FI955542A - Hiiliyhdisteitä ja menetelmiä ei-johtavan galvanointiaineen valmistamiseksi - Google Patents

Hiiliyhdisteitä ja menetelmiä ei-johtavan galvanointiaineen valmistamiseksi Download PDF

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Publication number
FI955542A
FI955542A FI955542A FI955542A FI955542A FI 955542 A FI955542 A FI 955542A FI 955542 A FI955542 A FI 955542A FI 955542 A FI955542 A FI 955542A FI 955542 A FI955542 A FI 955542A
Authority
FI
Finland
Prior art keywords
making
methods
carbon compounds
electroplating agent
conductive electroplating
Prior art date
Application number
FI955542A
Other languages
English (en)
Swedish (sv)
Other versions
FI955542A0 (fi
Inventor
Charles Edwin Thorn
Frank Polakovic
Charles A Mosolf
Original Assignee
Electrochemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/062,943 external-priority patent/US5389270A/en
Application filed by Electrochemicals Inc filed Critical Electrochemicals Inc
Publication of FI955542A0 publication Critical patent/FI955542A0/fi
Publication of FI955542A publication Critical patent/FI955542A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
FI955542A 1993-05-17 1995-11-16 Hiiliyhdisteitä ja menetelmiä ei-johtavan galvanointiaineen valmistamiseksi FI955542A (fi)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/062,943 US5389270A (en) 1993-05-17 1993-05-17 Composition and process for preparing a non-conductive substrate for electroplating
US08/232,574 US5476580A (en) 1993-05-17 1994-05-03 Processes for preparing a non-conductive substrate for electroplating
PCT/US1994/005267 WO1994026958A1 (en) 1993-05-17 1994-05-12 Carbon compositions and processes for preparing a non-conductive substrate for electroplating

Publications (2)

Publication Number Publication Date
FI955542A0 FI955542A0 (fi) 1995-11-16
FI955542A true FI955542A (fi) 1996-01-16

Family

ID=26742894

Family Applications (1)

Application Number Title Priority Date Filing Date
FI955542A FI955542A (fi) 1993-05-17 1995-11-16 Hiiliyhdisteitä ja menetelmiä ei-johtavan galvanointiaineen valmistamiseksi

Country Status (11)

Country Link
US (1) US5476580A (fi)
EP (1) EP0698132B1 (fi)
JP (1) JP3335176B2 (fi)
AU (1) AU6831794A (fi)
CA (1) CA2162905A1 (fi)
DE (1) DE69421699T2 (fi)
FI (1) FI955542A (fi)
HK (1) HK1005414A1 (fi)
NO (1) NO954637L (fi)
PL (1) PL311705A1 (fi)
WO (1) WO1994026958A1 (fi)

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JPH05218618A (ja) * 1992-01-30 1993-08-27 Cmk Corp プリント配線板の製造方法

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NO954637L (no) 1996-01-16
PL311705A1 (en) 1996-03-04
EP0698132A4 (en) 1996-01-15
DE69421699D1 (de) 1999-12-23
AU6831794A (en) 1994-12-12
CA2162905A1 (en) 1994-11-24
US5476580A (en) 1995-12-19
EP0698132B1 (en) 1999-11-17
JP3335176B2 (ja) 2002-10-15
EP0698132A1 (en) 1996-02-28
HK1005414A1 (en) 1999-01-08
FI955542A0 (fi) 1995-11-16
JPH09500419A (ja) 1997-01-14
WO1994026958A1 (en) 1994-11-24
DE69421699T2 (de) 2000-07-06
NO954637D0 (no) 1995-11-16

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