FI113937B - Tryckt kretskort och sätt för dess framställing - Google Patents
Tryckt kretskort och sätt för dess framställing Download PDFInfo
- Publication number
- FI113937B FI113937B FI900580A FI900580A FI113937B FI 113937 B FI113937 B FI 113937B FI 900580 A FI900580 A FI 900580A FI 900580 A FI900580 A FI 900580A FI 113937 B FI113937 B FI 113937B
- Authority
- FI
- Finland
- Prior art keywords
- pattern
- printed circuit
- circuit board
- conductive layer
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09272—Layout details of angles or corners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Claims (5)
1. Tryckt kretskort innefattande: 5 ett underlag (1); ett kretsmönster (2) som är framställt pä underlaget (1) och som inkluderar ett sig-nalledningsmönster (20) och ett ytterligare mönster som är ett strömtillförselled-ningsmönster (22) eller ett jordledningsmönster (21); ett isolerande skikt (4) som är framställt pä underlaget (1) över kretsmönstret (2); 10 och ett ledande skikt (5) för anslutning tili jord- eller en strömtillförselpotential samt framställt pä det isolerande skiktet (4); kännetecknat av att: det isolerande skiktet (4) är framställt för att övertäcka kretsmönstret (2) med undantag för ätminstone en del av det ytterligare mönstret och med undantag för ett 15 parti (23, 25) i kretsmönstret (2) för en IC-stiftanslutning för strömkällan eller för jord; och det ledande skiktet (5) är framställt för att förbindas med en icke-isolerad del av det ytterligare mönstret och med partiet för nämnda IC-stiftanslutning.
2. Kretskort enligt patentkrav 1, kännetecknat av att ytan av IC-stiftanslutnings- !*! 20 partiet (23, 25) är vidare än ett signalparti (24) för en IC-signalstiftanslutning. ; j I
3. Kretskort enligt patentkrav 1 eller 2, kännetecknat av att det ledande skiktet : ‘: (5) täcker i huvudsak hela det isolerande skiktet (4).
• * · * · · ;;; 4. Sätt att framställa ett tryckt kretskort, vilket inbegriper stegen: * · » • - att try eka en krets pä ett under lag (1); • · 25 - att framställa ett isolerande skikt (4) pä den tryekta kretsen; och ; . - att framställa ett ledande skikt (5) pä det isolerande skiktet (4), kännetecknat av att ; t (’ den tryekta kretsen (2) har en ledande del (23, 25) för kontakt med ett jordstift eller ett strömtillförselstift av en kretskomponent som skall monteras pä kortet, att det 30 isolerande skiktet inte är framställt vid den ledande delen (23, 25) av den tryekta .1. kretsen (2) och att det ledande skiktet (5) kontaktar den tryekta kretsen (2) vid den ledande delen (23, 25). 113937 9
5. Sätt enligt patentkrav 4, kännetecknat av att det isolerande skiktet (4) inte heller är framställt över ätminstone en del av en jordledning (21) eller en ström-förselledning (2), och att det ledande skiktet (5) även kontaktar jordledningen (21) eller strömförselledningen (22) separat frän sin kontakt med den ledande delen (23, 5 25). f I • ·
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4083689 | 1989-02-21 | ||
JP4083689 | 1989-02-21 | ||
JP1922089 | 1989-02-21 | ||
JP1922089 | 1989-02-21 | ||
JP4083889 | 1989-02-21 | ||
JP1921989 | 1989-02-21 | ||
JP1921889 | 1989-02-21 | ||
JP1921989 | 1989-02-21 | ||
JP4083789 | 1989-02-21 | ||
JP4083789 | 1989-02-21 | ||
JP4083889 | 1989-02-21 | ||
JP1921889 | 1989-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
FI900580A0 FI900580A0 (fi) | 1990-02-06 |
FI113937B true FI113937B (sv) | 2004-06-30 |
Family
ID=27548844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI900580A FI113937B (sv) | 1989-02-21 | 1990-02-06 | Tryckt kretskort och sätt för dess framställing |
Country Status (7)
Country | Link |
---|---|
US (2) | US5341274A (sv) |
EP (3) | EP0631460B1 (sv) |
KR (1) | KR0123805B1 (sv) |
AU (1) | AU636129B2 (sv) |
CA (1) | CA2010128C (sv) |
DE (3) | DE69033522T2 (sv) |
FI (1) | FI113937B (sv) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH073660Y2 (ja) * | 1989-02-27 | 1995-01-30 | 任天堂株式会社 | Emi対策用回路基板 |
US4904968A (en) * | 1989-04-07 | 1990-02-27 | Tektronix, Inc. | Circuit board configuration for reducing signal distortion |
JP3260941B2 (ja) * | 1993-06-18 | 2002-02-25 | 株式会社日立製作所 | 多層配線基板および多層配線基板の製造方法 |
US5639989A (en) * | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
US5500789A (en) * | 1994-12-12 | 1996-03-19 | Dell Usa, L.P. | Printed circuit board EMI shielding apparatus and associated methods |
JP3368451B2 (ja) * | 1995-03-17 | 2003-01-20 | 富士通株式会社 | 回路基板の製造方法と回路検査装置 |
SE506941C2 (sv) * | 1995-03-31 | 1998-03-02 | Ericsson Telefon Ab L M | Kretskort med interferensskärmande skikt |
US5981043A (en) * | 1996-04-25 | 1999-11-09 | Tatsuta Electric Wire And Cable Co., Ltd | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
JP3581971B2 (ja) * | 1996-05-22 | 2004-10-27 | 株式会社ボッシュオートモーティブシステム | 車載用コントロールユニットのemi用接地構造 |
KR100227741B1 (ko) * | 1996-11-29 | 1999-11-01 | 윤종용 | 스텐바이 전원을 가진 전자제품 |
JP2004506309A (ja) | 1997-12-31 | 2004-02-26 | エルパック(ユーエスエー)、インコーポレイテッド | モールドされた電子パッケージ、製作方法およびシールディング方法 |
US6160714A (en) | 1997-12-31 | 2000-12-12 | Elpac (Usa), Inc. | Molded electronic package and method of preparation |
JP3501674B2 (ja) * | 1999-04-21 | 2004-03-02 | 日本電気株式会社 | プリント回路基板特性評価装置、プリント回路基板特性評価方法、及び記憶媒体 |
JP3455498B2 (ja) * | 2000-05-31 | 2003-10-14 | 株式会社東芝 | プリント基板および情報処理装置 |
US6614662B2 (en) * | 2000-12-14 | 2003-09-02 | Hewlett-Packard Development Company, L.P. | Printed circuit board layout |
US6618787B2 (en) * | 2000-12-14 | 2003-09-09 | Hewlett-Packard Development Company, L.P. | Computer printed circuit system board with LVD SCSI device direct connector |
US6753746B2 (en) * | 2001-11-07 | 2004-06-22 | Compeq Manufacturing Co., Ltd. | Printed circuit board having jumper lines and the method for making said printed circuit board |
US6717485B2 (en) * | 2002-02-19 | 2004-04-06 | Hewlett-Packard Development Company, L.P. | Interference signal decoupling using a board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
JP2005536059A (ja) * | 2002-08-14 | 2005-11-24 | ハネウェル・インターナショナル・インコーポレーテッド | 電子回路からの電磁放射を低減する方法及び装置 |
DE10305520A1 (de) * | 2003-02-11 | 2004-08-19 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Dämpfung von Hohlraumresonanzen in einer mehrschichtigen Trägereinrichtung |
DE102006027748A1 (de) * | 2006-06-16 | 2007-12-20 | Robert Bosch Gmbh | Leiterplatte und Verfahren zur Herstellung einer lötfreien elektrischen Verbindung |
JP4877791B2 (ja) | 2007-01-26 | 2012-02-15 | 日東電工株式会社 | 配線回路基板 |
US8276268B2 (en) * | 2008-11-03 | 2012-10-02 | General Electric Company | System and method of forming a patterned conformal structure |
US8373317B2 (en) * | 2009-05-04 | 2013-02-12 | Ingersoll Rand Company | RFI suppression system and method of mounting for DC cordless tools |
TWI387407B (zh) * | 2009-06-10 | 2013-02-21 | Htc Corp | 軟式印刷電路板其及組成方法 |
DE102009044608A1 (de) | 2009-11-20 | 2011-05-26 | Webasto Ag | Heizgerät |
US9545043B1 (en) * | 2010-09-28 | 2017-01-10 | Rockwell Collins, Inc. | Shielding encapsulation for electrical circuitry |
CN203015272U (zh) | 2012-12-21 | 2013-06-19 | 奥特斯(中国)有限公司 | 印制电路板 |
JP2017118015A (ja) * | 2015-12-25 | 2017-06-29 | 株式会社トーキン | 電子装置及び電磁干渉抑制体の配置方法 |
US10694620B1 (en) * | 2019-04-02 | 2020-06-23 | Microsoft Technology Licensing, Llc | Method and apparatus for circuit board noise shielding and grounding |
USD980842S1 (en) | 2020-08-24 | 2023-03-14 | Intel Corporation | Shielding for circuit board |
WO2023147691A1 (en) * | 2022-02-03 | 2023-08-10 | Microsoft Technology Licensing, Llc | Printed de-coupling plane for printed circuit boards |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1936899A1 (de) * | 1969-07-19 | 1971-02-04 | Siemens Ag | Baugruppentraeger fuer Steuer- bzw. Regelanlagen |
US3740678A (en) * | 1971-03-19 | 1973-06-19 | Ibm | Strip transmission line structures |
DE2260195A1 (de) * | 1972-12-08 | 1974-06-12 | Michael M Dipl Ing Iloff | Leiterplatte fuer elektrische schaltungen |
FR2212740B1 (sv) * | 1972-12-28 | 1977-02-25 | Honeywell Bull | |
EP0082216B1 (de) * | 1981-12-23 | 1985-10-09 | Ibm Deutschland Gmbh | Mehrschichtiges, keramisches Substrat für integrierte Halbleiterschaltungen mit mehreren Metallisierungsebenen |
FR2527039A1 (fr) * | 1982-05-14 | 1983-11-18 | Inf Milit Spatiale Aeronaut | Dispositif de protection d'un dispositif electronique contre les tensions engendrees par un champ electromagnetique |
JPS6016701A (ja) * | 1983-07-08 | 1985-01-28 | Nec Corp | マイクロ波プリント板回路 |
US4723197A (en) * | 1985-12-16 | 1988-02-02 | National Semiconductor Corporation | Bonding pad interconnection structure |
US4724040A (en) * | 1986-01-14 | 1988-02-09 | Asahi Chemical Research Laboratory Co., Ltd. | Method for producing electric circuits on a base boad |
FR2593346B1 (fr) * | 1986-01-17 | 1990-05-25 | Nec Corp | Substrat de cablage utilisant une ceramique comme isolant |
US5043526A (en) * | 1986-03-13 | 1991-08-27 | Nintendo Company Ltd. | Printed circuit board capable of preventing electromagnetic interference |
US4801489A (en) * | 1986-03-13 | 1989-01-31 | Nintendo Co., Ltd. | Printed circuit board capable of preventing electromagnetic interference |
US4717988A (en) * | 1986-05-05 | 1988-01-05 | Itt Defense Communications Division Of Itt Corporation | Universal wafer scale assembly |
US4770921A (en) * | 1986-09-11 | 1988-09-13 | Insulating Materials Incorporated | Self-shielding multi-layer circuit boards |
JPS6453498A (en) * | 1987-05-15 | 1989-03-01 | Sanki Eng Co Ltd | Multilayer interconnection board |
US4963697A (en) * | 1988-02-12 | 1990-10-16 | Texas Instruments Incorporated | Advanced polymers on metal printed wiring board |
US4927983A (en) * | 1988-12-16 | 1990-05-22 | International Business Machines Corporation | Circuit board |
JP2631548B2 (ja) * | 1989-03-15 | 1997-07-16 | 日本シイエムケイ株式会社 | シールド層を備えるプリント配線板 |
US5003273A (en) * | 1989-12-04 | 1991-03-26 | Itt Corporation | Multilayer printed circuit board with pseudo-coaxial transmission lines |
US5285017A (en) * | 1991-12-31 | 1994-02-08 | Intel Corporation | Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias |
-
1990
- 1990-02-06 FI FI900580A patent/FI113937B/sv not_active IP Right Cessation
- 1990-02-07 AU AU49200/90A patent/AU636129B2/en not_active Ceased
- 1990-02-08 US US07/477,322 patent/US5341274A/en not_active Expired - Fee Related
- 1990-02-15 DE DE69033522T patent/DE69033522T2/de not_active Expired - Fee Related
- 1990-02-15 DE DE69033784T patent/DE69033784T2/de not_active Expired - Fee Related
- 1990-02-15 EP EP94202846A patent/EP0631460B1/en not_active Expired - Lifetime
- 1990-02-15 DE DE69019030T patent/DE69019030T2/de not_active Expired - Fee Related
- 1990-02-15 EP EP94202845A patent/EP0633715B1/en not_active Expired - Lifetime
- 1990-02-15 EP EP90301612A patent/EP0384644B1/en not_active Expired - Lifetime
- 1990-02-15 CA CA002010128A patent/CA2010128C/en not_active Expired - Fee Related
- 1990-02-20 KR KR1019900002040A patent/KR0123805B1/ko not_active IP Right Cessation
-
1994
- 1994-03-30 US US08/220,257 patent/US5449863A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2010128C (en) | 1996-03-19 |
EP0633715B1 (en) | 2001-08-29 |
DE69019030T2 (de) | 1995-12-21 |
FI900580A0 (fi) | 1990-02-06 |
KR900013820A (ko) | 1990-09-06 |
CA2010128A1 (en) | 1990-08-21 |
DE69033784D1 (de) | 2001-10-04 |
AU4920090A (en) | 1990-08-30 |
DE69033522D1 (de) | 2000-05-31 |
DE69033784T2 (de) | 2002-07-04 |
US5341274A (en) | 1994-08-23 |
DE69033522T2 (de) | 2000-12-21 |
EP0631460A2 (en) | 1994-12-28 |
DE69019030D1 (de) | 1995-06-08 |
EP0384644A1 (en) | 1990-08-29 |
EP0631460B1 (en) | 2000-04-26 |
EP0384644B1 (en) | 1995-05-03 |
EP0633715A3 (en) | 1995-07-26 |
KR0123805B1 (ko) | 1997-12-04 |
EP0633715A2 (en) | 1995-01-11 |
US5449863A (en) | 1995-09-12 |
AU636129B2 (en) | 1993-04-22 |
EP0631460A3 (en) | 1995-07-26 |
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Date | Code | Title | Description |
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FG | Patent granted |
Owner name: TATSUTA ELECTRIC WIRE & GABLE CO., LTD |
|
MA | Patent expired |