DE2639979C3 - Halbleiterbaueinheit - Google Patents

Halbleiterbaueinheit

Info

Publication number
DE2639979C3
DE2639979C3 DE19762639979 DE2639979A DE2639979C3 DE 2639979 C3 DE2639979 C3 DE 2639979C3 DE 19762639979 DE19762639979 DE 19762639979 DE 2639979 A DE2639979 A DE 2639979A DE 2639979 C3 DE2639979 C3 DE 2639979C3
Authority
DE
Germany
Prior art keywords
base plate
semiconductor
components
shaped
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19762639979
Other languages
German (de)
English (en)
Other versions
DE2639979A1 (de
DE2639979B2 (de
Inventor
Winfried Ing.(Grad.) 8542 Roth Schierz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Priority to DE19762639979 priority Critical patent/DE2639979C3/de
Priority to CH1036777A priority patent/CH621435A5/de
Priority to AT617777A priority patent/AT377386B/de
Priority to US05/829,911 priority patent/US4106052A/en
Priority to JP10426877A priority patent/JPS5332673A/ja
Priority to FR7726655A priority patent/FR2363893A1/fr
Priority to GB3694077A priority patent/GB1584783A/en
Publication of DE2639979A1 publication Critical patent/DE2639979A1/de
Publication of DE2639979B2 publication Critical patent/DE2639979B2/de
Application granted granted Critical
Publication of DE2639979C3 publication Critical patent/DE2639979C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19762639979 1975-04-19 1976-09-04 Halbleiterbaueinheit Expired DE2639979C3 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE19762639979 DE2639979C3 (de) 1976-09-04 1976-09-04 Halbleiterbaueinheit
CH1036777A CH621435A5 (en) 1976-09-04 1977-08-24 Semiconductor module
AT617777A AT377386B (de) 1976-09-04 1977-08-25 Halbleiterbaueinheit
JP10426877A JPS5332673A (en) 1976-09-04 1977-09-01 Semiconductor constituting units
US05/829,911 US4106052A (en) 1975-04-19 1977-09-01 Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
FR7726655A FR2363893A1 (fr) 1976-09-04 1977-09-02 Composant a semi-conducteur avec socle durablement fixable a du metal leger, notamment pour refroidissement
GB3694077A GB1584783A (en) 1976-09-04 1977-09-05 Semiconductor assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762639979 DE2639979C3 (de) 1976-09-04 1976-09-04 Halbleiterbaueinheit

Publications (3)

Publication Number Publication Date
DE2639979A1 DE2639979A1 (de) 1978-03-09
DE2639979B2 DE2639979B2 (de) 1979-08-23
DE2639979C3 true DE2639979C3 (de) 1980-05-14

Family

ID=5987203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762639979 Expired DE2639979C3 (de) 1975-04-19 1976-09-04 Halbleiterbaueinheit

Country Status (6)

Country Link
JP (1) JPS5332673A (fr)
AT (1) AT377386B (fr)
CH (1) CH621435A5 (fr)
DE (1) DE2639979C3 (fr)
FR (1) FR2363893A1 (fr)
GB (1) GB1584783A (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2805019C2 (de) * 1978-02-06 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Spannungsversorgungsgerät für Werkzeugmaschinenantriebe
DE2812699C2 (de) * 1978-03-23 1987-04-09 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichter in Brückenschaltung mit einseitig gekühlten Scheibenthyristoren
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
DE2829300C2 (de) * 1978-07-04 1988-07-28 Brown, Boveri & Cie Ag, 6800 Mannheim Umkehrstromrichter-Anordnung
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS56132760U (fr) * 1980-03-06 1981-10-08
JPS5710959A (en) * 1980-06-23 1982-01-20 Mitsubishi Electric Corp Semiconductor device
FR2503526A1 (fr) * 1981-04-03 1982-10-08 Silicium Semiconducteur Ssc Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.
JPS5823469A (ja) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp 複合パワ−トランジスタ
DE3143339C2 (de) * 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS5968958A (ja) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ組立体
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
KR900003012Y1 (ko) * 1986-02-21 1990-04-10 아루프스 덴기 가부시끼가이샤 Rf 모듈레이터
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
DE3915707A1 (de) * 1989-05-13 1990-11-22 Asea Brown Boveri Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse
DE3940933C2 (de) * 1989-12-12 1996-08-01 Eupec Gmbh & Co Kg Verfahren zum Verformen einer Basisplatte für Halbleitermodule und Vorrichtung zum Durchführen des Verfahrens
DE4305439C2 (de) * 1993-02-23 1999-10-21 Eldo Elektronik Service Gmbh Umkapselung für einen elektronischen Sensor zur Feldstärkemessung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316672B2 (fr) * 1971-09-16 1978-06-02

Also Published As

Publication number Publication date
AT377386B (de) 1985-03-11
DE2639979A1 (de) 1978-03-09
JPS5332673A (en) 1978-03-28
ATA617777A (de) 1984-07-15
CH621435A5 (en) 1981-01-30
FR2363893A1 (fr) 1978-03-31
DE2639979B2 (de) 1979-08-23
GB1584783A (en) 1981-02-18

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Legal Events

Date Code Title Description
OAM Search report available
OAP Request for examination filed
OC Search report available
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee