FR2363893A1 - Composant a semi-conducteur avec socle durablement fixable a du metal leger, notamment pour refroidissement - Google Patents

Composant a semi-conducteur avec socle durablement fixable a du metal leger, notamment pour refroidissement

Info

Publication number
FR2363893A1
FR2363893A1 FR7726655A FR7726655A FR2363893A1 FR 2363893 A1 FR2363893 A1 FR 2363893A1 FR 7726655 A FR7726655 A FR 7726655A FR 7726655 A FR7726655 A FR 7726655A FR 2363893 A1 FR2363893 A1 FR 2363893A1
Authority
FR
France
Prior art keywords
light metal
semiconductor component
sustainably
cooling
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7726655A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of FR2363893A1 publication Critical patent/FR2363893A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

Composant à semi-conducteur. Le socle en cuvette maintient une plaque isolante et des éléments de contact dans la position determinée pour l'assemblage ; la partie supérieure du boîtier est reliée au socle par sertissage; le socle est formé d'un matériau permettant une liaison durable et ferme aussi bien avec des éléments en cuivre, pour la constitution du composant, qu'avec des éléments en métal léger. Fabrication de composants à semi-conducteur avec organe de refroidissement.
FR7726655A 1976-09-04 1977-09-02 Composant a semi-conducteur avec socle durablement fixable a du metal leger, notamment pour refroidissement Withdrawn FR2363893A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762639979 DE2639979C3 (de) 1976-09-04 1976-09-04 Halbleiterbaueinheit

Publications (1)

Publication Number Publication Date
FR2363893A1 true FR2363893A1 (fr) 1978-03-31

Family

ID=5987203

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7726655A Withdrawn FR2363893A1 (fr) 1976-09-04 1977-09-02 Composant a semi-conducteur avec socle durablement fixable a du metal leger, notamment pour refroidissement

Country Status (6)

Country Link
JP (1) JPS5332673A (fr)
AT (1) AT377386B (fr)
CH (1) CH621435A5 (fr)
DE (1) DE2639979C3 (fr)
FR (1) FR2363893A1 (fr)
GB (1) GB1584783A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2503526A1 (fr) * 1981-04-03 1982-10-08 Silicium Semiconducteur Ssc Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2805019C2 (de) * 1978-02-06 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Spannungsversorgungsgerät für Werkzeugmaschinenantriebe
DE2812699A1 (de) * 1978-03-23 1979-09-27 Bbc Brown Boveri & Cie Anordnung von scheibenthyristoren in thermischer und elektrischer kontaktierung auf kuehlkoerpern
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
DE2829300C2 (de) * 1978-07-04 1988-07-28 Brown, Boveri & Cie Ag, 6800 Mannheim Umkehrstromrichter-Anordnung
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS56132760U (fr) * 1980-03-06 1981-10-08
JPS5710959A (en) * 1980-06-23 1982-01-20 Mitsubishi Electric Corp Semiconductor device
JPS5823469A (ja) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp 複合パワ−トランジスタ
DE3143339A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS5968958A (ja) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ組立体
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
KR900003012Y1 (ko) * 1986-02-21 1990-04-10 아루프스 덴기 가부시끼가이샤 Rf 모듈레이터
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
DE3915707A1 (de) * 1989-05-13 1990-11-22 Asea Brown Boveri Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse
DE3940933C2 (de) * 1989-12-12 1996-08-01 Eupec Gmbh & Co Kg Verfahren zum Verformen einer Basisplatte für Halbleitermodule und Vorrichtung zum Durchführen des Verfahrens
DE4305439C2 (de) * 1993-02-23 1999-10-21 Eldo Elektronik Service Gmbh Umkapselung für einen elektronischen Sensor zur Feldstärkemessung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316672B2 (fr) * 1971-09-16 1978-06-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2503526A1 (fr) * 1981-04-03 1982-10-08 Silicium Semiconducteur Ssc Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.

Also Published As

Publication number Publication date
JPS5332673A (en) 1978-03-28
CH621435A5 (en) 1981-01-30
DE2639979C3 (de) 1980-05-14
AT377386B (de) 1985-03-11
DE2639979B2 (de) 1979-08-23
DE2639979A1 (de) 1978-03-09
ATA617777A (de) 1984-07-15
GB1584783A (en) 1981-02-18

Similar Documents

Publication Publication Date Title
FR2363893A1 (fr) Composant a semi-conducteur avec socle durablement fixable a du metal leger, notamment pour refroidissement
DE69133468D1 (de) Halbleiterchipanordnungen, Herstellungsmethoden und Komponenten für dieselbe
FR2423848A1 (fr)
FR2433270A1 (fr) Monture a connexions pour dispositifs electroniques
FR2400266A1 (fr) Connecteur electrique, notamment pour compresseur de refrigerateur
FR2435801A1 (fr) Disjoncteur de protection bipolaire a declenchement thermique
FR2437708A1 (fr) Connecteur electrique en deux parties
FR2392758A1 (fr) Procede de soudage sur couches d'or
FR2389031A1 (fr) Assemblage amovible et plaque a languettes, en particulier pour meubles
FR2393429A1 (fr) Circuit integre semi-conducteur oxyde-metal a symetrie complementaire
JPS54124678A (en) Lead frame
JPS5423484A (en) Semiconductor integrated circuit and its manufacture
US1837238A (en) Method of making electrical switch contacts
FR2403711A1 (fr) Circuit imprime avec interconnexion entre les deux faces
FR2416371A1 (fr) Perfectionnements a des moyens de fixation d'une vis a travers un orifice forme dans une paroi et cooperant avec un ecrou prisonnier
JPS6421876A (en) Electrical structural component with contact pin
FR2373159A1 (fr) Lampe a incandescence a halogene reliee a un reflecteur
FR2415739A1 (fr) Dispositif d'accouplement articule separable pour exploitations minieres au fond
FR2369774A1 (fr) Dispositif de suppo
FR2400248A1 (fr) Composant electrique enrobe d'une masse isolante et son procede de fabrication
JPS6490585A (en) Semiconductor device
FR2404910A1 (fr) Dispositif de connexion pourvu d'un support pour coupe-circuit a fluide
SU1457015A2 (ru) Термореле
FR2371094A1 (fr) Perfectionnements aux commutateurs et relatifs a ceux-ci
FR2382100A1 (fr) Structure de brasage d'un conducteur sur un dispositif semi-conducteur

Legal Events

Date Code Title Description
ST Notification of lapse