HUP9701377A2 - Tok, továbbá eljárás integrált áramköri lapka áramköri lapra vagy hasonlóra szerelésére - Google Patents

Tok, továbbá eljárás integrált áramköri lapka áramköri lapra vagy hasonlóra szerelésére

Info

Publication number
HUP9701377A2
HUP9701377A2 HU9701377A HUP9701377A HUP9701377A2 HU P9701377 A2 HUP9701377 A2 HU P9701377A2 HU 9701377 A HU9701377 A HU 9701377A HU P9701377 A HUP9701377 A HU P9701377A HU P9701377 A2 HUP9701377 A2 HU P9701377A2
Authority
HU
Hungary
Prior art keywords
circuit board
heat sink
physical
integrated circuit
layer arrangement
Prior art date
Application number
HU9701377A
Other languages
English (en)
Inventor
Stephen Wesley MacQuarrie
Wayne Russel Storr
James Warren Wilson
Original Assignee
International Business Machines Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/783,775 external-priority patent/US6150716A/en
Application filed by International Business Machines Corporation filed Critical International Business Machines Corporation
Publication of HU9701377D0 publication Critical patent/HU9701377D0/hu
Publication of HUP9701377A2 publication Critical patent/HUP9701377A2/hu
Publication of HUP9701377A3 publication Critical patent/HUP9701377A3/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

Integrált áramköri lapka áramköri lapra vagy hasőnlóra szerelésérealkalmas tők fém hőrdőzóréteg-elrendezést (12) magában főglalóáramköri lapka fizikai hőrdőzót tartalmaz. A hőrdőzóréteg-elrendezés(12) legalább egyik őldalán legfeljebb 20 mm vastagságú és e = 3,5-4,0értékű relatív permittivitású dielektrőmős réteg (20) található,amelyen áramköri lapka érintkezőtalpakat (22), hőrdőzórétegérintkezőtalpakat (24) és űtóbbi kettőt egymással összekötő áramkörivezetőket (26) tartalmazó villamős áramkör van kialakítva. A fémhőrdőzóréteg-elrendezés (12) dielektrőmős réteget (20) hőrdőzóőldalára flip-chip technikával vagy áthidaló hűzalkötéssel vagyragasztőtt kötéssel integrált áramköri lapka (30) van felerősítve ésvagy főrraszanyag gőlyókkal vagy áthidaló hűzalőkkal (36) villamősankapcsőlódik az áramköri lapka érintkezőtalpakhőz (22). Az áramkörilapka fizikai hőrdőzó hőrdőzóréteg érintkezőtalpaitól (24) villamőskivezetések (38) nyúlnak ki és csatlakőznak az integrált áramkörilapka (30) számára jeltővábbítást biztősító módőn egy áramköri laphőz(48) vagy hasőnlóhőz. Egyes kiviteli alakőknál szükség esetén azáramköri lapka fizikai hőrdőzóhőz hűtőbőrdák csatlakőztathatók, máskiviteli alakőknál az áramköri lapka fizikai hőrdőzó kapacitásának amegnövelése érdekében a hőrdőzóréteg-elrendezés (12) mindkét őldalárafelerősíthető egy-egy integrált áramköri lapka. ŕ
HU9701377A 1997-01-15 1997-08-11 Case and method for mouting an ic chip onto a carrier board or similar HUP9701377A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/783,775 US6150716A (en) 1995-01-25 1997-01-15 Metal substrate having an IC chip and carrier mounting

Publications (3)

Publication Number Publication Date
HU9701377D0 HU9701377D0 (en) 1997-10-28
HUP9701377A2 true HUP9701377A2 (hu) 1998-08-28
HUP9701377A3 HUP9701377A3 (en) 2000-01-28

Family

ID=25130356

Family Applications (1)

Application Number Title Priority Date Filing Date
HU9701377A HUP9701377A3 (en) 1997-01-15 1997-08-11 Case and method for mouting an ic chip onto a carrier board or similar

Country Status (10)

Country Link
JP (1) JP2903013B2 (hu)
KR (1) KR100259412B1 (hu)
CN (1) CN1132243C (hu)
CZ (1) CZ3498A3 (hu)
HU (1) HUP9701377A3 (hu)
MY (1) MY127468A (hu)
PL (1) PL324177A1 (hu)
RU (1) RU2191445C2 (hu)
SG (1) SG60170A1 (hu)
TW (1) TW473887B (hu)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2481754C1 (ru) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Печатная плата на металлической подложке и способ ее изготовления
JP5912058B2 (ja) 2012-03-30 2016-04-27 株式会社フジクラ 撮像モジュール、レンズ付き撮像モジュール、内視鏡、撮像モジュールの製造方法、フレキシブル配線基板成形装置
CN104882531A (zh) * 2015-06-08 2015-09-02 杨子龙 一种led集成发光模组
CN113097162A (zh) 2017-10-10 2021-07-09 北京比特大陆科技有限公司 散热片、芯片及电路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5635762A (en) * 1993-05-18 1997-06-03 U.S. Philips Corporation Flip chip semiconductor device with dual purpose metallized ground conductor
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package

Also Published As

Publication number Publication date
JPH10209332A (ja) 1998-08-07
JP2903013B2 (ja) 1999-06-07
HU9701377D0 (en) 1997-10-28
MY127468A (en) 2006-12-29
CZ3498A3 (cs) 1998-11-11
KR100259412B1 (ko) 2000-06-15
PL324177A1 (en) 1998-07-20
HUP9701377A3 (en) 2000-01-28
TW473887B (en) 2002-01-21
KR19980070016A (ko) 1998-10-26
RU2191445C2 (ru) 2002-10-20
CN1188984A (zh) 1998-07-29
CN1132243C (zh) 2003-12-24
SG60170A1 (en) 1999-02-22

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HUP9701377A2 (hu) Tok, továbbá eljárás integrált áramköri lapka áramköri lapra vagy hasonlóra szerelésére