FR2700416B1 - Dispositif à semiconducteurs comportant un élément semiconducteur sur un élément de montage. - Google Patents
Dispositif à semiconducteurs comportant un élément semiconducteur sur un élément de montage.Info
- Publication number
- FR2700416B1 FR2700416B1 FR9400121A FR9400121A FR2700416B1 FR 2700416 B1 FR2700416 B1 FR 2700416B1 FR 9400121 A FR9400121 A FR 9400121A FR 9400121 A FR9400121 A FR 9400121A FR 2700416 B1 FR2700416 B1 FR 2700416B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor
- semiconductor device
- mounting
- mounting element
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5002092A JPH06209054A (ja) | 1993-01-08 | 1993-01-08 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2700416A1 FR2700416A1 (fr) | 1994-07-13 |
FR2700416B1 true FR2700416B1 (fr) | 1996-01-05 |
Family
ID=11519714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9400121A Expired - Fee Related FR2700416B1 (fr) | 1993-01-08 | 1994-01-07 | Dispositif à semiconducteurs comportant un élément semiconducteur sur un élément de montage. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5440169A (fr) |
JP (1) | JPH06209054A (fr) |
DE (1) | DE4400341A1 (fr) |
FR (1) | FR2700416B1 (fr) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW271496B (fr) * | 1994-06-09 | 1996-03-01 | Samsung Electronics Co Ltd | |
JP3419922B2 (ja) * | 1994-12-07 | 2003-06-23 | 富士通株式会社 | 半導体装置 |
JPH08130267A (ja) * | 1994-11-01 | 1996-05-21 | Mitsubishi Electric Corp | 樹脂封止型半導体パッケージ、それを用いた樹脂封止型半導体装置およびその製造方法 |
JP3367299B2 (ja) * | 1994-11-11 | 2003-01-14 | セイコーエプソン株式会社 | 樹脂封止型半導体装置およびその製造方法 |
JPH08316372A (ja) * | 1995-05-16 | 1996-11-29 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH0992776A (ja) * | 1995-09-28 | 1997-04-04 | Mitsubishi Electric Corp | リードフレームおよび半導体装置 |
US6072239A (en) * | 1995-11-08 | 2000-06-06 | Fujitsu Limited | Device having resin package with projections |
US6376921B1 (en) | 1995-11-08 | 2002-04-23 | Fujitsu Limited | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
US6329711B1 (en) | 1995-11-08 | 2001-12-11 | Fujitsu Limited | Semiconductor device and mounting structure |
US6159770A (en) * | 1995-11-08 | 2000-12-12 | Fujitsu Limited | Method and apparatus for fabricating semiconductor device |
JP3345241B2 (ja) * | 1995-11-30 | 2002-11-18 | 三菱電機株式会社 | 半導体装置 |
JPH09260550A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JPH09260436A (ja) * | 1996-03-27 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JPH09260568A (ja) * | 1996-03-27 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
WO1998009329A1 (fr) * | 1996-08-29 | 1998-03-05 | Hitachi, Ltd. | Dispositif a semi-conducteur scelle par resine, et son procede de production |
JP3612155B2 (ja) | 1996-11-20 | 2005-01-19 | 株式会社日立製作所 | 半導体装置および半導体装置用のリードフレーム |
KR19980067735A (ko) * | 1997-02-11 | 1998-10-15 | 문정환 | 반도체 패키지의 제조방법 |
US6001672A (en) * | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
JP2907186B2 (ja) | 1997-05-19 | 1999-06-21 | 日本電気株式会社 | 半導体装置、その製造方法 |
US6297548B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
US6297960B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
US6246124B1 (en) | 1998-09-16 | 2001-06-12 | International Business Machines Corporation | Encapsulated chip module and method of making same |
KR20010009350A (ko) * | 1999-07-09 | 2001-02-05 | 윤종용 | 기판이 없는 칩 스케일 패키지 및 그 제조방법 |
KR100342589B1 (ko) * | 1999-10-01 | 2002-07-04 | 김덕중 | 반도체 전력 모듈 및 그 제조 방법 |
US6329220B1 (en) * | 1999-11-23 | 2001-12-11 | Micron Technology, Inc. | Packages for semiconductor die |
JP2001313363A (ja) * | 2000-05-01 | 2001-11-09 | Rohm Co Ltd | 樹脂封止型半導体装置 |
US6559537B1 (en) * | 2000-08-31 | 2003-05-06 | Micron Technology, Inc. | Ball grid array packages with thermally conductive containers |
JP4286465B2 (ja) * | 2001-02-09 | 2009-07-01 | 三菱電機株式会社 | 半導体装置とその製造方法 |
JP2002246515A (ja) * | 2001-02-20 | 2002-08-30 | Mitsubishi Electric Corp | 半導体装置 |
US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
US6444501B1 (en) * | 2001-06-12 | 2002-09-03 | Micron Technology, Inc. | Two stage transfer molding method to encapsulate MMC module |
JP2003224239A (ja) * | 2002-01-29 | 2003-08-08 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
US7019394B2 (en) * | 2003-09-30 | 2006-03-28 | Intel Corporation | Circuit package and method of plating the same |
US20050133913A1 (en) * | 2003-12-17 | 2005-06-23 | Dan Okamoto | Stress distribution package |
JP4549171B2 (ja) * | 2004-08-31 | 2010-09-22 | 三洋電機株式会社 | 混成集積回路装置 |
JP2006086273A (ja) * | 2004-09-15 | 2006-03-30 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置 |
US7088586B2 (en) * | 2004-11-15 | 2006-08-08 | Cisco Technology, Inc. | Techniques for cooling a circuit board component within an environment with little or no forced convection airflow |
US7202113B2 (en) * | 2005-06-09 | 2007-04-10 | Ming Sun | Wafer level bumpless method of making a flip chip mounted semiconductor device package |
CN101449371B (zh) * | 2006-05-30 | 2010-09-29 | 国产电机株式会社 | 树脂密封型半导体器件以及用该半导体器件的电子装置 |
JP4821537B2 (ja) * | 2006-09-26 | 2011-11-24 | 株式会社デンソー | 電子制御装置 |
JP2008118067A (ja) * | 2006-11-08 | 2008-05-22 | Hitachi Ltd | パワーモジュール及びモータ一体型コントロール装置 |
JP2008172172A (ja) * | 2007-01-15 | 2008-07-24 | Denso Corp | 電子制御装置及びその製造方法 |
US7915728B2 (en) | 2007-07-12 | 2011-03-29 | Vishay General Semiconductor Llc | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof |
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TWI368956B (en) * | 2007-08-10 | 2012-07-21 | Siliconware Precision Industries Co Ltd | Multichip stack structure and method for fabricating the same |
JP5056552B2 (ja) * | 2008-04-08 | 2012-10-24 | 株式会社デンソー | 電子装置の実装構造 |
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US8106502B2 (en) * | 2008-11-17 | 2012-01-31 | Stats Chippac Ltd. | Integrated circuit packaging system with plated pad and method of manufacture thereof |
JP5425461B2 (ja) | 2008-12-26 | 2014-02-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5588137B2 (ja) * | 2009-09-14 | 2014-09-10 | 新光電気工業株式会社 | 半導体装置の製造方法 |
US9129949B2 (en) | 2011-02-09 | 2015-09-08 | Mitsubishi Electric Corporation | Power semiconductor module |
JP2013070026A (ja) | 2011-09-08 | 2013-04-18 | Rohm Co Ltd | 半導体装置、半導体装置の製造方法、半導体装置の実装構造、およびパワー用半導体装置 |
JP2013115133A (ja) * | 2011-11-25 | 2013-06-10 | Semiconductor Components Industries Llc | 回路装置の製造方法 |
JP2014203861A (ja) | 2013-04-02 | 2014-10-27 | 三菱電機株式会社 | 半導体装置および半導体モジュール |
WO2014174573A1 (fr) * | 2013-04-22 | 2014-10-30 | 三菱電機株式会社 | Dispositif à semi-conducteurs, et procédé de fabrication associé |
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JPS5577160A (en) * | 1978-12-07 | 1980-06-10 | Nec Corp | Semiconductor device |
FR2488445A1 (fr) * | 1980-08-06 | 1982-02-12 | Efcis | Boitier plastique pour circuits integres |
JPS5966157A (ja) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
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JP2834841B2 (ja) * | 1990-04-20 | 1998-12-14 | 沖電気工業株式会社 | 高耐熱性樹脂封止型半導体装置 |
US5216283A (en) * | 1990-05-03 | 1993-06-01 | Motorola, Inc. | Semiconductor device having an insertable heat sink and method for mounting the same |
JPH0451549A (ja) * | 1990-06-19 | 1992-02-20 | Mitsubishi Electric Corp | 高放熱型半導体装置 |
US5105259A (en) * | 1990-09-28 | 1992-04-14 | Motorola, Inc. | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation |
JPH04246849A (ja) * | 1991-02-01 | 1992-09-02 | Nec Kyushu Ltd | 半導体装置 |
US5214846A (en) * | 1991-04-24 | 1993-06-01 | Sony Corporation | Packaging of semiconductor chips |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
JPH05152488A (ja) * | 1991-11-30 | 1993-06-18 | Nec Corp | 樹脂封止型半導体装置 |
-
1993
- 1993-01-08 JP JP5002092A patent/JPH06209054A/ja active Pending
-
1994
- 1994-01-05 US US08/177,380 patent/US5440169A/en not_active Expired - Fee Related
- 1994-01-07 FR FR9400121A patent/FR2700416B1/fr not_active Expired - Fee Related
- 1994-01-07 DE DE4400341A patent/DE4400341A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
FR2700416A1 (fr) | 1994-07-13 |
DE4400341A1 (de) | 1994-07-14 |
JPH06209054A (ja) | 1994-07-26 |
US5440169A (en) | 1995-08-08 |
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