TW222313B - Electroplating method - Google Patents

Electroplating method

Info

Publication number
TW222313B
TW222313B TW082107277A TW82107277A TW222313B TW 222313 B TW222313 B TW 222313B TW 082107277 A TW082107277 A TW 082107277A TW 82107277 A TW82107277 A TW 82107277A TW 222313 B TW222313 B TW 222313B
Authority
TW
Taiwan
Prior art keywords
electroplating method
layer
electroplating
ofnonconductor
graphiteparticle
Prior art date
Application number
TW082107277A
Other languages
Chinese (zh)
Inventor
Yoshihiro Sakamoto
Sachiko Nakamura
Original Assignee
Mekku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mekku Kk filed Critical Mekku Kk
Application granted granted Critical
Publication of TW222313B publication Critical patent/TW222313B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Abstract

One type of electroplating method applied to nonconductor features that making the dispersive liquid contact with the surface ofnonconductor, which consists of graphite particle with diameter less than 2 micrometer and binder, forms a layer of graphiteparticle, then proceeds the electroplating process by taking the above graphite layer as conductor.
TW082107277A 1993-01-29 1993-09-06 Electroplating method TW222313B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3240393 1993-01-29

Publications (1)

Publication Number Publication Date
TW222313B true TW222313B (en) 1994-04-11

Family

ID=12357996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082107277A TW222313B (en) 1993-01-29 1993-09-06 Electroplating method

Country Status (5)

Country Link
CN (1) CN1093892C (en)
DE (1) DE4402413C2 (en)
GB (1) GB2274853B (en)
SG (1) SG52489A1 (en)
TW (1) TW222313B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07268682A (en) * 1994-03-28 1995-10-17 Mec Kk Method for electroplating surface of electric nonconductor
JP3481379B2 (en) * 1995-08-23 2003-12-22 メック株式会社 Electroplating method
GB2338715B (en) * 1998-06-24 2003-03-19 Hang Fung Jewellery Co Ltd A method of depositing a metal on an article
US6375731B1 (en) * 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
CN105231604A (en) * 2014-05-27 2016-01-13 中色金银贸易中心有限公司 Gold jewelry
CN114351197B (en) * 2021-11-30 2023-04-28 武汉格智新材料有限公司 Graphite shadow metallization auxiliary agent and preparation method and application thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB476042A (en) * 1936-03-27 1937-11-29 Albert Henry Stuart Improvements in and relating to coating compositions and the coating of surfaces
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
EP0581816A1 (en) * 1991-04-22 1994-02-09 ATOTECH Deutschland GmbH Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
JP3118103B2 (en) * 1992-12-21 2000-12-18 矢崎総業株式会社 Conductive member for electric circuit, electric circuit body and method of manufacturing the same
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating

Also Published As

Publication number Publication date
SG52489A1 (en) 1998-09-28
CN1093892C (en) 2002-11-06
DE4402413C2 (en) 1998-08-06
CN1092118A (en) 1994-09-14
DE4402413A1 (en) 1994-08-04
GB2274853B (en) 1996-05-15
GB9401134D0 (en) 1994-03-16
GB2274853A (en) 1994-08-10

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