FI991160A - Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemisek si - Google Patents

Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemisek si Download PDF

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Publication number
FI991160A
FI991160A FI991160A FI991160A FI991160A FI 991160 A FI991160 A FI 991160A FI 991160 A FI991160 A FI 991160A FI 991160 A FI991160 A FI 991160A FI 991160 A FI991160 A FI 991160A
Authority
FI
Finland
Prior art keywords
semiconductor industry
washing utensils
utensils
washing
industry
Prior art date
Application number
FI991160A
Other languages
English (en)
Swedish (sv)
Other versions
FI113750B (fi
FI991160A0 (fi
Inventor
Kari Laang
Pertti Maentylae
Original Assignee
Kojair Tech Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kojair Tech Oy filed Critical Kojair Tech Oy
Priority to FI991160A priority Critical patent/FI113750B/fi
Publication of FI991160A0 publication Critical patent/FI991160A0/fi
Priority to GB0012086A priority patent/GB2351436B/en
Priority to IE2000/0384A priority patent/IE83509B1/en
Priority to DE10024870A priority patent/DE10024870A1/de
Priority to US09/575,614 priority patent/US6620258B1/en
Publication of FI991160A publication Critical patent/FI991160A/fi
Application granted granted Critical
Publication of FI113750B publication Critical patent/FI113750B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
FI991160A 1999-05-21 1999-05-21 Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemiseksi FI113750B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI991160A FI113750B (fi) 1999-05-21 1999-05-21 Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemiseksi
GB0012086A GB2351436B (en) 1999-05-21 2000-05-18 The cleaning of instruments used in the semiconductor industry using a flammable solvent
IE2000/0384A IE83509B1 (en) 2000-05-18 The cleaning of instruments used in the semiconductor industry using a flammable solvent
DE10024870A DE10024870A1 (de) 1999-05-21 2000-05-19 Verfahren und Einrichtung zum Waschen von Arbeitsgeräten der Halbleiterindustrie
US09/575,614 US6620258B1 (en) 1999-05-21 2000-05-22 Method for washing instruments used in semiconductor industry

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI991160 1999-05-21
FI991160A FI113750B (fi) 1999-05-21 1999-05-21 Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemiseksi

Publications (3)

Publication Number Publication Date
FI991160A0 FI991160A0 (fi) 1999-05-21
FI991160A true FI991160A (fi) 2000-11-22
FI113750B FI113750B (fi) 2004-06-15

Family

ID=8554708

Family Applications (1)

Application Number Title Priority Date Filing Date
FI991160A FI113750B (fi) 1999-05-21 1999-05-21 Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemiseksi

Country Status (4)

Country Link
US (1) US6620258B1 (fi)
DE (1) DE10024870A1 (fi)
FI (1) FI113750B (fi)
GB (1) GB2351436B (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7819981B2 (en) 2004-10-26 2010-10-26 Advanced Technology Materials, Inc. Methods for cleaning ion implanter components

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE235548C (fi)
DE3145815C2 (de) 1981-11-19 1984-08-09 AGA Gas GmbH, 2102 Hamburg Verfahren zum Entfernen von ablösungsfähigen Materialschichten von beschichteten Gegenständen,
DE3804694A1 (de) 1987-06-23 1989-01-05 Taiyo Sanso Co Ltd Verfahren zur oberflaechenbearbeitung fuer halbleiter-wafer und vorrichtung zur durchfuehrung des verfahrens
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
CA2003859A1 (en) * 1989-02-01 1990-08-01 David Alan Dickinson Technique for cleaning an object with a combustible cleaning solvent
CA2011397C (en) * 1989-03-06 1994-07-12 Michael T. Mittag Method and apparatus for cleaning electronic and other devices
US5027841A (en) * 1990-04-24 1991-07-02 Electronic Controls Design, Inc. Apparatus to clean printed circuit boards
US5593507A (en) 1990-08-22 1997-01-14 Kabushiki Kaisha Toshiba Cleaning method and cleaning apparatus
US5201960A (en) 1991-02-04 1993-04-13 Applied Photonics Research, Inc. Method for removing photoresist and other adherent materials from substrates
FI97920C (fi) 1991-02-27 1997-03-10 Okmetic Oy Tapa puhdistaa puolijohdevalmiste
US5486235A (en) 1993-08-09 1996-01-23 Applied Materials, Inc. Plasma dry cleaning of semiconductor processing chambers
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
US5599743A (en) 1994-04-07 1997-02-04 Matsushita Electronics Corporation Method of manufacturing a semiconductor device
US5454390A (en) 1994-05-16 1995-10-03 International Business Machines Corporation Vapor rinse-vapor dry process tool
US5711821A (en) * 1995-04-13 1998-01-27 Texas Instruments Incorporated Cleansing process for wafer handling implements
US5839455A (en) * 1995-04-13 1998-11-24 Texas Instruments Incorporated Enhanced high pressure cleansing system for wafer handling implements
US5715612A (en) 1995-08-17 1998-02-10 Schwenkler; Robert S. Method for precision drying surfaces

Also Published As

Publication number Publication date
GB2351436A (en) 2001-01-03
FI113750B (fi) 2004-06-15
GB2351436B (en) 2003-07-02
IE20000384A1 (en) 2001-02-21
FI991160A0 (fi) 1999-05-21
DE10024870A1 (de) 2000-12-07
US6620258B1 (en) 2003-09-16
GB0012086D0 (en) 2000-07-12

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Legal Events

Date Code Title Description
MA Patent expired