FR2547457B1 - Carte avec un module de circuit integre - Google Patents
Carte avec un module de circuit integreInfo
- Publication number
- FR2547457B1 FR2547457B1 FR8409075A FR8409075A FR2547457B1 FR 2547457 B1 FR2547457 B1 FR 2547457B1 FR 8409075 A FR8409075 A FR 8409075A FR 8409075 A FR8409075 A FR 8409075A FR 2547457 B1 FR2547457 B1 FR 2547457B1
- Authority
- FR
- France
- Prior art keywords
- card
- integrated circuit
- circuit module
- module
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58103346A JPS59229686A (ja) | 1983-06-09 | 1983-06-09 | Icカ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2547457A1 FR2547457A1 (fr) | 1984-12-14 |
FR2547457B1 true FR2547457B1 (fr) | 1986-07-18 |
Family
ID=14351572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8409075A Expired FR2547457B1 (fr) | 1983-06-09 | 1984-06-08 | Carte avec un module de circuit integre |
Country Status (3)
Country | Link |
---|---|
US (1) | US4621190A (fr) |
JP (1) | JPS59229686A (fr) |
FR (1) | FR2547457B1 (fr) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
JPH0751390B2 (ja) * | 1985-07-10 | 1995-06-05 | カシオ計算機株式会社 | Icカ−ド |
US4889980A (en) * | 1985-07-10 | 1989-12-26 | Casio Computer Co., Ltd. | Electronic memory card and method of manufacturing same |
IT1214634B (it) * | 1985-10-23 | 1990-01-18 | Pentasystem Srl | Supporto per carta o tesserino in materiale plastico inglobante un circuito integrato di memoria. |
JPS62229491A (ja) * | 1986-03-31 | 1987-10-08 | Toshiba Corp | 携帯可能記録媒体の読取り/書込み装置 |
FR2608293B1 (fr) * | 1986-12-12 | 1990-12-28 | Petit Jean P | Acces a un dispositif comportant un circuit electronique a l'aide de deux contacts et dispositifs associes |
FR2611945B1 (fr) * | 1987-03-06 | 1991-07-12 | Medina Jean Bertrand | Dispositif et procede pour l'enregistrement, la conservation et la consultation limitee d'informations confidentielles relatives a un objet, et jeton pour la mise en oeuvre du procede |
DE3713251C2 (de) * | 1987-04-18 | 1996-04-11 | Mannesmann Kienzle Gmbh | Vorrichtung zur Übertragung und Speicherung von Energie und Informationen in einen kartenförmig ausgebildeten, mobilen Datenträger |
USRE36356E (en) * | 1987-12-14 | 1999-10-26 | Sgs-Thomson Microelectronics S.A. | Electronic component support for memory card and product obtained thereby |
FR2624635B1 (fr) * | 1987-12-14 | 1991-05-10 | Sgs Thomson Microelectronics | Support de composant electronique pour carte memoire et produit ainsi obtenu |
JP2585683B2 (ja) * | 1988-02-10 | 1997-02-26 | 富士写真フイルム株式会社 | Icカード及びicカードを使用する装置 |
GB8819481D0 (en) * | 1988-08-16 | 1988-09-21 | Plus 5 Eng Ltd | Portable memory device |
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
US4931991A (en) * | 1988-12-22 | 1990-06-05 | Amp Incorporated | Machine readable memory card with capacitive interconnect |
JP2859288B2 (ja) * | 1989-03-20 | 1999-02-17 | 株式会社日立製作所 | 半導体集積回路装置及びその製造方法 |
US6016255A (en) * | 1990-11-19 | 2000-01-18 | Dallas Semiconductor Corp. | Portable data carrier mounting system |
US5210846B1 (en) * | 1989-05-15 | 1999-06-29 | Dallas Semiconductor | One-wire bus architecture |
WO1990014626A1 (fr) * | 1989-05-15 | 1990-11-29 | Dallas Semiconductor Corporation | Systemes a jeton de donnee/bus monofil |
US5045675A (en) * | 1989-05-15 | 1991-09-03 | Dallas Semiconductor Corporation | Serial port interface to low-voltage low-power data module |
US5157244A (en) * | 1989-12-19 | 1992-10-20 | Amp Incorporated | Smart key system |
US5517015A (en) | 1990-11-19 | 1996-05-14 | Dallas Semiconductor Corporation | Communication module |
US5994770A (en) * | 1991-07-09 | 1999-11-30 | Dallas Semiconductor Corporation | Portable electronic data carrier |
US5638418A (en) * | 1993-02-05 | 1997-06-10 | Dallas Semiconductor Corporation | Temperature detector systems and methods |
US5552999A (en) * | 1991-07-09 | 1996-09-03 | Dallas Semiconductor Corp | Digital histogram generator systems and methods |
FR2686997B1 (fr) * | 1992-01-30 | 1994-04-01 | Gemplus Card International | Carte a puce a deux contacts et procede de communication avec un lecteur de carte. |
US5374818A (en) * | 1992-03-09 | 1994-12-20 | Control Module Inc. | Identification means with integral memory device |
USRE42773E1 (en) * | 1992-06-17 | 2011-10-04 | Round Rock Research, Llc | Method of manufacturing an enclosed transceiver |
US7158031B2 (en) * | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
ATE196813T1 (de) * | 1993-10-08 | 2000-10-15 | Valtac Alex Beaud | Speicheranordnung |
US5848541A (en) * | 1994-03-30 | 1998-12-15 | Dallas Semiconductor Corporation | Electrical/mechanical access control systems |
US5831827A (en) * | 1994-04-28 | 1998-11-03 | Dallas Semiconductor Corporation | Token shaped module for housing an electronic circuit |
US5604343A (en) * | 1994-05-24 | 1997-02-18 | Dallas Semiconductor Corporation | Secure storage of monetary equivalent data systems and processes |
US5679944A (en) * | 1994-06-15 | 1997-10-21 | Dallas Semiconductor Corporation | Portable electronic module having EPROM memory, systems and processes |
DE4437844C2 (de) * | 1994-10-22 | 2001-03-08 | Cubit Electronics Gmbh | Kontaktloser Datenträger und Verfahren zu seiner Herstellung |
US5615130A (en) * | 1994-12-14 | 1997-03-25 | Dallas Semiconductor Corp. | Systems and methods to gather, store and transfer information from electro/mechanical tools and instruments |
US6001211A (en) * | 1995-07-18 | 1999-12-14 | Oki Electric Industry Co., Ltd. | Method of producing a tag device with IC capacitively coupled to antenna |
US5862354A (en) * | 1996-03-05 | 1999-01-19 | Dallas Semiconductor Corporation | Universal asynchronous receiver/transmitter (UART) slave device containing an identifier for communication on a one-wire bus |
US6339385B1 (en) | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
DE69817543T2 (de) | 1998-06-08 | 2004-06-24 | International Business Machines Corp. | Automatische Datenrückgewinnung in Chipkarten |
EP0964361A1 (fr) * | 1998-06-08 | 1999-12-15 | International Business Machines Corporation | Protection d'information sensible contenue dans les cartes à puce |
DE19840248A1 (de) * | 1998-09-03 | 2000-03-16 | Fraunhofer Ges Forschung | Schaltungschip mit spezifischer Anschlußflächenanordnung |
FR2784210B1 (fr) * | 1998-10-02 | 2001-09-14 | Gemplus Card Int | Carte a puce sans contact comportant des moyens d'inhibition |
US6685338B1 (en) | 2002-02-20 | 2004-02-03 | Buztronics, Inc. | Flashing coin |
US7168624B2 (en) * | 2002-04-26 | 2007-01-30 | Renesas Technology Corp. | Semiconductor device and IC card |
JP2004241754A (ja) * | 2002-07-16 | 2004-08-26 | Chem Art Technol:Kk | 基板処理方法及び基板処理装置 |
JP2005026743A (ja) * | 2003-06-30 | 2005-01-27 | Matsushita Electric Ind Co Ltd | アンテナ一体型非接触icカード読取/書込装置 |
DE10356367B4 (de) | 2003-11-28 | 2009-06-10 | Georg Bernitz | Verfahren zur Herstellung eines Bauelements und Bauelement |
CN103828046B (zh) * | 2011-09-30 | 2018-05-22 | 英特尔公司 | 用于3d集成电路层叠的层间通信 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
TWM435771U (en) * | 2012-04-27 | 2012-08-11 | Giga Solar Materials Corp | Card type solar charger |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2304965A2 (fr) * | 1974-03-25 | 1976-10-15 | Innovation Ste Int | Procede et dispositif de commande electronique |
US4004133A (en) * | 1974-12-30 | 1977-01-18 | Rca Corporation | Credit card containing electronic circuit |
US4001550A (en) * | 1975-12-04 | 1977-01-04 | Schatz Vernon L | Universal funds transfer and identification card |
FR2403695A1 (fr) * | 1977-09-16 | 1979-04-13 | Cii Honeywell Bull | Dispositif pour assurer l'alimentation et la transmission de signaux electriques entre deux dispositifs par l'intermediaire de contacts en nombre reduit |
DE2920012C2 (de) * | 1979-05-17 | 1988-09-29 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
FR2505091A1 (fr) * | 1981-04-30 | 1982-11-05 | Cii Honeywell Bull | Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques |
US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
US4447716A (en) * | 1982-03-01 | 1984-05-08 | Seiichiro Aigo | Information card |
US4480178A (en) * | 1983-04-04 | 1984-10-30 | At&T Information Systems | Tuning arrangement for interfacing credit card-like device to a reader system |
-
1983
- 1983-06-09 JP JP58103346A patent/JPS59229686A/ja active Granted
-
1984
- 1984-06-07 US US06/618,381 patent/US4621190A/en not_active Expired - Lifetime
- 1984-06-08 FR FR8409075A patent/FR2547457B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS59229686A (ja) | 1984-12-24 |
JPH0233198B2 (fr) | 1990-07-25 |
FR2547457A1 (fr) | 1984-12-14 |
US4621190A (en) | 1986-11-04 |
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