ES462635A1 - Perfeccionamientos introducidos en un conectador electrico de dos partes. - Google Patents
Perfeccionamientos introducidos en un conectador electrico de dos partes.Info
- Publication number
- ES462635A1 ES462635A1 ES462635A ES462635A ES462635A1 ES 462635 A1 ES462635 A1 ES 462635A1 ES 462635 A ES462635 A ES 462635A ES 462635 A ES462635 A ES 462635A ES 462635 A1 ES462635 A1 ES 462635A1
- Authority
- ES
- Spain
- Prior art keywords
- circuit board
- printed circuit
- chip
- connector
- chip carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
- H05K7/1046—J-shaped leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Connecting Device With Holders (AREA)
Abstract
Perfeccionamientos introducidos en un conectador eléctrico de dos partes, para uso en el montaje de un componente eléctrico en un substrato, caracterizados porque dicho conectador presenta una primera parte en forma de bastidor de material eléctricamente aislante que define una cavidad de recepción de componente eléctrico, habiendo una pluralidad de contactos eléctricos que se extienden a través del bastidor, teniendo cada contacto una primera porción que se extiende hacia el interior de la cavidad para conexión a un componente eléctrico recibido en la cavidad, una segunda empotrada en el bastidor, y una tercera porción que se extiende fuera del bastidor; y una segunda parte en forma de un cuerpo de material eléctricamente aislante que tiene una base y paredes laterales que se extienden en esencia normalmente a la base para definir una caja abierta, habiendo una pluralidad de terminales eléctricos que se extienden a través e la base.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/727,307 US4089575A (en) | 1976-09-27 | 1976-09-27 | Connector for connecting a circuit element to the surface of a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
ES462635A1 true ES462635A1 (es) | 1978-07-01 |
Family
ID=24922149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES462635A Expired ES462635A1 (es) | 1976-09-27 | 1977-09-26 | Perfeccionamientos introducidos en un conectador electrico de dos partes. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4089575A (es) |
JP (1) | JPS5341979A (es) |
CA (1) | CA1081334A (es) |
DE (1) | DE2743241A1 (es) |
ES (1) | ES462635A1 (es) |
FR (1) | FR2365899A1 (es) |
GB (1) | GB1543665A (es) |
IT (1) | IT1087366B (es) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4327953A (en) * | 1977-06-06 | 1982-05-04 | Texas Instruments Incorporated | Interchangeable module for integrated circuits |
US4222622A (en) * | 1978-06-12 | 1980-09-16 | Gte Products Corporation | Electrical connector for circuit board |
US4272140A (en) * | 1979-12-19 | 1981-06-09 | Gte Automatic Electric Laboratories Incorporated | Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits |
US4351580A (en) * | 1980-05-15 | 1982-09-28 | Augat Inc. | Carrier socket for leadless integrated circuit devices |
US4362353A (en) * | 1980-05-27 | 1982-12-07 | Amp Incorporated | Contact clip for connecting a ceramic substrate to a printed circuit board |
US4352535A (en) * | 1980-06-27 | 1982-10-05 | General Motors Corporation | Electrical connector |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
US4406508A (en) * | 1981-07-02 | 1983-09-27 | Thomas & Betts Corporation | Dual-in-line package assembly |
JPH01132148A (ja) * | 1981-07-27 | 1989-05-24 | Texas Instr Inc <Ti> | 集積回路用キャリア |
US4495376A (en) * | 1981-07-27 | 1985-01-22 | Texas Instruments Incorporated | Carrier for integrated circuit |
DE3303165C2 (de) * | 1982-02-05 | 1993-12-09 | Hitachi Ltd | Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern |
US4491377A (en) * | 1982-04-19 | 1985-01-01 | Pfaff Wayne | Mounting housing for leadless chip carrier |
US4458968A (en) * | 1982-07-06 | 1984-07-10 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
US4506938A (en) * | 1982-07-06 | 1985-03-26 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
DE3236325A1 (de) * | 1982-09-30 | 1984-04-05 | Siemens AG, 1000 Berlin und 8000 München | Flachbaugruppe |
FR2538961B1 (fr) * | 1982-12-30 | 1985-07-12 | Europ Composants Electron | Embase pour circuit integre |
SE435443B (sv) * | 1983-02-18 | 1984-09-24 | Ericsson Telefon Ab L M | Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
DE3584532D1 (de) * | 1984-02-27 | 1991-12-05 | Amp Inc | Kontakt fuer schaltungstraeger und verfahren um diesen in ein gehaeuse einzusetzen. |
US4555151A (en) * | 1984-08-06 | 1985-11-26 | Gte Communication Systems Corporation | Contact terminal device for connecting hybrid circuit modules to a printed circuit board |
JPS61157290U (es) * | 1985-03-22 | 1986-09-29 | ||
US4682829A (en) * | 1985-06-13 | 1987-07-28 | Amp Incorporated | Surface mount socket for dual in-line package |
US4647126A (en) * | 1985-06-17 | 1987-03-03 | Sperry Corporation | Compliant lead clip |
US4676571A (en) * | 1985-07-23 | 1987-06-30 | Thomas & Betts Corporation | Leaded chip carrier connector |
JPH0325410Y2 (es) * | 1985-08-10 | 1991-06-03 | ||
JPH0511508Y2 (es) * | 1985-10-04 | 1993-03-22 | ||
US4799897A (en) * | 1985-12-30 | 1989-01-24 | Dai-Ichi Seiko Kabushiki Kaisha | IC tester socket |
US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
JPH0218547Y2 (es) * | 1986-05-02 | 1990-05-23 | ||
US4747017A (en) * | 1986-05-27 | 1988-05-24 | General Motors Corporation | Surface mountable integrated circuit package equipped with sockets |
US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
US4846702A (en) * | 1988-01-07 | 1989-07-11 | Minnesota Mining & Manufacturing Company | Electrical connector for surface mount chip carrier installed in a socket |
US4941832A (en) * | 1989-01-30 | 1990-07-17 | Amp Incorporated | Low profile chip carrier socket |
JPH02155181A (ja) * | 1989-10-02 | 1990-06-14 | Yamaichi Electric Mfg Co Ltd | Ic接続器 |
US5088930A (en) * | 1990-11-20 | 1992-02-18 | Advanced Interconnections Corporation | Integrated circuit socket with reed-shaped leads |
US5157480A (en) * | 1991-02-06 | 1992-10-20 | Motorola, Inc. | Semiconductor device having dual electrical contact sites |
US5177326A (en) * | 1991-10-21 | 1993-01-05 | Gec-Marconi Electronic Systems Corp. | Lead wire array for a leadless chip carrier |
US5158467A (en) * | 1991-11-01 | 1992-10-27 | Amp Incorporated | High speed bare chip test socket |
US5226825A (en) * | 1992-01-15 | 1993-07-13 | The Whitaker Corporation | Surface mount chip carrier socket |
US5288236A (en) * | 1992-04-01 | 1994-02-22 | Sun Microsystems, Inc. | Method and apparatus for replacing electronic components on a printed circuit board |
DE69323110D1 (de) * | 1992-04-24 | 1999-03-04 | Altera Corp | Oberflächenmontierte Chipträger |
US5880403A (en) * | 1994-04-01 | 1999-03-09 | Space Electronics, Inc. | Radiation shielding of three dimensional multi-chip modules |
US6613978B2 (en) | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
US6720493B1 (en) | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
US6261508B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Method for making a shielding composition |
US6455864B1 (en) | 1994-04-01 | 2002-09-24 | Maxwell Electronic Components Group, Inc. | Methods and compositions for ionizing radiation shielding |
US5923538A (en) * | 1994-10-17 | 1999-07-13 | Lsi Logic Corporation | Support member for mounting a microelectronic circuit package |
US5629837A (en) * | 1995-09-20 | 1997-05-13 | Oz Technologies, Inc. | Button contact for surface mounting an IC device to a circuit board |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
FR2743170B1 (fr) * | 1995-12-28 | 1998-02-06 | Framatome Connectors Int | Connecteur actif pour carte a puce |
US5920114A (en) * | 1997-09-25 | 1999-07-06 | International Business Machines Corporation | Leadframe having resilient carrier positioning means |
US5874323A (en) * | 1997-08-28 | 1999-02-23 | Mcms, Inc. | Method of providing electrical contact to component leads |
US5910024A (en) * | 1997-08-28 | 1999-06-08 | Mcms, Inc. | Carrier socket for receiving a damaged IC |
US6297654B1 (en) | 1999-07-14 | 2001-10-02 | Cerprobe Corporation | Test socket and method for testing an IC device in a dead bug orientation |
DE19935188C2 (de) * | 1999-07-27 | 2002-06-13 | Amphenol Tuchel Elect | Kontaktblock für einen Chipkartenleser |
US6368899B1 (en) * | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
US6558169B2 (en) * | 2001-03-29 | 2003-05-06 | Intel Corporation | Shunt power connection for an integrated circuit package |
US6891276B1 (en) * | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
US6575766B1 (en) * | 2002-02-26 | 2003-06-10 | Intel Corporation | Laminated socket contacts |
US7382043B2 (en) * | 2002-09-25 | 2008-06-03 | Maxwell Technologies, Inc. | Method and apparatus for shielding an integrated circuit from radiation |
JP2004304604A (ja) * | 2003-03-31 | 2004-10-28 | Mitsumi Electric Co Ltd | 小型カメラモジュールのソケットへの取付け構造 |
US7191516B2 (en) * | 2003-07-16 | 2007-03-20 | Maxwell Technologies, Inc. | Method for shielding integrated circuit devices |
EP1622362A1 (en) * | 2004-07-12 | 2006-02-01 | Research In Motion Limited | Structure for mounting a component to a circuit-board |
US7918671B2 (en) * | 2004-07-13 | 2011-04-05 | Research In Motion Limited | Mounting structure with springs biasing towards a latching edge |
GB2416928A (en) * | 2004-08-02 | 2006-02-08 | Itt Mfg Enterprises Inc | Carrier for compression chip |
US20070029649A1 (en) * | 2005-08-08 | 2007-02-08 | Honeywell International Inc. | Plastic lead frame with snap-together circuitry |
DE102007005630B4 (de) * | 2007-02-05 | 2019-08-08 | Infineon Technologies Ag | Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls |
CN201160134Y (zh) * | 2007-09-22 | 2008-12-03 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN102007406B (zh) * | 2008-03-04 | 2013-08-21 | 3M创新有限公司 | 利用组合光学询问方法和装置监测炸油质量 |
US7581965B1 (en) | 2008-05-01 | 2009-09-01 | Commscope, Inc. Of North Carolina | Bottom entry interconnection element for connecting components to a circuit board |
CN102197474A (zh) * | 2008-10-27 | 2011-09-21 | Nxp股份有限公司 | 微电子封装结构、拆卸微电子封装的方法 |
US10826208B1 (en) * | 2017-01-30 | 2020-11-03 | Superior Sensor Technology | Sensor with integrated electrical contacts |
CN111812357B (zh) * | 2020-07-10 | 2021-05-25 | 浙江大学 | 一种用于微纳米制造的自填料三臂式热扫描探针 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3311790A (en) * | 1965-02-17 | 1967-03-28 | Brown Engineering Company Inc | Micromodule connector and assembly |
US3337678A (en) * | 1965-06-30 | 1967-08-22 | John P Stelmak | Sealed microminiature electronic package |
US3643133A (en) * | 1969-12-15 | 1972-02-15 | Computer Ind Inc | Wire-routing system |
US3701077A (en) * | 1969-12-29 | 1972-10-24 | Tech Inc K | Electronic components |
US3710299A (en) * | 1971-06-01 | 1973-01-09 | Aries Electronics | Low profile socket for integrated circuit pack |
US3910664A (en) * | 1973-01-04 | 1975-10-07 | Amp Inc | Multi-contact electrical connector for a ceramic substrate or the like |
US3873173A (en) * | 1973-10-05 | 1975-03-25 | Itt | Electrical connector assembly |
US3904262A (en) * | 1974-09-27 | 1975-09-09 | John M Cutchaw | Connector for leadless integrated circuit packages |
US3984166A (en) * | 1975-05-07 | 1976-10-05 | Burroughs Corporation | Semiconductor device package having lead frame structure with integral spring contacts |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
-
1976
- 1976-09-27 US US05/727,307 patent/US4089575A/en not_active Expired - Lifetime
-
1977
- 1977-08-23 CA CA285,317A patent/CA1081334A/en not_active Expired
- 1977-08-31 IT IT27145/77A patent/IT1087366B/it active
- 1977-09-05 GB GB36941/77A patent/GB1543665A/en not_active Expired
- 1977-09-26 FR FR7728905A patent/FR2365899A1/fr active Granted
- 1977-09-26 ES ES462635A patent/ES462635A1/es not_active Expired
- 1977-09-26 DE DE19772743241 patent/DE2743241A1/de active Granted
- 1977-09-27 JP JP11522477A patent/JPS5341979A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
IT1087366B (it) | 1985-06-04 |
CA1081334A (en) | 1980-07-08 |
DE2743241A1 (de) | 1978-03-30 |
JPS5341979A (en) | 1978-04-15 |
GB1543665A (en) | 1979-04-04 |
JPS61711B2 (es) | 1986-01-10 |
DE2743241C2 (es) | 1987-12-23 |
FR2365899B1 (es) | 1982-11-19 |
FR2365899A1 (fr) | 1978-04-21 |
US4089575A (en) | 1978-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19990201 |