DE20208478U1 - Printed circuit board with mass pad on the back - Google Patents

Printed circuit board with mass pad on the back

Info

Publication number
DE20208478U1
DE20208478U1 DE20208478U DE20208478U DE20208478U1 DE 20208478 U1 DE20208478 U1 DE 20208478U1 DE 20208478 U DE20208478 U DE 20208478U DE 20208478 U DE20208478 U DE 20208478U DE 20208478 U1 DE20208478 U1 DE 20208478U1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
ground line
area
mass pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20208478U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE20208478U priority Critical patent/DE20208478U1/en
Priority to CN02247544U priority patent/CN2572720Y/en
Publication of DE20208478U1 publication Critical patent/DE20208478U1/en
Priority to FR0211315A priority patent/FR2840503B3/en
Priority to ES200202577U priority patent/ES1053051Y/en
Priority to ITMI20030013 priority patent/ITMI20030013U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Pens And Brushes (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (4)

1. Leiterplatte (10), die auf einer ihrer beiden Seiten - der Vorderseite (5) - mit elektrischen und/oder elektronischen Bauelementen (15, 20, 22) bestückt ist, wobei auf der Vorderseite (5) der Leiterplatte (10) zumindest eine elektrische Masseleitung (25) vorhanden ist, dadurch gekennzeichnet, dass
  • - auf der Rückseite (30) der Leiterplatte (10) mindestens eine zusätzliche Masseleitung (40) vorhanden ist, die elektrisch mit der mindestens einen Masseleitung (25) der Vorderseite verbunden ist und
  • - diese mindestens eine zusätzliche Masseleitung (40) mindestens einem Bauelement (22) auf der Vorderseite räumlich zugeordnet ist.
1. Printed circuit board ( 10 ), which is equipped on one of its two sides - the front side ( 5 ) - with electrical and / or electronic components ( 15 , 20 , 22 ), at least on the front side ( 5 ) of the printed circuit board ( 10 ) there is an electrical ground line ( 25 ), characterized in that
  • - On the back ( 30 ) of the circuit board ( 10 ) there is at least one additional ground line ( 40 ) which is electrically connected to the at least one ground line ( 25 ) on the front and
  • - This at least one additional ground line ( 40 ) is spatially assigned to at least one component ( 22 ) on the front.
2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, dass die zusätzliche Masseleitung (40) auf der Rückseite (30) der Leiterplatte (10) mindestens ein großflächiges Massepad (40) bildet, dessen Fläche mindestens so groß wie die Grundfläche des zugeordneten Bauelements (22) ist.2. Printed circuit board according to claim 1, characterized in that the additional ground line ( 40 ) on the back ( 30 ) of the printed circuit board ( 10 ) forms at least one large-area mass pad ( 40 ), the area of which is at least as large as the base area of the assigned component ( 22 ) is. 3. Leiterplatte nach Anspruch 2, dadurch gekennzeichnet, dass auf dem großflächigen Massepad (40) oder - im Falle mehrerer Massepads - auf zumindest einem der großflächigen Massepads zumindest ein Kühlkörper (50, 60, 70, 80) angebracht ist. 3. Printed circuit board according to claim 2, characterized in that on the large-area mass pad ( 40 ) or - in the case of several ground pads - at least one heat sink ( 50 , 60 , 70 , 80 ) is attached to at least one of the large-area ground pads. 4. Leiterplatte nach Anspruch 3, dadurch gekennzeichnet, dass mindestens ein Kühlkörper durch einen metallischen Montagerahmen (50, 60, 70, 80) gebildet ist, mit dem die Leiterplatte (10) in oder an einem Gehäuse befestigbar ist.4. Printed circuit board according to claim 3, characterized in that at least one heat sink is formed by a metallic mounting frame ( 50 , 60 , 70 , 80 ) with which the printed circuit board ( 10 ) can be fastened in or on a housing.
DE20208478U 2002-05-29 2002-05-29 Printed circuit board with mass pad on the back Expired - Lifetime DE20208478U1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE20208478U DE20208478U1 (en) 2002-05-29 2002-05-29 Printed circuit board with mass pad on the back
CN02247544U CN2572720Y (en) 2002-05-29 2002-08-21 Printed circuit board with backside grounding piece
FR0211315A FR2840503B3 (en) 2002-05-29 2002-09-12 PRINTED CIRCUIT BOARD
ES200202577U ES1053051Y (en) 2002-05-29 2002-10-25 PRINTED CIRCUIT PLATE WITH DORSAL MASS PLATE.
ITMI20030013 ITMI20030013U1 (en) 2002-05-29 2003-01-16 CIRCUIT PLATE WITH REAR GROUND BRANCH

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20208478U DE20208478U1 (en) 2002-05-29 2002-05-29 Printed circuit board with mass pad on the back

Publications (1)

Publication Number Publication Date
DE20208478U1 true DE20208478U1 (en) 2002-08-29

Family

ID=7971699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20208478U Expired - Lifetime DE20208478U1 (en) 2002-05-29 2002-05-29 Printed circuit board with mass pad on the back

Country Status (5)

Country Link
CN (1) CN2572720Y (en)
DE (1) DE20208478U1 (en)
ES (1) ES1053051Y (en)
FR (1) FR2840503B3 (en)
IT (1) ITMI20030013U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027596A2 (en) * 2003-09-12 2005-03-24 Siemens Aktiengesellschaft Printed circuit board for a radio module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102509957B (en) * 2011-10-18 2014-02-19 华为终端有限公司 Universal serial bus (USB) male plug

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027596A2 (en) * 2003-09-12 2005-03-24 Siemens Aktiengesellschaft Printed circuit board for a radio module
WO2005027596A3 (en) * 2003-09-12 2005-07-21 Siemens Ag Printed circuit board for a radio module

Also Published As

Publication number Publication date
CN2572720Y (en) 2003-09-10
ES1053051U (en) 2003-03-01
FR2840503B3 (en) 2004-04-30
ES1053051Y (en) 2003-06-16
FR2840503A3 (en) 2003-12-05
ITMI20030013U1 (en) 2003-11-30

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20021002

R150 Term of protection extended to 6 years

Effective date: 20050803

R157 Lapse of ip right after 6 years

Effective date: 20081202