526U1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE20314526U DE20314526U1 (en) 2003-09-12 2003-09-12 PCB for a radio module
PCT/DE2004/001910 WO2005027596A2 (en) 2003-09-12 2004-08-24 Printed circuit board for a radio module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20314526U DE20314526U1 (en) 2003-09-12 2003-09-12 PCB for a radio module

Publications (1)

Publication Number Publication Date
DE20314526U1 true DE20314526U1 (en) 2003-11-20

Family

ID=29594906

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20314526U Expired - Lifetime DE20314526U1 (en) 2003-09-12 2003-09-12 PCB for a radio module

Country Status (2)

Country Link
DE (1) DE20314526U1 (en)
WO (1) WO2005027596A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109397370A (en) * 2017-08-15 2019-03-01 惠州中京电子科技有限公司 Splice screen board cutting method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217214B4 (en) * 2002-04-18 2004-03-11 Hella Kg Hueck & Co. Cooling arrangement for a circuit arrangement
DE20208476U1 (en) * 2002-05-29 2002-08-29 Siemens Ag Printed circuit board with recesses on the edge
DE20208478U1 (en) * 2002-05-29 2002-08-29 Siemens Ag Printed circuit board with mass pad on the back
DE20208479U1 (en) * 2002-05-29 2002-08-29 Siemens Ag Printed circuit board with shielding device
DE20220681U1 (en) * 2002-10-31 2004-01-08 Hella Kg Hueck & Co. Mirror-symmetrical electronic module for required mirror-symmetrical applications with circuit board and electronic circuit with electronic components and conductive tracks
DE20217220U1 (en) * 2002-11-06 2003-02-27 Siemens Ag Printed circuit board with optimized electromagnetic, electrical and mechanical contacting
DE20217338U1 (en) * 2002-11-06 2003-02-06 Siemens Ag Printed circuit board with a contact surface for an antenna connection

Also Published As

Publication number Publication date
WO2005027596A2 (en) 2005-03-24
WO2005027596A3 (en) 2005-07-21

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20031224

R156 Lapse of ip right after 3 years

Effective date: 20070403