CN2572720Y - Printed circuit board with backside grounding piece - Google Patents

Printed circuit board with backside grounding piece Download PDF

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Publication number
CN2572720Y
CN2572720Y CN02247544U CN02247544U CN2572720Y CN 2572720 Y CN2572720 Y CN 2572720Y CN 02247544 U CN02247544 U CN 02247544U CN 02247544 U CN02247544 U CN 02247544U CN 2572720 Y CN2572720 Y CN 2572720Y
Authority
CN
China
Prior art keywords
circuit board
printed circuit
pcb
earth lead
ground strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02247544U
Other languages
Chinese (zh)
Inventor
玛丽安·巴兰
安妮特·贝尔克
伯恩德·凯泽
罗伯特·卡利基
乔尔格·罗曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CN2572720Y publication Critical patent/CN2572720Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Pens And Brushes (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to a printed circuit board (10), the front surface (5) of which is matched with electrical and / or electronic structure elements (15, 20, 22), wherein, the front surface (5) of the printed circuit board (10) is provided with at least one electric ground connecting conductive wire (25), wherein, the back surface (30) of the printed circuit board (10) is provided with at least one additional ground connecting conductive wire (40) which is electrically connected with at least one ground connecting conductive wire (25) of the front surface. At least the additional ground connecting conductive wire (4) is matched with at least one structure element (22) of the front surface in space.

Description

Printed circuit board (PCB) with reverse side ground strip
Technical field
The utility model relates to a kind of printed circuit board (PCB).
Background technology
In many printed circuit board (PCB)s of on market, selling, commonly be equipped with electric and/or electronic structure element, and have a lead electrical ground at least in the front of printed circuit board (PCB) in its front.
The utility model content
Technical problem to be solved in the utility model is to propose a kind of with known printed circuit board (PCB) and compare improved printed circuit board (PCB) aspect thermal characteristics.
According to the utility model, above-mentioned technical problem solves like this, promptly the reverse side at printed circuit board (PCB) is provided with at least one additional earth lead, this earth lead is electrically connected with positive at least one earth lead, and spatially attach troops to a unit at least one structural detail on the front of this additional earth lead at least.
A major advantage according to printed circuit board (PCB) of the present utility model is, reduce the waste heat that the printed circuit board (PCB) duration of work forms, because have additional earth lead at the printed circuit board (PCB) reverse side, the resistance that this earth lead has reduced the front earth lead is all-in resistance in other words.Another major advantage according to printed circuit board (PCB) of the present utility model is, because conductive effective is not only by additional earth lead and heat conduction is also effective, therefore the waste heat that produces just can be transmitted to the reverse side of printed circuit board (PCB) inevitably at an easy rate by additional earth lead.Owing to should add this thermal conduction characteristic of earth lead, printed circuit board (PCB) of the present utility model is so just compared with common printed circuit board (PCB) can and realize bigger driving power with bigger current work.
In order to realize especially effectively heat conduction or thermal radiation, according to one of printed circuit board (PCB) of the present utility model favourable expansion structure, additional earth lead forms at least one large tracts of land ground strip at the printed circuit board (PCB) reverse side, and its area base area with the structural detail of attaching troops to a unit at least is the same big.
This external structural detail needs have advantage ground regulation under the situation of king-sized electric current, on the large tracts of land ground strip or a radiator is being set at least one large tracts of land ground strip under a plurality of ground strip situations at least.
Have advantage ground regulation in order to make printed circuit board (PCB) occupy especially little space, at least one radiator constitutes by the metal assembling frame, by this assembling frame printed circuit board (PCB) can be fixed on the housing the inside or above; Therefore for this improvement of the present utility model under normal conditions always the essential assembling frame that is used for fixing printed circuit board (PCB) simultaneously also as radiator.Be that assembling frame has double action, so it not only is used for fixing printed circuit board (PCB) but also as radiator.
Description of drawings
By the accompanying drawing illustrated embodiment the utility model is described below, in the accompanying drawing:
Fig. 1 is the front elevation of an execution mode of the utility model printed circuit board (PCB);
Fig. 2 is the reverse side figure of execution mode shown in Figure 1;
Fig. 3 has the three-dimensional diagrammatic sketch of the assembling frame of a strap bolt brace for printed circuit board (PCB) shown in Fig. 1 and 2;
Fig. 4 has the three-dimensional diagrammatic sketch of the assembling frame of a band soldering support for printed circuit board (PCB) shown in Fig. 1 and 2;
Fig. 5 has a three-dimensional diagrammatic sketch that encloses the card assembling frame with vertical soldering support for printed circuit board (PCB) shown in Fig. 1 and 2;
Fig. 6 has the three-dimensional diagrammatic sketch that encloses the card assembling frame that a tape made a horizontal spiral ties contact pin for printed circuit board (PCB) shown in Fig. 1 and 2.
Embodiment
Fig. 1 illustrates the front 5 of printed circuit board (PCB) 10.On the front 5 of printed circuit board (PCB) 10, be mounted with electric or electronic structure element 15,20 and 22.The first structural detail group that is made of structural detail 20 and 22 in structural detail 15,20 and 22 is than have bigger electric current demand by the second structural detail group of being represented by label symbol 15 in Fig. 1.Have earth lead 25 on the front 5 of this external printed circuit board (PCB) 10, this earth lead couples together electronic structure element 15,20 and 22.
Fig. 2 illustrates the reverse side 30 of the printed circuit board (PCB) 10 among Fig. 1.Can see large-area ground strip 40 on reverse side 30, this ground strip plays the effect of additional earth lead.This large tracts of land ground strip 40 is worn contact 41 thoroughly by two and is electrically connected with earth lead 25 on printed circuit board (PCB) 10 fronts 5.
In addition as shown in Figure 2, also have 5 and wear the contact thoroughly, these are worn the contact thoroughly and represent with label symbol 42.By this other 5 wear contact 42 thoroughly and directly also guarantee that thus the Low ESR ground connection of structural detail 22 is connected in the effect of playing electrical connection between the ground connection places (in Fig. 1 and 2, not have more detailed demonstrating) of structural detail 22 and the large tracts of land ground strip 40 for clear simple and direct reason.
Must so design at this and to wear contact 41 and 42, can flow through enough big electric current and heat to guarantee from earth lead 25 to ground strip 40.
Ground strip 40 is positioned at the reverse side of structural detail 22 from the space; In other words: ground strip 40 is positioned at identical position with structural detail, only is positioned at the reverse side rather than the front of printed circuit board (PCB).In order to make this point clearly expression in Fig. 1 and 2, in Fig. 2, represent the reverse side of printed circuit board (PCB) 10 with " transparent " form, promptly can see the front of printed circuit board (PCB); Therefore the earth lead 25 that is arranged in the printed circuit board (PCB) front only dots at Fig. 2.The dashed graph of earth lead 25 also is in order clearly to represent the position of ground strip 40 among Fig. 2 in addition.
Approximately or at least the base area with the structural detail 22 of attaching troops to a unit is the same big for ground strip 40.
The effect of large tracts of land ground strip 40 is, is used to conduct or heat that radiation is produced by structural detail 22.The large tracts of land ground strip plays the effect of additional earth lead in addition, and additional earth lead is in parallel with the earth lead 25 on printed circuit board (PCB) 10 fronts 5 on the circuit.By this parallel circuits structure the all-in resistance of earth lead 25 is reduced.
Fig. 3 and 4 expression assembling frames 50 and 60, this assembling frame is arranged on large tracts of land ground strip 40 places on the printed circuit board (PCB) 10.Assembling frame 50 or 60 be used on the one hand with printed circuit board (PCB) be fixed on the housing the inside of not expressing in Fig. 3 and 4 or above, be used for conducting heat on the other hand simultaneously, these heats are produced by electric structural detail 22 and give assembling frame 50 or 60 by 40 conduction of large tracts of land ground strip.Therefore assembling frame 50 and 60 plays the effect of heat conduction cooling.
The assembling frame 70 and 80 of card is enclosed in Fig. 5 and 6 expressions, and this assembling frame encloses card printing circuit board 10, promptly not only is connected with the front 5 of printed circuit board (PCB) 10 but also is connected with reverse side 30.Always guarantee that at this not only assembling frame 70 and 80 is arranged in that zone of printed circuit board (PCB) 10 reverse side 30, and large tracts of land ground strip 40 is positioned at also in wherein the scope; So can guarantee thus, also continue to conduct to give the housing of illustration, not expressing for the assembling frame that encloses card thus again by the heat continuation conduction that large tracts of land ground strip 40 is derived from electric structural detail 22.
Self-evident, assembling frame 50,60,70 and 80 form of implementation is only represented the embodiment of assembling frame; The professional will make the structure design of assembling frame adapt to concrete demand.Only note that for this suitability assembling frame is in hot link with a large tracts of land ground strip (this large tracts of land ground strip is exactly a ground strip 40 in the above-described embodiments) at least.

Claims (4)

1. a printed circuit board (PCB) (10), on its front (5), be furnished with electric and/or electronic structure element (15,20,22), wherein, at least one lead (25) is electrical ground arranged on the front (5) of printed circuit board (PCB) (10), it is characterized in that, at least one additional earth lead (40) is arranged on the reverse side (30) of described printed circuit board (PCB) (10), this earth lead is electrically connected with positive at least one earth lead (25), and spatially attach troops to a unit at least one structural detail (22) on the front of this additional earth lead (40) at least.
2. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described additional earth lead (40) is gone up at the reverse side (30) of printed circuit board (PCB) (10) and is formed at least one large tracts of land ground strip (40), and its area base area with the structural detail of attaching troops to a unit (22) at least is the same big.
3. printed circuit board (PCB) as claimed in claim 2 is characterized in that, on described large tracts of land ground strip (40) or under a plurality of ground strip situations, at least one radiator (50,60,70,80) is set at least one large tracts of land ground strip.
4. printed circuit board (PCB) as claimed in claim 3 is characterized in that, at least one radiator is made of a metal assembling frame (50,60,70,80), by this assembling frame printed circuit board (PCB) (10) can be fixed on the housing the inside or above.
CN02247544U 2002-05-29 2002-08-21 Printed circuit board with backside grounding piece Expired - Fee Related CN2572720Y (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20208478U DE20208478U1 (en) 2002-05-29 2002-05-29 Printed circuit board with mass pad on the back
DE20208478.7 2002-05-29

Publications (1)

Publication Number Publication Date
CN2572720Y true CN2572720Y (en) 2003-09-10

Family

ID=7971699

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02247544U Expired - Fee Related CN2572720Y (en) 2002-05-29 2002-08-21 Printed circuit board with backside grounding piece

Country Status (5)

Country Link
CN (1) CN2572720Y (en)
DE (1) DE20208478U1 (en)
ES (1) ES1053051Y (en)
FR (1) FR2840503B3 (en)
IT (1) ITMI20030013U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102509957A (en) * 2011-10-18 2012-06-20 华为终端有限公司 Universal serial bus (USB) male plug

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20314526U1 (en) * 2003-09-12 2003-11-20 Siemens Ag PCB for a radio module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102509957A (en) * 2011-10-18 2012-06-20 华为终端有限公司 Universal serial bus (USB) male plug

Also Published As

Publication number Publication date
ES1053051U (en) 2003-03-01
FR2840503B3 (en) 2004-04-30
ES1053051Y (en) 2003-06-16
DE20208478U1 (en) 2002-08-29
FR2840503A3 (en) 2003-12-05
ITMI20030013U1 (en) 2003-11-30

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee